Wafer chuck with tunable stiffness material
US-12479070-B2 · Nov 25, 2025 · US
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Ip Nathan patents
Ip Nathan is listed as an inventor on 21 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Ip Nathan |
| Total patents | 21 |
| First publication | Nov 29, 2018 |
| Latest publication | Nov 25, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Integrated metrology for process controls in wafer bonding system
US-2025029847-A1 · Jan 23, 2025 · US
Compliant chuck edge ring
US-2024250059-A1 · Jul 25, 2024 · US
Wafer bonding process with reduced overlay distortion
US-2024063022-A1 · Feb 22, 2024 · US
Method and process using fingerprint based semiconductor manufacturing process fault detection
US-11868119-B2 · Jan 9, 2024 · US
Wafer chuck with tunable stiffness material
US-2023234188-A1 · Jul 27, 2023 · US
Method And Process Using Fingerprint Based Semiconductor Manufacturing Process Fault Detection
US-2023102438-A1 · Mar 30, 2023 · US
Wafer bonding apparatus and methods to reduce post-bond wafer distortion
US-11594431-B2 · Feb 28, 2023 · US
Plasma processing method and plasma processing apparatus
US-11574808-B2 · Feb 7, 2023 · US
Wafer bonding apparatus and methods to reduce post-bond wafer distortion
US-2022344179-A1 · Oct 27, 2022 · US
Recent patents
Latest publications not already listed above.
Enhancement of yield of functional microelectronic devices
US-11435393-B2 · Sep 6, 2022 · US
Plasma processing method and plasma processing apparatus
US-2022262631-A1 · Aug 18, 2022 · US
Enhancement of yield of functional microelectronic devices
US-11346882-B2 · May 31, 2022 · US
Apparatus and methods for wafer to wafer bonding
US-11335607-B2 · May 17, 2022 · US
Systems and methods for manufacturing microelectronic devices
US-11244873-B2 · Feb 8, 2022 · US
Apparatus and Methods for Wafer to Wafer Bonding
US-2022013416-A1 · Jan 13, 2022 · US
Systems and Methods For Manufacturing Microelectronic Devices
US-2020135592-A1 · Apr 30, 2020 · US
Amelioration of global wafer distortion based on determination of localized distortions of a semiconductor wafer
US-10622233-B2 · Apr 14, 2020 · US
Enhancement of yield of functional microelectronic devices
US-2019137565-A1 · May 9, 2019 · US
Enhancement of yield of functional microelectronic devices
US-2019139798-A1 · May 9, 2019 · US
Amelioration of global wafer distortion based on determination of localized distortions of a semiconductor wafer
US-2018342410-A1 · Nov 29, 2018 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Tokyo Electron Ltd | 21 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P74/23 | 15 |
| H10P74/203 | 15 |
| H01L22/20 | 13 |
| H01L22/12 | 8 |
| H10P72/0428 | 6 |