Micromechanical structure and method for fabricating the same

Patent metadata

Field	Value
Publication number	US-10081533-B2
Application number	US-201414448767-A
Country	US
Kind code	B2
Filing date	Jul 31, 2014
Priority date	Jul 31, 2014
Publication date	Sep 25, 2018
Grant date	Sep 25, 2018

Abstract

A micromechanical structure includes a substrate and a functional structure arranged at the substrate. The functional structure has a functional region configured to deflect with respect to the substrate responsive to a force acting on the functional region. The functional structure includes a conductive base layer and a functional structure comprising a stiffening structure having a stiffening structure material arranged at the conductive base layer and only partially covering the conductive base layer at the functional region. The stiffening structure material includes a silicon material and at least a carbon material.

First claim

What is claimed is:

1. A micro mechanical structure comprising:
a substrate; and
a functional structure arranged at the substrate;
wherein the functional structure comprises a functional region configured to repeatedly deflect with respect to the substrate responsive to a force acting on the functional region;
wherein the functional structure comprises a conductive base layer;
wherein the functional structure comprises a stiffening structure having a stiffening structure material arranged at the conductive base layer and only partially covering the conductive base layer at the functional region;
wherein the stiffening structure material comprises a silicon material and at least a carbon material; and
wherein a concentration of the carbon material varies along a thickness direction of the stiffening structure; and
wherein the concentration of the carbon material varies stepwise with a plurality of steps.

2. The micro mechanical structure according to claim 1 , wherein the stiffening structure material comprises the carbon material with a concentration that is at least 1% of the concentration of the silicon material.

3. The micro mechanical structure according to claim 1 , wherein the stiffening structure material additionally comprises at least one of a nitrogen material, an oxygen material, a titanium material, a molybdenum material and a tantalum material with a material concentration.

4. The micro mechanical structure according to claim 3 , wherein the material concentration varies along a thickness direction of the stiffening structure.

5. The micro mechanical structure according to claim 4 , wherein the material concentration varies stepwise along the thickness direction of the stiffening structure.

6. The micro mechanical structure according to claim 3 , wherein the stiffening structure comprises at least two film structures forming a stack on the conductive base layer, each of the at least two film structures having a stiffening structure material comprising at least one of the carbon material, the nitrogen material, the oxygen material, the titanium material, the molybdenum material and the tantalum material with the respective material concentration, wherein at least one film structure material comprises the carbon material.

7. The micro mechanical structure according to claim 1 , wherein the stiffening structure material comprises a hardness that is higher than a hardness of a material of the conductive base layer.

8. The micro mechanical structure according to claim 1 , wherein a first stiffening structure is arranged at a first surface area of the conductive base layer and wherein a second stiffening structure is arranged at a second surface area of the conductive base layer, the second stiffening structure only partially covering the conductive base layer at the second surface area, the second surface area opposing the first surface area.

9. The micro mechanical structure according to claim 1 , wherein a base area of the stiffening structure comprises at least a part of a circular shape, a ring shape, a star shape, a polygon shape, an elliptical shape, a honeycomb structured shape or a combination thereof.

10. The micro mechanical structure according to claim 1 , comprising a plurality of stiffening structures arranged at the conductive base layer.

11. The micro mechanical structure according to claim 1 , wherein the functional structure is a membrane structure and wherein the micro mechanical structure is part of a sound transducer structure.

12. The micro mechanical structure according to claim 1 , wherein the stiffening structure is arranged at abutting portions of the functional structure and configured to abut against the substrate when the functional region deflects.

13. The micro mechanical structure according to claim 1 , wherein the stiffening structure is configured to set sound transducing characteristics of the micro mechanical structure.

14. A micro mechanical sound transducer comprising the micro mechanical structure according to claim 1 .

15. The micro mechanical sound transducer according to claim 14 , wherein the micro mechanical sound transducer is a microphone.

16. The micro mechanical sound transducer according to claim 14 , wherein the micro mechanical sound transducer is a loudspeaker.

17. A micro mechanical structure comprising:
a substrate; and
a functional structure arranged at the substrate;
wherein the functional structure comprises a functional region which is repeatedly deflectable with respect to the substrate responsive to a force acting on the functional region;
wherein the functional structure comprises a conductive base layer;
wherein the functional structure comprises a stiffening structure having a stiffening structure material covering at least partially the conductive base layer;
wherein the stiffening structure material comprises a carbon material comprising a varying carbon concentration along a thickness direction of the stiffening structure; and
wherein the carbon concentration varies stepwise with a plurality of steps.

18. A method for fabricating a micro mechanical structure, the method comprising:
providing a substrate;
arranging a functional structure comprising a conductive base layer at the substrate such that the functional structure is repeatedly deflectable in a functional region with respect to the substrate responsive to a force acting on the functional region;
depositing a stiffening structure having a stiffening structure material at the conductive base layer such that the stiffening structure only partially covers the functional region, the stiffening structure material comprising a silicon material and at least a carbon material;
wherein depositing the stiffening structure comprises applying a physical vapor deposition or a chemical vapor deposition process; and
wherein the deposition is repeated such that the stiffening structure is deposited with at least two film structures as a stack on the conductive base layer, each of the at least two film structures having a respective stiffening structure material comprising at least one of a carbon material, a nitrogen material, an oxygen material, a titanium material, a molybdenum material and a tantalum material with a respective material concentration, wherein at least one film structure material comprises the carbon material, and the respective material concentration varies stepwise with a plurality of steps.

19. The method as in claim 18 , wherein, the deposition comprises deposition of a silicon material and at least one of a carbon material, a nitrogen material, an oxygen material, a titanium material, a molybdenum material and a tantalum material with a respective concentration at the conductive base layer.

20. The method as in claim 18 , wherein the stiffening structure material is deposited in regions outside predefined target regions of the stiffening structure, the method further comprising:
removing of the material of the stiffening structure outside the predefined target regions.

21. A method for fabricating a micro mechanical structure comprising:
providing a substrate;
arranging a functional structure comprising a conductive base layer at the substrate such that the functional structure is repeatedly deflectable in a functional region with respect to the substrate and responsive to a force acting on the functional region; and
depositing a stiffening structure material comprising a carbon material at the functional structure to form a stiffening stru

Assignees

• Infineon Technologies Ag

Inventors

• Schmid Ulrich
• Frischmuth Tobias
• Irsigler Peter
• Grille Thomas
• Maurer Daniel
• Hedenig Ursula
• Kahn Markus
• Denifl Günter

Classifications

• B81B2203/051

  Translation according to an axis parallel to the substrate · CPC title

• H04R2400/01

  Transducers used as a loudspeaker to generate sound aswell as a microphone to detect sound · CPC title

• B81C1/0015

  Cantilevers (switches using MEMS H01H1/0036; electrostatic relays using micromechanics H01H59/0009; microelectro-mechanical resonators H03H9/02244) · CPC title

• H04R2307/023

  Diaphragms comprising ceramic-like materials, e.g. pure ceramic, glass, boride, nitride, carbide, mica and carbon materials · CPC title

• B81C2201/019

  Bonding or gluing multiple substrate layers · CPC title