Semiconductor device, microphone and methods for forming a semiconductor device

Patent metadata

Field	Value
Publication number	US-10858246-B2
Application number	US-201815901196-A
Country	US
Kind code	B2
Filing date	Feb 21, 2018
Priority date	Feb 22, 2017
Publication date	Dec 8, 2020
Grant date	Dec 8, 2020

Abstract

A semiconductor device comprises a structured metal layer. The structured metal layer lies above a semiconductor substrate. In addition, a thickness of the structured metal layer is more than 100 nm. Furthermore, the semiconductor device comprises a covering layer. The covering layer lies adjacent to at least one part of a front side of the structured metal layer and adjacent to a side wall of the structured metal layer. In addition, the covering layer comprises amorphous silicon carbide.

First claim

What is claimed is:

1. A semiconductor device, comprising:
a structured metal layer, wherein the structured metal layer lies above a semiconductor substrate, and wherein a thickness of the structured metal layer is more than 100 nm; and
a covering layer, wherein the covering layer lies adjacent to at least one part of a front side of the structured metal layer and adjacent to a side wall of the structured metal layer, and wherein the covering layer comprises amorphous silicon carbide doped or alloyed with chromium (Cr).

2. The semiconductor device as claimed in claim 1 , wherein the structured metal layer is an aluminum layer or an aluminum alloy layer.

3. The semiconductor device as claimed in claim 1 , further comprising a microelectromechanical element, wherein the structured metal layer forms a connection pad for electrical contacting of the microelectromechanical element.

4. The semiconductor device as claimed in claim 3 , wherein the microelectromechanical element comprises a membrane structure, and wherein the membrane structure is arranged above a cutout formed in the semiconductor substrate.

5. The semiconductor device as claimed in claim 1 , further comprising a bond structure in contact with the structured metal layer.

6. The semiconductor device as claimed in claim 1 , wherein the structured metal layer is arranged on an oxide layer.

7. The semiconductor device as claimed in claim 1 , wherein the covering layer has a thickness of more than 10 nm.

8. The semiconductor device as claimed in claim 1 , wherein a resistivity of the covering layer is more than 1*10 10 Ωcm and less than 1*10 12 Ωcm.

9. The semiconductor device as claimed in claim 1 , wherein the side wall of the structured metal layer has an average gradient angle of more than 20°.

10. A microphone comprising the semiconductor device as claimed in claim 1 .

11. A semiconductor device, comprising:
a structured metal layer, wherein the structured metal layer lies above a semiconductor substrate, and wherein a thickness of the structured metal layer is more than 100 nm; and
a covering layer, wherein the covering layer lies adjacent to at least one part of a front side of the structured metal layer and adjacent to a side wall of the structured metal layer, and wherein the covering layer comprises a multilayer structure comprising a plurality of amorphous silicon carbide layers, and wherein the covering layer is doped or alloyed with chromium (Cr), titanium (Ti), or tungsten (W).

12. The semiconductor device of claim 11 , wherein the multilayer structure comprises a maximum of 10,000 layers.

13. The semiconductor device of claim 11 , wherein the multilayer structure comprises a plurality of alternating stoichiometry amorphous silicon carbide layers.

14. The semiconductor device of claim 11 , wherein the multilayer structure further comprises nitride layers or oxide layers.

15. A semiconductor device, comprising:
a structured metal layer, wherein the structured metal layer lies above a semiconductor substrate, and wherein a thickness of the structured metal layer is more than 100 nm; and
a covering layer, wherein the covering layer lies adjacent to at least one part of a front side of the structured metal layer and adjacent to a side wall of the structured metal layer, and wherein the covering layer comprises amorphous silicon carbide, wherein the covering layer comprises a passivation layer of the structured metal layer during operation of the semiconductor device in order to extend an operating lifetime of the semiconductor device, and wherein the covering layer comprises amorphous silicon carbide doped or alloyed with chromium (Cr), titanium (Ti), or tungsten (W).

16. The semiconductor device of claim 15 , wherein a front side of the structured metal layer is free of the covering layer.

17. The semiconductor device of claim 16 , further comprising a bond wire or solder ball coupled to the front side of the structured metal layer.

Assignees

• Infineon Technologies Ag

Inventors

• Kahn Markus
• Kaiser Anna-Katharina
• Pirk Soenke
• Steinbrenner Juergen
• Straeussnigg Julia-Magdalena

Classifications

• H04R19/005 Primary

  using semiconductor materials · CPC title

• H04R31/00

  Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor {(manufacture of microstructural arrangements of deformable or non-deformable structures in general B81C1/00182)} · CPC title

• H04R19/04

  Microphones (H04R19/01 takes precedence) · CPC title

• B81C2201/056

  Releasing structures at the end of the manufacturing process · CPC title

• B81C1/00801 Primary

  Avoid alteration of functional structures by etching, e.g. using a passivation layer or an etch stop layer (B81C1/00595, B81C1/00468 take precedence) · CPC title