Electrical Testing for Panel Characterization and Defect Screening
US-2024402237-A1 · Dec 5, 2024 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10P74/203 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 10,140 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 687 |
| 2016 | 664 |
| 2017 | 821 |
| 2018 | 856 |
| 2019 | 981 |
| 2020 | 1,065 |
| 2021 | 948 |
| 2022 | 961 |
| 2023 | 992 |
| 2024 | 1,011 |
| 2025 | 934 |
| 2026 | 220 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Systems and methods of testing memory devices
US-2024387303-A1 · Nov 21, 2024 · US
Method and System for Positioning Center of V-Type Notch of Wafer, and Computer Storage Medium
US-2024266198-A1 · Aug 8, 2024 · US
Method of extracting properties of a layer on a wafer
US-2024234216-A9 · Jul 11, 2024 · US
Method and system for monitoring deposition process
US-2024167814-A1 · May 23, 2024 · US
Display defect monitoring structure
US-2024087966-A1 · Mar 14, 2024 · US
Well Modulation for Defect Inspection
US-2024079278-A1 · Mar 7, 2024 · US
Defect detection using thermal laser stimulation and atomic force microscopy
US-2024069095-A1 · Feb 29, 2024 · US
Substrate imaging apparatus
US-2024022693-A1 · Jan 18, 2024 · US
Film thickness metrology
US-9224661-B2 · Dec 29, 2015 · US
Chemical mechanical polishing (cmp) platform for local profile control
US-2015352686-A1 · Dec 10, 2015 · US
Defect pattern evaluation method, defect pattern evaluation apparatus, and recording media
US-9202763-B2 · Dec 1, 2015 · US
Method for separating and transferring IC chips
US-9196539-B2 · Nov 24, 2015 · US
Group iii nitride wafers and fabrication method and testing method
US-2015329361-A1 · Nov 19, 2015 · US
Film thickness measurement apparatus, film thickness measurement method, and non-transitory computer storage medium
US-2015324970-A1 · Nov 12, 2015 · US
Method and system for optical characterization of patterned samples
US-2015316468-A1 · Nov 5, 2015 · US
Method for forming ReRAM chips operating at low operating temperatures
US-9177996-B2 · Nov 3, 2015 · US
Process control methods for CMP (chemical mechanical polishing) and other polishing methods used to form semiconductor devices
US-9165880-B2 · Oct 20, 2015 · US
Apparatus and method for measuring thickness and temperature and substrate processing system
US-9163931-B2 · Oct 20, 2015 · US
Substrate processing apparatus and control device for substrate processing apparatus
US-2015294884-A1 · Oct 15, 2015 · US
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10P74/203?
- CPC H10P74/203 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H10P74/203 (Electricity)?
- Our database includes 10,140 publications tagged with this CPC code.
- Is patent activity under CPC H10P74/203 growing?
- Publication counts under this code: 1,011 in 2024 vs 934 in 2025 (latest complete years).