Inspection device
US-2023236223-A1 · Jul 27, 2023 · US
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Hoshino Tomohisa patents
Hoshino Tomohisa is listed as an inventor on 21 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Hoshino Tomohisa |
| Total patents | 21 |
| First publication | Apr 21, 2016 |
| Latest publication | Jul 27, 2023 |
Notable patents
Publications ranked by popularity score, then publication date.
Inspection device
US-2023221350-A1 · Jul 13, 2023 · US
Plunger and method of manufacturing plunger
US-2023221349-A1 · Jul 13, 2023 · US
Electrolytic processing jig and electrolytic processing method
US-11542627-B2 · Jan 3, 2023 · US
Electrolytic processing jig and electrolytic processing method
US-11427920-B2 · Aug 30, 2022 · US
Electrolytic treatment apparatus and electrolytic treatment method
US-11427921-B2 · Aug 30, 2022 · US
Electrolytic treatment apparatus and electrolytic treatment method
US-2021285119-A1 · Sep 16, 2021 · US
Manufacturing apparatus and manufacturing method for semiconductor device
US-11111592-B2 · Sep 7, 2021 · US
Substrate processing method
US-10903081-B2 · Jan 26, 2021 · US
Substrate processing method and template
US-10428438-B2 · Oct 1, 2019 · US
Recent patents
Latest publications not already listed above.
Electrolytic treatment apparatus and electrolytic treatment method
US-10392719-B2 · Aug 27, 2019 · US
Electrolytic processing jig and electrolytic processing method
US-2019233963-A1 · Aug 1, 2019 · US
Electrolytic processing jig and electrolytic processing method
US-2019218682-A1 · Jul 18, 2019 · US
Adhesion layer forming method, adhesion layer forming system and recording medium
US-10354915-B2 · Jul 16, 2019 · US
Manufacturing apparatus and manufacturing method for semiconductor device
US-2018355501-A1 · Dec 13, 2018 · US
Substrate processing method
US-2018122641-A1 · May 3, 2018 · US
Substrate processing apparatus, substrate processing method and recording medium
US-2017170021-A1 · Jun 15, 2017 · US
Substrate processing apparatus, substrate processing method and recording medium
US-2017167029-A1 · Jun 15, 2017 · US
Electrolytic treatment apparatus and electrolytic treatment method
US-2017159202-A1 · Jun 8, 2017 · US
Adhesion layer forming method, adhesion layer forming system and recording medium
US-2016284592-A1 · Sep 29, 2016 · US
Substrate processing method and template
US-2016108538-A1 · Apr 21, 2016 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Tokyo Electron Ltd | 18 |
| Yokowo Seisakusho Kk | 3 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C25D21/12 | 12 |
| C25D7/123 | 11 |
| C25D17/001 | 10 |
| C25D17/007 | 10 |
| C25D5/18 | 8 |