Fbar Type Filter

US2023047232A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2023047232-A1
Application numberUS-202217876898-A
CountryUS
Kind codeA1
Filing dateJul 29, 2022
Priority dateAug 13, 2021
Publication dateFeb 16, 2023
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Disclosed is a film bulk acoustic resonator (FBAR) type filter including a substrate including two or more cavities on a top surface thereof, a lower electrode formed above the substrate, a piezoelectric layer formed above the lower electrode, two or more upper electrodes formed above the piezoelectric layer, and a package layer including a wall vertically extending while surrounding a periphery of certain areas in which the cavities and the lower electrode are formed and a roof disposed above the wall while being spaced apart from the upper electrodes to seal the certain areas.

First claim

Opening claim text (preview).

What is claimed is: 1 . A film bulk acoustic resonator (FBAR) type filter comprising: a substrate comprising two or more cavities on a top surface thereof; a lower electrode formed above the substrate; a piezoelectric layer formed above the lower electrode; two or more upper electrodes formed above the piezoelectric layer; and a package layer including a wall vertically extending while surrounding a periphery of certain areas in which the cavities and the lower electrode are formed and a roof disposed above the wall while being spaced apart from the upper electrodes to seal the certain areas. 2 . The FBAR type filter of claim 1 , wherein the package layer is formed of a photosensitive polymer. 3 . The FBAR type filter of claim 1 , wherein the piezoelectric layer comprises an open hole formed above any one of the cavities in contact therewith and communicable with the any one cavity, and wherein the wall surrounds a periphery of the open hole. 4 . The FBAR type filter of claim 1 , wherein an edge of the roof is formed inside an edge of the wall. 5 . The FBAR type filter of claim 1 , comprising: a first distribution layer formed along a side part of one side of the package layer and having one end connected to the lower electrode and the other end connected to a top of the roof; and a second distribution layer formed along a side part of the other side of the package layer and having one end connected to any one of the upper electrodes and the other end connected to the top of the roof. 6 . An FBAR type filter comprising: a substrate comprising two or more cavities on a top surface thereof; a lower electrode formed above the substrate; a piezoelectric layer formed above the lower electrode; two or more upper electrodes formed above the piezoelectric layer; and a package layer including a wall vertically extending while surrounding a periphery of certain areas in which the cavities and the lower electrode are formed and a roof disposed above the wall while being spaced apart from the upper electrodes to seal the certain areas, wherein, the piezoelectric layer comprises an open hole formed above any one of the cavities in contact therewith and communicable with the any one cavity, and wherein the wall seals the open hole. 7 . The FBAR type filter of claim 6 , wherein the package layer is formed of a photosensitive polymer. 8 . The FBAR type filter of claim 6 , wherein an edge of the roof is formed inside an edge of the wall. 9 . The FBAR type filter of claim 6 , comprising: a first distribution layer formed along a side part of one side of the package layer and having one end connected to the lower electrode and the other end connected to a top of the roof; and a second distribution layer formed along a side part of the other side of the package layer and having one end connected to any one of the upper electrodes and the other end connected to the top of the roof.

Assignees

Inventors

Classifications

  • Air-gaps · CPC title

  • Air-gaps · CPC title

  • H03H9/105Primary

    the enclosure being defined by a cover cap mounted on an element forming part of the BAW device · CPC title

  • the enclosure being defined by a housing formed by a cavity in a resin · CPC title

  • implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type · CPC title

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Frequently asked questions

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What does patent US2023047232A1 cover?
Disclosed is a film bulk acoustic resonator (FBAR) type filter including a substrate including two or more cavities on a top surface thereof, a lower electrode formed above the substrate, a piezoelectric layer formed above the lower electrode, two or more upper electrodes formed above the piezoelectric layer, and a package layer including a wall vertically extending while surrounding a peripher…
Who is the assignee on this patent?
Wisol Co Ltd
What technology area does this patent fall under?
Primary CPC classification H03H9/105. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu Feb 16 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).