Plating apparatus and plating method
US-2017298531-A1 · Oct 19, 2017 · US
Current directing devices
Current directing devices · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C25D17/007 |
| Official title | {Current directing devices} |
| Display label | Current directing devices |
| Total patents | 338 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 18 |
| 2016 | 34 |
| 2017 | 31 |
| 2018 | 32 |
| 2019 | 37 |
| 2020 | 25 |
| 2021 | 29 |
| 2022 | 37 |
| 2023 | 44 |
| 2024 | 33 |
| 2025 | 15 |
| 2026 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Pattern transfer device and pattern transfer method
US-2017283975-A1 · Oct 5, 2017 · US
Substrate processing apparatus and substrate processing method
US-2017283977-A1 · Oct 5, 2017 · US
Electroplating processor with current thief electrode
US-9765443-B2 · Sep 19, 2017 · US
Method of electroplating low internal stress copper deposits on thin film substrates to inhibit warping
US-2017145577-A1 · May 25, 2017 · US
Apparatus for electroplating of electrodes on photovoltaic structures
US-2017110622-A1 · Apr 20, 2017 · US
Electroplating processor with current thief electrode
US-2017058424-A1 · Mar 2, 2017 · US
Inert anode electroplating processor and replenisher
US-2017016137-A1 · Jan 19, 2017 · US
Method of adjusting plating apparatus, and measuring apparatus
US-2016369422-A1 · Dec 22, 2016 · US
Apparatus and method for modulating azimuthal uniformity in electroplating
US-2016362809-A1 · Dec 15, 2016 · US
Plating cup with contoured cup bottom
US-9512538-B2 · Dec 6, 2016 · US
Substrate holder, plating apparatus, and plating method
US-2016348264-A1 · Dec 1, 2016 · US
Apparatus and method for electodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity
US-2016333495-A1 · Nov 17, 2016 · US
Electric field treatment method and electric field treatment device
US-2016326663-A1 · Nov 10, 2016 · US
Semiconductor electroplating system
US-2016315048-A1 · Oct 27, 2016 · US
Electro chemical plating process
US-9476135-B2 · Oct 25, 2016 · US
Electroplating apparatus with membrane tube shield
US-9469911-B2 · Oct 18, 2016 · US
Electroplating method and electroplating device
US-2016273121-A1 · Sep 22, 2016 · US
Control of current density in an electroplating apparatus
US-2016273124-A1 · Sep 22, 2016 · US
Coating forming device and coating forming method for forming metal coating
US-2016265128-A1 · Sep 15, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C25D17/007?
- CPC C25D17/007 is the Cooperative Patent Classification code for “Current directing devices.”
- How many patents are filed under CPC C25D17/007 (Current directing devices)?
- Our database includes 338 publications tagged with this CPC code.
- Is patent activity under CPC C25D17/007 growing?
- Publication counts under this code: 33 in 2024 vs 15 in 2025 (latest complete years).