Anchored polymeric package for acoustic resonator structures
US-10511285-B1 · Dec 17, 2019 · US
US2023047232A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2023047232-A1 |
| Application number | US-202217876898-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jul 29, 2022 |
| Priority date | Aug 13, 2021 |
| Publication date | Feb 16, 2023 |
| Grant date | — |
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Disclosed is a film bulk acoustic resonator (FBAR) type filter including a substrate including two or more cavities on a top surface thereof, a lower electrode formed above the substrate, a piezoelectric layer formed above the lower electrode, two or more upper electrodes formed above the piezoelectric layer, and a package layer including a wall vertically extending while surrounding a periphery of certain areas in which the cavities and the lower electrode are formed and a roof disposed above the wall while being spaced apart from the upper electrodes to seal the certain areas.
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What is claimed is: 1 . A film bulk acoustic resonator (FBAR) type filter comprising: a substrate comprising two or more cavities on a top surface thereof; a lower electrode formed above the substrate; a piezoelectric layer formed above the lower electrode; two or more upper electrodes formed above the piezoelectric layer; and a package layer including a wall vertically extending while surrounding a periphery of certain areas in which the cavities and the lower electrode are formed and a roof disposed above the wall while being spaced apart from the upper electrodes to seal the certain areas. 2 . The FBAR type filter of claim 1 , wherein the package layer is formed of a photosensitive polymer. 3 . The FBAR type filter of claim 1 , wherein the piezoelectric layer comprises an open hole formed above any one of the cavities in contact therewith and communicable with the any one cavity, and wherein the wall surrounds a periphery of the open hole. 4 . The FBAR type filter of claim 1 , wherein an edge of the roof is formed inside an edge of the wall. 5 . The FBAR type filter of claim 1 , comprising: a first distribution layer formed along a side part of one side of the package layer and having one end connected to the lower electrode and the other end connected to a top of the roof; and a second distribution layer formed along a side part of the other side of the package layer and having one end connected to any one of the upper electrodes and the other end connected to the top of the roof. 6 . An FBAR type filter comprising: a substrate comprising two or more cavities on a top surface thereof; a lower electrode formed above the substrate; a piezoelectric layer formed above the lower electrode; two or more upper electrodes formed above the piezoelectric layer; and a package layer including a wall vertically extending while surrounding a periphery of certain areas in which the cavities and the lower electrode are formed and a roof disposed above the wall while being spaced apart from the upper electrodes to seal the certain areas, wherein, the piezoelectric layer comprises an open hole formed above any one of the cavities in contact therewith and communicable with the any one cavity, and wherein the wall seals the open hole. 7 . The FBAR type filter of claim 6 , wherein the package layer is formed of a photosensitive polymer. 8 . The FBAR type filter of claim 6 , wherein an edge of the roof is formed inside an edge of the wall. 9 . The FBAR type filter of claim 6 , comprising: a first distribution layer formed along a side part of one side of the package layer and having one end connected to the lower electrode and the other end connected to a top of the roof; and a second distribution layer formed along a side part of the other side of the package layer and having one end connected to any one of the upper electrodes and the other end connected to the top of the roof.
Air-gaps · CPC title
Air-gaps · CPC title
the enclosure being defined by a cover cap mounted on an element forming part of the BAW device · CPC title
the enclosure being defined by a housing formed by a cavity in a resin · CPC title
implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type · CPC title
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