Semiconductor device with a multi-layered encapsulant and associated systems, devices, and methods
US-2024222145-A1 · Jul 4, 2024 · US
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Hacker Jonathan S patents
Hacker Jonathan S is listed as an inventor on 44 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Hacker Jonathan S |
| Total patents | 44 |
| First publication | Dec 8, 2016 |
| Latest publication | Jul 4, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Uniform electrochemical plating of metal onto arrays of pillars having different lateral densities and related technology
US-2024178175-A1 · May 30, 2024 · US
Semiconductor device with a multi-layered encapsulant and associated systems, devices, and methods
US-11955346-B2 · Apr 9, 2024 · US
Uniform electrochemical plating of metal onto arrays of pillars having different lateral densities and related technology
US-11923329-B2 · Mar 5, 2024 · US
Uniform electrochemical plating of metal onto arrays of pillars having different lateral densities and related technology
US-2023104042-A1 · Apr 6, 2023 · US
Systems and methods for forming semiconductor cutting/trimming blades
US-11565371-B2 · Jan 31, 2023 · US
Uniform electrochemical plating of metal onto arrays of pillars having different lateral densities and related technology
US-11527505-B2 · Dec 13, 2022 · US
Inductive testing probe apparatus for testing semiconductor die and related systems and methods
US-11402426-B2 · Aug 2, 2022 · US
Die features for self-alignment during die bonding
US-11302653-B2 · Apr 12, 2022 · US
Semiconductor device with a multi-layered encapsulant and associated systems, devices, and methods
US-2021257226-A1 · Aug 19, 2021 · US
Recent patents
Latest publications not already listed above.
Edge cut debond using a temporary filler material with no adhesive properties and edge cut debond using an engineered carrier to enable topography
US-11094684-B2 · Aug 17, 2021 · US
Semiconductor device with a multi-layered encapsulant and associated systems, devices, and methods
US-11004697-B2 · May 11, 2021 · US
Uniform electrochemical plating of metal onto arrays of pillars having different lateral densities and related technology
US-2021074663-A1 · Mar 11, 2021 · US
Inductive testing probe apparatus for testing semiconductor die and related systems and methods
US-2021041495-A1 · Feb 11, 2021 · US
Semiconductor devices having discretely located passivation material, and associated systems and methods
US-10896886-B2 · Jan 19, 2021 · US
Inductive testing probe apparatus for testing semiconductor die and related systems and methods
US-10852344-B2 · Dec 1, 2020 · US
Die Features for Self-Alignment During Die Bonding
US-2020373252-A1 · Nov 26, 2020 · US
Uniform electrochemical plating of metal onto arrays of pillars having different lateral densities and related technology
US-10847486-B2 · Nov 24, 2020 · US
Semiconductor device with a multi-layered encapsulant and associated systems, devices, and methods
US-10763131-B2 · Sep 1, 2020 · US
Die features for self-alignment during die bonding
US-10748857-B2 · Aug 18, 2020 · US
Systems and methods for forming semiconductor cutting/trimming blades
US-2020206869-A1 · Jul 2, 2020 · US
Semiconductor device with a multi-layered encapsulant and associated systems, devices, and methods
US-10622223-B2 · Apr 14, 2020 · US
Die Features for Self-Alignment During Die Bonding
US-2020083178-A1 · Mar 12, 2020 · US
Uniform electrochemical plating of metal onto arrays of pillars having different lateral densities and related technology
US-2019385967-A1 · Dec 19, 2019 · US
Edge Cut Debond Using a Temporary Filler Material With No Adhesive Properties and Edge Cut Debond Using an Engineered Carrier to Enable Topography
US-2019341378-A1 · Nov 7, 2019 · US
Temporary carrier debond initiation, and associated systems and methods
US-10446431-B2 · Oct 15, 2019 · US
Semiconductor device with a multi-layered encapsulant and associated systems, devices, and methods
US-2019311918-A1 · Oct 10, 2019 · US
Edge cut debond using a temporary filler material with no adhesive properties and edge cut debond using an engineered carrier to enable topography
US-10403618-B2 · Sep 3, 2019 · US
Uniform electrochemical plating of metal onto arrays of pillars having different lateral densities and related technology
US-10396052-B2 · Aug 27, 2019 · US
Temporary carrier debond initiation, and associated systems and methods
US-2019198377-A1 · Jun 27, 2019 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Micron Technology Inc | 42 |
| Lodestar Licensing Group Llc | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W72/252 | 32 |
| H10W90/00 | 27 |
| H10W72/072 | 23 |
| H10W90/722 | 23 |
| H01L25/0657 | 23 |