Semiconductor device
US-2025118357-A1 · Apr 10, 2025 · US
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Han Jung Hoon patents
Han Jung Hoon is listed as an inventor on 26 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Han Jung Hoon |
| Total patents | 26 |
| First publication | Dec 3, 2015 |
| Latest publication | Apr 10, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Method for measuring distribution of pores in electrode for secondary battery
US-12196651-B2 · Jan 14, 2025 · US
Semiconductor memory device
US-12185528-B2 · Dec 31, 2024 · US
Semiconductor memory device
US-2024147709-A1 · May 2, 2024 · US
Semiconductor memory device
US-11895833-B2 · Feb 6, 2024 · US
Battery electrode analysis method
US-11650223-B2 · May 16, 2023 · US
Surface acoustic wave device package and method of manufacturing the same
US-11637539-B2 · Apr 25, 2023 · US
Fbar Type Filter
US-2023047232-A1 · Feb 16, 2023 · US
Semiconductor memory device
US-2022173112-A1 · Jun 2, 2022 · US
Analysis method for crack rate of electrode active material of electrode for lithium secondary battery
US-11334984-B2 · May 17, 2022 · US
Recent patents
Latest publications not already listed above.
Battery Electrode Analysis Method
US-2021231704-A1 · Jul 29, 2021 · US
Analysis method for crack rate of electrode active material of electrode for lithium secondary battery
US-2021012483-A1 · Jan 14, 2021 · US
Method for Measuring Distribution of Pores in Electrode for Secondary Battery
US-2020141841-A1 · May 7, 2020 · US
Surface acoustic wave device package and method of manufacturing the same
US-2019393850-A1 · Dec 26, 2019 · US
Wafer level package and manufacturing method thereof
US-10446506-B2 · Oct 15, 2019 · US
Semiconductor device
US-10249627-B2 · Apr 2, 2019 · US
Wafer level package and manufacturing method thereof
US-2018358305-A1 · Dec 13, 2018 · US
Wafer level package and manufacturing method thereof
US-2018358308-A1 · Dec 13, 2018 · US
Semiconductor device and method for fabricating the same
US-10134740-B2 · Nov 20, 2018 · US
Surface acoustic wave wafer level package and method of manufacturing pcb for the same
US-2018269853-A1 · Sep 20, 2018 · US
Semiconductor device and method for fabricating the same
US-2018145080-A1 · May 24, 2018 · US
Semiconductor device
US-2018122810-A1 · May 3, 2018 · US
Rf module including saw device, method of manufacturing the rf module, the saw device, and method of manufacturing the saw device
US-2018062611-A1 · Mar 1, 2018 · US
Semiconductor devices
US-2018040571-A1 · Feb 8, 2018 · US
Catalytic manufacturing method for imine having no substituent group on the nitrogen, and use for the imine produced
US-9328069-B2 · May 3, 2016 · US
Catalytic Manufacturing Method for Imine Having No Substituent Group on the Nitrogen, and Use for the Imine Produced
US-2015344428-A1 · Dec 3, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Wisol Co Ltd | 8 |
| Samsung Electronics Co Ltd | 8 |
| Lg Chemical Ltd | 6 |
| Lg Energy Solution Ltd | 2 |
| Postech Acad Ind Found | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10B12/315 | 8 |
| H10B12/34 | 6 |
| H01M4/13 | 6 |
| Y02E60/10 | 6 |
| H03H9/1064 | 5 |