Semiconductor device with a porous portion, wafer composite and method of manufacturing a semiconductor device
US-12412740-B2 · Sep 9, 2025 · US
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Goller Bernhard patents
Goller Bernhard is listed as an inventor on 87 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Goller Bernhard |
| Total patents | 87 |
| First publication | Feb 5, 2015 |
| Latest publication | Sep 9, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Apparatus for Electrochemical Treating of a Semiconductor Substrate and a Process using the Apparatus
US-2025253168-A1 · Aug 7, 2025 · US
Method of processing a semiconductor wafer
US-2025183031-A1 · Jun 5, 2025 · US
Manufacturing and reuse of semiconductor substrates
US-12249504-B2 · Mar 11, 2025 · US
Methods for forming a semiconductor device having a second semiconductor layer on a first semiconductor layer
US-12211703-B2 · Jan 28, 2025 · US
Method with mechanical dicing process for producing MEMS components
US-12060266-B2 · Aug 13, 2024 · US
Semiconductor device with a porous portion, wafer composite and method of manufacturing a semiconductor device
US-2024153759-A1 · May 9, 2024 · US
Method for manufacturing a contact on a silicon carbide semiconductor substrate, and silicon carbide semiconductor device
US-2024030032-A1 · Jan 25, 2024 · US
Semiconductor device with a porous portion, wafer composite and method of manufacturing a semiconductor device
US-11881397-B2 · Jan 23, 2024 · US
Method of manufacturing a semiconductor device
US-2024006218-A1 · Jan 4, 2024 · US
Recent patents
Latest publications not already listed above.
Methods for Forming a Semiconductor Device Having a Second Semiconductor Layer on a First Semiconductor Layer
US-2023395394-A1 · Dec 7, 2023 · US
Method of porosifying part of a semiconductor wafer
US-11810779-B2 · Nov 7, 2023 · US
Parent Substrate, Wafer Composite and Methods of Manufacturing Crystalline Substrates and Semiconductor Devices
US-2023330769-A1 · Oct 19, 2023 · US
Methods for forming a semiconductor device
US-11742215-B2 · Aug 29, 2023 · US
Parent substrate, wafer composite and methods of manufacturing crystalline substrates and semiconductor devices
US-11712749-B2 · Aug 1, 2023 · US
Semiconductor device with metal nitride layer and a method of manufacturing thereof
US-2023238442-A1 · Jul 27, 2023 · US
Manufacturing and reuse of semiconductor substrates
US-2023127556-A1 · Apr 27, 2023 · US
Semiconductor device with a porous portion, wafer composite and method of manufacturing a semiconductor device
US-2022359194-A1 · Nov 10, 2022 · US
Semiconductor device with a porous portion, wafer composite and method of manufacturing a semiconductor device
US-11476111-B2 · Oct 18, 2022 · US
Method of porosifying part of a semiconductor wafer
US-2022310380-A1 · Sep 29, 2022 · US
Method for partially removing a semiconductor wafer
US-11404262-B2 · Aug 2, 2022 · US
Semiconductor surface smoothing and semiconductor arrangement
US-11373857-B2 · Jun 28, 2022 · US
Semiconductor chip including back-side conductive layer
US-11328955-B2 · May 10, 2022 · US
Methods for Forming a Semiconductor Device
US-2022037165-A1 · Feb 3, 2022 · US
Semiconductor device manufacturing by thinning and dicing
US-2021391218-A1 · Dec 16, 2021 · US
Method of thinning a semiconductor substrate to high evenness and semiconductor substrate having a device layer of high evenness
US-2021391377-A1 · Dec 16, 2021 · US
Semiconductor device and method of manufacturing a semiconductor device
US-11139375-B2 · Oct 5, 2021 · US
Method with mechanical dicing process for producing mems components
US-2021253421-A1 · Aug 19, 2021 · US
Support table, support table assembly, processing arrangement, and methods thereof
US-11088009-B2 · Aug 10, 2021 · US
Method of forming oxygen inserted Si-layers in power semiconductor devices
US-11031466-B2 · Jun 8, 2021 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Ag | 73 |
| Infineon Technologies Austria Ag | 13 |
| Infineon Technologies Austria | 2 |
| Infineon Technologies Americas Corp | 1 |
| Infineon Technoogies Ag | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P52/00 | 26 |
| H10D30/668 | 22 |
| H10D12/481 | 22 |
| H10P50/00 | 21 |
| H10D30/66 | 19 |