Substrate processing apparatus, substrate processing method and recording medium

Patent metadata

Field	Value
Publication number	US-2017167029-A1
Application number	US-201615372787-A
Country	US
Kind code	A1
Filing date	Dec 8, 2016
Priority date	Dec 11, 2015
Publication date	Jun 15, 2017
Grant date	—

Abstract

A substrate processing apparatus can allow palladium atoms to be coupled to a surface of a substrate without performing a silane coupling processing with a silane coupling agent on the substrate. In a substrate processing apparatus 1 , a plating unit 4 includes a catalyst solution supply unit 43 a and a plating liquid supply unit 45 . The catalyst solution supply unit 43 a forms a catalyst layer 91 on a surface of a substrate W 1 by supplying, onto the substrate W 1 , a catalyst solution L 1 containing a complex of a palladium ion and a monocyclic 5- or 6-membered aromatic or aliphatic heterocyclic compound having one or two nitrogen atoms as a heteroatom. After the catalyst solution L 1 is supplied, the plating liquid supply unit 45 forms an electroless plating layer 92 on the catalyst layer 91 formed on a substrate W 2 by supplying a plating liquid M 1 onto the substrate W 2.

First claim

We claim:

1 . A substrate processing apparatus configured to perform a plating processing on a substrate, the substrate processing apparatus comprising:
a catalyst solution supply unit configured to supply, onto the substrate, a catalyst solution containing a complex of a palladium ion and a monocyclic 5- or 6-membered heterocyclic compound having one or two nitrogen atoms as a heteroatom; a plating liquid supply unit configured to supply a plating liquid onto the substrate; and a controller configured to control operations of the catalyst solution supply unit and the plating liquid supply unit, wherein the controller controls the catalyst solution supply unit and the plating liquid supply unit such that the catalyst solution is supplied onto the substrate by the catalyst solution supply unit and, after the catalyst solution is supplied, the plating liquid is supplied onto the substrate by the plating liquid supply unit.

2 . The substrate processing apparatus of claim 1 ,
wherein the heterocyclic compound is selected from a group consisting of pyrroline, pyrrole, imidazoline, imidazole, pyrazoline, pyrazole, pyridine, pyridazine, pyrimidine, pyrazine, pyrrolidine, imidazolidine, pyrazolidine, piperidine and piperazine.

3 . The substrate processing apparatus of claim 1 ,
wherein the heterocyclic compound has a substituent selected from a group consisting of a hydroxyl group, a carboxyl group and a sulfate group.

4 . A substrate processing method of performing a plating processing on a substrate, the substrate processing method comprising:
forming a catalyst layer by supplying, onto the substrate, a catalyst solution containing a complex of a palladium ion and a monocyclic 5- or 6-membered heterocyclic compound having one or two nitrogen atoms as a heteroatom; and forming a plating layer through electroless plating by supplying a plating liquid onto the substrate after the forming of the catalyst layer.

5 . The substrate processing method of claim 4 ,
wherein the heterocyclic compound is selected from a group consisting of pyrroline, pyrrole, imidazoline, imidazole, pyrazoline, pyrazole, pyridine, pyridazine, pyrimidine, pyrazine, pyrrolidine, imidazolidine, pyrazolidine, piperidine and piperazine.

6 . The substrate processing method of claim 4 ,
wherein the heterocyclic compound has a substituent selected from a group consisting of a hydroxyl group, a carboxyl group and a sulfate group.

7 . A computer-readable recording medium having stored thereon computer-executable instructions that, in response to execution, cause a substrate processing apparatus to perform a substrate processing method as claimed in claim 4 .

Assignees

• Tokyo Electron Ltd

Inventors

• Hoshino Tomohisa
• Fujita Keiichi
• Hamada Masato

Classifications

• H10P14/46

  using a liquid · CPC title

• H10W20/044 Primary

  for electroless plating · CPC title

• H10W20/043

  for electroplating · CPC title

• H10W20/023

  the interconnections being through-semiconductor vias · CPC title

• H10W20/0245

  comprising use of blind vias during the manufacture · CPC title