Addressing layout retargeting shortfalls

US11574103B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11574103-B2
Application numberUS-202016779179-A
CountryUS
Kind codeB2
Filing dateJan 31, 2020
Priority dateJan 31, 2020
Publication dateFeb 7, 2023
Grant dateFeb 7, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Aspects of the invention provide means for addressing layout retargeting shortfalls. Initially, an original design shape in the layout is allowed to be simulated by process simulation to form process simulation contours. A polygon is then fitted to the process simulation contours to form a fitted simulated shape. Subsequently, whether the fitted simulated shape differs from the original design shape is detected. The process simulation may reflect the changes to the layout that occur at a foundry as part of a retargeting process. Advantageously, addressing a layout for retargeting shortfalls in accordance with aspects of the invention is likely to result in manufactured semiconductor devices having higher yields and reliability than those produced from a like layout that is not addressed in this manner.

First claim

Opening claim text (preview).

What is claimed is: 1. A method comprising the steps of: using, using at least one processor, an original design shape in a layout to be simulated by process simulation to form process simulation contours; fitting, using the at least one processor, a polygon to the process simulation contours to form a fitted simulated shape; comparing, using the at least one processor, the fitted simulated shape and the original design shape; and determining, using the at least one processor, whether the fitted simulated shape violates a set of design rules in response to detecting that the fitted simulated shape differs from the original design shape, wherein the fitting step comprises generating a concave hull that characterizes the process simulation contours, fitting a plurality of rectangles to the concave hull and merging the plurality of rectangles to form the polygon. 2. The method of claim 1 , wherein the comparing step comprises comparing the fitted simulated shape to the original design shape utilizing a NOT or an XOR Boolean operation. 3. The method of claim 1 , wherein the determining step comprises determining at least one of width, length, spacing, density, enclosure, or area of the fitted simulated shape. 4. The method of claim 1 , further comprising the step of modifying the layout if the fitted simulated shape violates the set of design rules. 5. The method of claim 4 , wherein the modifying step comprises modifying at least one of size, shape, or position of the original design shape. 6. The method of claim 4 , further comprising the step of manufacturing a semiconductor device based on the modified layout. 7. The method of claim 1 , further comprising providing a system, wherein the system comprises distinct software modules, each of the distinct software modules being embodied on a computer readable storage medium, and wherein: the distinct software modules comprise a polygon fitting module and a difference detection module; the fitting step is carried out by the polygon fitting module executing on at least one hardware processor; and the comparing step is carried out by the difference detection module executing on the at least one hardware processor. 8. An apparatus comprising: a memory; and at least one processor coupled to the memory and operative to perform the steps of: using an original design shape in the layout to be simulated by process simulation to form process simulation contours; fitting a polygon to the process simulation contours to form a fitted simulated shape; comparing the fitted simulated shape and the original design shape; and determining whether the fitted simulated shape violates a set of design rules in response to detecting that the fitted simulated shape differs from the original design shape, wherein the fitting step comprises generating a concave hull that characterizes the process simulation contours, fitting a plurality of rectangles to the concave hull and merging the plurality of rectangles to form the polygon. 9. The apparatus of claim 8 , wherein the comparing step comprises comparing the fitted simulated shape to the original design shape utilizing a NOT or XOR Boolean operation. 10. The apparatus of claim 8 , wherein the determining step comprises determining at least one of width, length, spacing, density, enclosure, or area of the fitted simulated shape. 11. The apparatus of claim 8 , wherein the at least one processor is further operative to perform the step of modifying the layout if the fitted simulated shape violates the set of design rules. 12. The apparatus of claim 11 , wherein the modifying step comprises modifying at least one of size, shape, or position of the original design shape. 13. The apparatus of claim 8 , further comprising a plurality of distinct software modules, each of the distinct software modules being embodied on a computer-readable storage medium, and wherein the distinct software modules comprise a polygon fitting module and a difference detection module, wherein: the at least one processor is operative to perform the fitting step by executing the polygon fitting module; and the at least one processor is operative to perform the comparing step by executing the difference detection module.

Assignees

Inventors

Classifications

  • Manufacturability analysis or optimisation for manufacturability · CPC title

  • G06F30/392Primary

    Floor-planning or layout, e.g. partitioning or placement · CPC title

  • Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM] (optical proximity correction [OPC] design processes G03F1/36) · CPC title

  • Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS] · CPC title

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Frequently asked questions

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What does patent US11574103B2 cover?
Aspects of the invention provide means for addressing layout retargeting shortfalls. Initially, an original design shape in the layout is allowed to be simulated by process simulation to form process simulation contours. A polygon is then fitted to the process simulation contours to form a fitted simulated shape. Subsequently, whether the fitted simulated shape differs from the original design …
Who is the assignee on this patent?
IBM
What technology area does this patent fall under?
Primary CPC classification G06F30/392. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Feb 07 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).