Adhesion layer forming method, adhesion layer forming system and recording medium

Patent metadata

Field	Value
Publication number	US-10354915-B2
Application number	US-201615077988-A
Country	US
Kind code	B2
Filing date	Mar 23, 2016
Priority date	Mar 26, 2015
Publication date	Jul 16, 2019
Grant date	Jul 16, 2019

Abstract

An adhesion layer formed of a thin film can be formed on a surface of a substrate. An adhesion layer forming method of forming the adhesion layer on the substrate includes supplying a coupling agent onto the substrate 2 while rotating the substrate 2 . The substrate 2 is rotated at a low speed equal to or less than 300 rpm and the coupling agent diluted with IPA is supplied onto the substrate 2.

First claim

We claim:

1. An adhesion layer forming method of forming an adhesion layer, for forming an electroless plating layer, on a substrate, comprising:
preparing the substrate; and
supplying an organic solvent having hydrophilicity from a first nozzle of a common nozzle head onto the substrate while rotating the substrate; and
then supplying a coupling agent from a second nozzle of the common nozzle head onto the substrate while rotating the substrate and continuously supplying the organic solvent from the first nozzle onto the substrate,
wherein, in the supplying of the coupling agent, the coupling agent is being diluted with the organic solvent that is being supplied onto the substrate while maintaining the substrate in a wet state, and
the first nozzle and the second nozzle are adjacently provided to the common nozzle head to supply different solutions toward the substrate.

2. The adhesion layer forming method of claim 1 ,
wherein, in the supplying of the coupling agent, the substrate is rotated at a rotational number equal to or less than 300 rpm.

3. The adhesion layer forming method of claim 1 ,
wherein the coupling agent is diluted with isopropyl alcohol.

4. The adhesion layer forming method of claim 3 ,
wherein the coupling agent is diluted with the isopropyl alcohol by 10 times to 1000 times.

5. The adhesion layer forming method of claim 1 ,
wherein before the supplying of the coupling agent, the substrate is previously maintained in the wet state by the organic solvent having hydrophilicity.

6. The adhesion layer forming method of claim 1 ,
wherein after the supplying of the coupling agent, a rinse process is performed on the substrate to remove the coupling agent remaining on the substrate.

7. A non-transitory computer-readable recording medium having stored thereon computer-executable instructions that, in response to execution, cause an adhesion layer forming system to perform an adhesion layer forming method,
wherein the adhesion layer forming method comprises:
preparing a substrate;
supplying an organic solvent having hydrophilicity from a first nozzle of a common nozzle head onto the substrate while rotating the substrate; and
supplying a coupling agent from a second nozzle of the common nozzle head onto the substrate while rotating the substrate and continuously supplying the organic solvent from the first nozzle onto the substrate,
wherein, in the supplying of the coupling agent, the coupling agent is being diluted with the organic solvent having hydrophilicity that is being supplied onto the substrate while maintaining the substrate in a wet state, and
the first nozzle and the second nozzle are adjacently provided to the common nozzle head to supply different solutions toward the substrate.

Assignees

• Tokyo Electron Ltd

Inventors

• Hoshino Tomohisa
• Hamada Masato
• Tanaka Takashi
• Inatomi Yuichiro
• Saito Yusuke

Classifications

• H10W20/0245

  comprising use of blind vias during the manufacture · CPC title

• H10W20/0261

  characterised by the filling method or the material of the conductive fill · CPC title

• C23C18/50

  with alloys based on iron, cobalt or nickel · CPC title

• C23C18/38

  Coating with copper · CPC title

• C23C18/32

  Coating with nickel, cobalt or mixtures thereof with phosphorus or boron (C23C18/50 takes precedence) · CPC title