Semiconductor device with metal structure passivation
US-2025183175-A1 · Jun 5, 2025 · US
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Kahn Markus patents
Kahn Markus is listed as an inventor on 49 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Kahn Markus |
| Total patents | 49 |
| First publication | Jun 25, 2015 |
| Latest publication | Jun 5, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor device and method of producing thereof
US-2024194779-A1 · Jun 13, 2024 · US
Semiconductor device with first and second portions that include silicon and nitrogen
US-11804415-B2 · Oct 31, 2023 · US
High Voltage Semiconductor Device with Step Topography Passivation Layer Stack
US-2023343726-A1 · Oct 26, 2023 · US
Wafer chuck and processing arrangement
US-11387081-B2 · Jul 12, 2022 · US
Semiconductor device, microphone and methods for forming a semiconductor device
US-11352253-B2 · Jun 7, 2022 · US
Semiconductor device with first and second portions that include silicon and nitrogen
US-2021287954-A1 · Sep 16, 2021 · US
Semiconductor device with a portion including silicon and nitrogen and method of manufacturing
US-11075134-B2 · Jul 27, 2021 · US
High Voltage Semiconductor Device with Step Topography Passivation Layer Stack
US-2021151391-A1 · May 20, 2021 · US
Semiconductor Device, Microphone and Methods for Forming a Semiconductor Device
US-2021002132-A1 · Jan 7, 2021 · US
Recent patents
Latest publications not already listed above.
Semiconductor device, microphone and methods for forming a semiconductor device
US-10858246-B2 · Dec 8, 2020 · US
Wafer chuck and processing arrangement
US-2020251314-A1 · Aug 6, 2020 · US
Micromechanical structure and method for manufacturing the same
US-10710874-B2 · Jul 14, 2020 · US
Wafer chuck and processing arrangement
US-10629416-B2 · Apr 21, 2020 · US
Semiconductor Device with a Portion Including Silicon and Nitrogen and Method of Manufacturing
US-2020083133-A1 · Mar 12, 2020 · US
Semiconductor Device and Manufacturing
US-2019333765-A1 · Oct 31, 2019 · US
Semiconductor wafer and method for processing a semiconductor wafer
US-10325803-B2 · Jun 18, 2019 · US
Micromechanical structure comprising carbon material and method for fabricating the same
US-10106398-B2 · Oct 23, 2018 · US
Micromechanical structure and method for fabricating the same
US-10081533-B2 · Sep 25, 2018 · US
Controlling the Reflow Behaviour of BPSG Films and Devices Made Thereof
US-2018247820-A1 · Aug 30, 2018 · US
Semiconductor wafer and method for processing a semiconductor wafer
US-2018247857-A1 · Aug 30, 2018 · US
Semiconductor device, microphone and methods for forming a semiconductor device
US-2018237292-A1 · Aug 23, 2018 · US
Self aligned silicon carbide contact formation using protective layer
US-10049879-B2 · Aug 14, 2018 · US
Wafer chuck and processing arrangement
US-2018211821-A1 · Jul 26, 2018 · US
Semiconductor wafer and method for processing a semiconductor wafer
US-9984915-B2 · May 29, 2018 · US
Method for processing a semiconductor layer, method for processing a silicon substrate, and method for processing a silicon layer
US-9941111-B2 · Apr 10, 2018 · US
Self Aligned Silicon Carbide Contact Formation Using Protective Layer
US-2018076036-A1 · Mar 15, 2018 · US
Carbon based contact structure for silicon carbide device technical field
US-9917170-B2 · Mar 13, 2018 · US
Micromechanical structure and method for manufacturing the same
US-2018002167-A1 · Jan 4, 2018 · US
Carbon Based Contact Structure for Silicon Carbide Device Technical Field
US-2017309720-A1 · Oct 26, 2017 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Ag | 42 |
| Infineon Technologies Austria Ag | 6 |
| Infineon Technologies Austria | 1 |
| Denifl Guenter | 1 |
| Maurer Daniel | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P14/6334 | 12 |
| H10P14/6336 | 11 |
| H04R2201/003 | 10 |
| H01L21/02271 | 9 |
| H10W74/43 | 9 |