Surface acoustic wave device package and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-11637539-B2
Application number	US-201916444182-A
Country	US
Kind code	B2
Filing date	Jun 18, 2019
Priority date	Jun 22, 2018
Publication date	Apr 25, 2023
Grant date	Apr 25, 2023

Abstract

The present invention relates to a surface acoustic wave device package and a method of manufacturing the same, and more specifically, to a method of manufacturing a miniaturized surface acoustic wave device package.

First claim

What is claimed is:

1. A method of manufacturing a surface acoustic wave device package using a first substrate, a second substrate disposed in parallel with the first substrate, and a plurality of surface acoustic wave devices disposed between the first substrate and the second substrate, the method comprising the steps of:
primarily cutting, along a partitioning line, any one among the first substrate including the plurality of surface acoustic wave devices and the second substrate electrically connected to the first substrate;
forming a protection member for wrapping a cut space of the cut substrate and a top of the cut substrate;
flattening the protection member formed on the top of the cut substrate; and
separating a plurality of surface acoustic wave device packages including package the surface acoustic wave device by secondarily cutting the substrate having the flattened protection member and an uncut substrate among the first and second substrates along a partitioning line,
wherein the first substrate and the second substrate include a dam structure disposed on any one among the first substrate and the second substrate to connect the first substrate and the second substrate and wrap an electrode pattern, and the step of forming the protection member includes forming the protection member to wrap the dam structure.

2. The method according to claim 1 , wherein a line width of the partitioning line for cutting any one among the first substrate and the second substrate at the primarily cutting step is larger than a line width of the partitioning line for cutting the substrate having the flattened protection member and the uncut substrate at the step of separating the plurality of surface acoustic wave device packages.

3. The method according to claim 1 , wherein the step of flattening the protection member includes flattening the protection member formed on the top to expose an electrode pad, when the cut substrate includes the electrode pad exposed from a top surface of the cut substrate.

4. The method according to claim 1 , wherein the step of separating the plurality of surface acoustic wave device packages includes cutting the substrates to dispose a side surface of the cut substrate and a side surface of the protection member on a same plane.

5. The method according to claim 1 , wherein the first substrate and the second substrate are formed of any one among a silicon substrate, a diamond substrate, a sapphire substrate, a silicon carbide substrate, a LiNbO 3 substrate, a LiTaO 3 substrate, and a printed circuit board (PCB).

6. The method according to claim 1 , wherein the step of forming the protection member includes forming the protection member using any one among a method of attaching a film-type protection member, a method using a liquid-type protection member, a transfer molding method, and a compression molding method.

Assignees

• Wisol Co Ltd

Inventors

• Yong Jun Woo
• Han Jung Hoon
• Kim Bong Soo
• Park Eun Tae

Classifications

• H03H9/02929

  of ageing changes of characteristics, e.g. electro-acousto-migration · CPC title

• H03H9/1085 Primary

  the enclosure being defined by a non-uniform sealing mass covering the non-active sides of the SAW device · CPC title

• H03H9/058

  for surface acoustic wave devices · CPC title

• H03H3/08 Primary

  for the manufacture of resonators or networks using surface acoustic waves · CPC title

• H03H9/1071

  the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device · CPC title