Back grinding apparatus and wear amount measuring method using the same
US-2024424637-A1 · Dec 26, 2024 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10P72/0428 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 4,988 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 207 |
| 2016 | 221 |
| 2017 | 274 |
| 2018 | 331 |
| 2019 | 475 |
| 2020 | 573 |
| 2021 | 548 |
| 2022 | 574 |
| 2023 | 608 |
| 2024 | 539 |
| 2025 | 512 |
| 2026 | 126 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Substrate correction device, substrate lamination device, substrate processing system, substrate correction method, substrate processing method, and semiconductor device manufacturing method
US-2024404859-A1 · Dec 5, 2024 · US
Wafer processing method
US-2024395620-A1 · Nov 28, 2024 · US
Semiconductor Manufacturing Device, Push-up Unit, and Method of Manufacturing Semiconductor Device
US-2024312825-A1 · Sep 19, 2024 · US
Information processing device, substrate processing device, and information processing method
US-2024302817-A1 · Sep 12, 2024 · US
Method for manufacturing electronic device
US-2024258152-A1 · Aug 1, 2024 · US
Semiconductor manufacturing apparatus
US-2024203762-A1 · Jun 20, 2024 · US
Resin member and dividing apparatus
US-2024178041-A1 · May 30, 2024 · US
Substrate processing apparatus and holding method of substrate
US-2024105497-A1 · Mar 28, 2024 · US
Bonding method and bonding apparatus
US-11931995-B2 · Mar 19, 2024 · US
Frame cassette with internal cover cases
US-2024087930-A1 · Mar 14, 2024 · US
Laser scribing trench opening control in wafer dicing using hybrid laser scribing and plasma etch approach
US-2024079273-A1 · Mar 7, 2024 · US
Method for manufacturing substrate with chips, and substrate processing device
US-2024079403-A1 · Mar 7, 2024 · US
Bonding method, bonder, and bonding system
US-2024066624-A1 · Feb 29, 2024 · US
Substrate polishing apparatus with contact extension or adjustable stop
US-11904429-B2 · Feb 20, 2024 · US
Wafer processing method
US-2015357224-A1 · Dec 10, 2015 · US
Apparatus and Method for Wafer Level Bonding
US-2015357226-A1 · Dec 10, 2015 · US
Method and system for real-time polishing recipe control
US-2015357252-A1 · Dec 10, 2015 · US
Planarization method and planarization apparatus
US-2015357212-A1 · Dec 10, 2015 · US
Circular polishing pad
US-2015343596-A1 · Dec 3, 2015 · US
Next steps
Free tools are coming soon. Tell us what you want to track and we'll notify you.
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10P72/0428?
- CPC H10P72/0428 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H10P72/0428 (Electricity)?
- Our database includes 4,988 publications tagged with this CPC code.
- Is patent activity under CPC H10P72/0428 growing?
- Publication counts under this code: 539 in 2024 vs 512 in 2025 (latest complete years).