Method for forming continuous line-end to line-end spaces with spacer assisted lithography-etch-lithography etch processes
US-12455505-B2 · Oct 28, 2025 · US
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Han Geng patents
Han Geng is listed as an inventor on 35 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Han Geng |
| Total patents | 35 |
| First publication | Jan 1, 2015 |
| Latest publication | Oct 28, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Parallel lines formed by isolation cut
US-2025259940-A1 · Aug 14, 2025 · US
Contact and placeholder configuration for backside power delivery devices
US-2025203933-A1 · Jun 19, 2025 · US
Metallization lines on integrated circuit products
US-2024413082-A1 · Dec 12, 2024 · US
Metallization lines on integrated circuit products
US-12131994-B2 · Oct 29, 2024 · US
Irregular-shaped power rail in cell power distribution
US-2024321748-A1 · Sep 26, 2024 · US
Metallization lines on integrated circuit products
US-2023395502-A1 · Dec 7, 2023 · US
Metallization lines on integrated circuit products
US-11791263-B2 · Oct 17, 2023 · US
Method for forming continuous line-end to line-end spaces with spacer assisted lithography-etch-lithography etch processes
US-2023314952-A1 · Oct 5, 2023 · US
Addressing layout retargeting shortfalls
US-11574103-B2 · Feb 7, 2023 · US
Recent patents
Latest publications not already listed above.
Metallization lines on integrated circuit products
US-2022108950-A1 · Apr 7, 2022 · US
Metallization lines on integrated circuit products
US-11233006-B2 · Jan 25, 2022 · US
Addressing layout retargeting shortfalls
US-2021240899-A1 · Aug 5, 2021 · US
Hybrid optical and EUV lithography
US-11061315-B2 · Jul 13, 2021 · US
Hybrid optical and euv lithography
US-2020159105-A1 · May 21, 2020 · US
Structure design generation for fixing metal tip-to-tip across cell boundary
US-10534258-B2 · Jan 14, 2020 · US
Structure design generation for fixing metal tip-to-tip across cell boundary
US-10527932-B2 · Jan 7, 2020 · US
Structure design generation for fixing metal tip-to-tip across cell boundary
US-2019155148-A1 · May 23, 2019 · US
Structure design generation for fixing metal tip-to-tip across cell boundary
US-2019137867-A1 · May 9, 2019 · US
Structure design generation for fixing metal tip-to-tip across cell boundary
US-10248017-B2 · Apr 2, 2019 · US
Metallization lines on integrated circuit products
US-2019006232-A1 · Jan 3, 2019 · US
Dummy pattern addition to improve CD uniformity
US-10170309-B2 · Jan 1, 2019 · US
Methods of forming metallization lines on integrated circuit products and the resulting products
US-10079173-B2 · Sep 18, 2018 · US
Dummy pattern addition to improve cd uniformity
US-2018233361-A1 · Aug 16, 2018 · US
Methods of forming metallization lines on integrated circuit products and the resulting products
US-2018096932-A1 · Apr 5, 2018 · US
Structure design generation for fixing metal tip-to-tip across cell boundary
US-2018067391-A1 · Mar 8, 2018 · US
Method of simultaneous lithography and etch correction flow
US-9910348-B2 · Mar 6, 2018 · US
Structure design generation for fixing metal tip-to-tip across cell boundary
US-9885951-B2 · Feb 6, 2018 · US
Structure design generation for fixing metal tip-to-tip across cell boundary
US-2017168386-A1 · Jun 15, 2017 · US
Method of simultaneous lithography and etch correction flow
US-2017004233-A1 · Jan 5, 2017 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| IBM | 19 |
| Globalfoundries Inc | 10 |
| Globalfoundries Us Inc | 7 |
| Samsung Electronics Co Ltd | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| G06F30/398 | 16 |
| H10W20/089 | 13 |
| H10D84/038 | 13 |
| H10D84/834 | 11 |
| H10D84/0158 | 11 |