Adhesion layer forming method, adhesion layer forming system and recording medium

Patent metadata

Field	Value
Publication number	US-2016284592-A1
Application number	US-201615077988-A
Country	US
Kind code	A1
Filing date	Mar 23, 2016
Priority date	Mar 26, 2015
Publication date	Sep 29, 2016
Grant date	—

Abstract

An adhesion layer formed of a thin film can be formed on a surface of a substrate. An adhesion layer forming method of forming the adhesion layer on the substrate includes supplying a coupling agent onto the substrate 2 while rotating the substrate 2 . The substrate 2 is rotated at a low speed equal to or less than 300 rpm and the coupling agent diluted with IPA is supplied onto the substrate 2.

First claim

We claim:

1 . An adhesion layer forming method of forming an adhesion layer, for forming an electroless plating layer, on a substrate, comprising:
preparing the substrate; and supplying a coupling agent onto the substrate while rotating the substrate, wherein, in the supplying of the coupling agent, the coupling agent diluted with an organic solvent having hydrophilicity is supplied while maintaining the substrate in a wet state.

2 . The adhesion layer forming method of claim 1 ,
wherein, in the supplying of the coupling agent, the substrate is rotated at a rotational number equal to or less than 300 rpm.

3 . The adhesion layer forming method of claim 1 ,
wherein the coupling agent is diluted with isopropyl alcohol.

4 . The adhesion layer forming method of claim 3 ,
wherein the coupling agent is diluted with the isopropyl alcohol by 10 times to 1000 times.

5 . The adhesion layer forming method of claim 1 ,
wherein before the supplying of the coupling agent, the substrate is previously maintained in the wet state by the organic solvent having hydrophilicity.

6 . The adhesion layer forming method of claim 1 ,
wherein after the supplying of the coupling agent, a rinse process is performed on the substrate to remove the coupling agent remaining on the substrate.

7 . An adhesion layer forming system of forming an adhesion layer on a substrate, comprising:
a substrate holding/rotating device configured to hold and rotate the substrate; and a coupling agent supplying unit configured to supply a coupling agent onto the substrate to form the adhesion layer on an entire surface of the substrate, wherein the coupling agent supplying unit is configured to supply the coupling agent diluted with an organic solvent having hydrophilicity.

8 . The adhesion layer forming system of claim 7 ,
wherein the substrate holding/rotating device is configured to rotate the substrate at a rotational number equal to or less than 300 rpm.

9 . A computer-readable recording medium having stored thereon computer-executable instructions that, in response to execution, cause an adhesion layer forming system to perform an adhesion layer forming method,
wherein the adhesion layer forming method comprises: preparing a substrate; and supplying a coupling agent onto the substrate while rotating the substrate, wherein, in the supplying of the coupling agent, the coupling agent diluted with an organic solvent having hydrophilicity is supplied while maintaining the substrate in a wet state.

Assignees

• Tokyo Electron Ltd

Inventors

• Hoshino Tomohisa
• Hamada Masato
• Tanaka Takashi
• Inatomi Yuichiro
• Saito Yusuke

Classifications

• H10W20/0245

  comprising use of blind vias during the manufacture · CPC title

• H10W20/0261

  characterised by the filling method or the material of the conductive fill · CPC title

• H10P72/0414

  using mainly spraying means, e.g. nozzles · CPC title

• H10W20/033

  in openings in dielectrics · CPC title

• H10W20/023

  the interconnections being through-semiconductor vias · CPC title