Support table, support table assembly, processing arrangement, and methods thereof

Patent metadata

Field	Value
Publication number	US-11088009-B2
Application number	US-201916514632-A
Country	US
Kind code	B2
Filing date	Jul 17, 2019
Priority date	Jul 18, 2018
Publication date	Aug 10, 2021
Grant date	Aug 10, 2021

Abstract

According to various embodiments, a support table may include: a baseplate including a support structure, the support structure defining a support region over the baseplate to support at least one of a workpiece or a workpiece carrier therein; and one or more light-emitting components disposed between the baseplate and the support region. The one or more light-emitting components are configured to emit light into the support region.

First claim

What is claimed is:

1. A support table assembly for processing a workpiece, the support table assembly comprising:
a workpiece carrier comprising a tape frame and a tape attached to the tape frame, the tape comprising a base layer and a light-sensitive adhesive layer configured to adhere a workpiece to the workpiece carrier; and
a support table configured to support the workpiece carrier and comprising one or more light-emitting components configured to emit light into a direction of the tape when the workpiece carrier is supported by the support table,
wherein the base layer of the tape is transparent for the light emitted by the one or more light-emitting components, for illumination of at least the light-sensitive adhesive layer of the tape,
wherein the support table comprises a baseplate and a support structure, the support structure defining a support region over the baseplate to support the workpiece carrier therein,
wherein the support table further comprises a reflector plate disposed between the baseplate and the support region,
wherein the reflector plate has one or more openings vertically aligned with the one or more light-emitting components such that the light emitted by the one or more light-emitting components passes through the one or more openings in the reflector plate and into the support region.

2. The support table assembly of claim 1 , wherein the support structure comprises a support plate disposed between the support region and the baseplate, the support plate comprising a support surface facing away from the baseplate configured to support the workpiece carrier thereon.

3. The support table assembly of claim 2 , wherein the one or more light-emitting components are configured to emit the light in a direction of the support plate, and wherein the support plate is configured to pass light emitted from the one or more light-emitting components through the support plate into the support region.

4. The support table assembly of claim 2 , wherein the support plate comprises a material that is transparent for ultra-violet light.

5. The support table assembly of claim 1 , wherein the base layer comprises a polymer.

6. The support table assembly of claim 5 , wherein the polymer is a poly olefin.

7. The support table assembly of claim 1 , wherein the workpiece is a semiconductor wafer, and wherein the workpiece carrier is a wafer carrier.

8. The support table assembly of claim 1 , wherein the tape is a dicing tape.

9. The support table assembly of claim 1 , wherein the base layer has a layer thickness in a range from about 60 μm to about 300 μm.

10. The support table assembly of claim 1 , wherein the light-sensitive adhesive layer comprises an adhesive material configured to reduce an adhesion strength of the light-sensitive adhesive layer when exposed to ultra-violet light.

11. The support table assembly of claim 1 , wherein the light-sensitive adhesive layer has a layer thickness in a range from about 5 μm to about 25 μm.

12. The support table assembly of claim 1 , wherein the reflector plate comprises aluminum.

13. The support table assembly of claim 1 , wherein the support structure comprises one or more attachment structures configured to attach the workpiece carrier to the support structure.

14. The support table assembly of claim 1 , wherein the support table further comprises a cooling structure configured to dissipate heat from the one or more light-emitting components.

15. The support table assembly of claim 1 , wherein the support table further comprises a temperature sensor associated with the one or more light-emitting components.

16. The support table assembly of claim 1 , wherein the one or more light-emitting components comprise a plurality of light-emitting components in an equilateral triangle arrangement.

17. The support table assembly of claim 1 , wherein the one or more light-emitting components are configured to emit ultra-violet light, and wherein the reflector plate comprises a material that reflects ultra-violet light.

18. The support table assembly of claim 1 , wherein the support structure includes one or more vacuum mounts configured to attach the workpiece carrier to the support structure.

19. A support table, comprising:
a baseplate;
a support structure defining a support region over the baseplate to support at least one of a workpiece or a workpiece carrier therein;
one or more light-emitting components disposed between the baseplate and the support region, the one or more light-emitting components configured to emit light into the support region; and
a reflector plate disposed between the baseplate and the support region, the reflector plate having one or more openings vertically aligned with the one or more light-emitting components such that the light emitted by the one or more light-emitting components passes through the one or more openings in the reflector plate and into the support region.

20. A processing arrangement, comprising:
one or more processing tools configured to process and/or handle at least one workpiece carrier, the workpiece carrier having a workpiece attached thereto; and
the support table of claim 19 to support the at least one workpiece carrier in at least one of the one or more processing tools.

21. The processing arrangement of claim 20 , wherein the one or more processing tools comprise a mounting tool configured to attach the workpiece to the workpiece carrier, and/or wherein the one or more processing tools comprise a cutting tool configured to remove an edge region of the workpiece, and/or wherein the one or more processing tools comprise a dicing tool configured to dice the workpiece into a plurality of portions.

22. A support table, comprising:
a baseplate;
a support structure defining a support region over the baseplate to support at least one of a workpiece or a workpiece carrier therein;
one or more light-emitting components disposed between the baseplate and the support region, the one or more light-emitting components configured to emit light into the support region;
one or more cooling channels disposed in the baseplate and configured to carry a cooling fluid for dissipating heat from the one or more light-emitting components; and
a reflector plate disposed between the baseplate and the support region,
wherein the reflector plate has one or more openings vertically aligned with the one or more light-emitting components such that the light emitted by the one or more light-emitting components passes through the one or more openings in the reflector plate and into the support region.

23. The support table of claim 22 , wherein the support structure includes one or more vacuum mounts configured to attach a workpiece carrier to the support structure.

24. The support table of claim 22 , wherein the one or more light-emitting components are configured to emit ultra-violet light, and wherein the reflector plate comprises a material that reflects ultra-violet light.

Assignees

• Infineon Technologies Ag

Inventors

• Goller Bernhard
• Leitgeb Walter
• Brunner Daniel
• Ferlan Lukas
• Ottowitz Markus

Classifications

• H10P72/7416

  used during dicing or grinding · CPC title

• H10P72/0602

  Temperature monitoring · CPC title

• H10P72/0436 Primary

  mainly by radiation · CPC title

• H10P72/0428

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• H10P54/00

  Cutting or separating of wafers, substrates or parts of devices · CPC title