Device and method for bonding
US-2024387202-A1 · Nov 21, 2024 · US
This page is not indexed by search engines while we improve data quality.
Fehkuhrer Andreas patents
Fehkuhrer Andreas is listed as an inventor on 21 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Fehkuhrer Andreas |
| Total patents | 21 |
| First publication | Nov 10, 2016 |
| Latest publication | Nov 21, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Method and device for bonding of substrates
US-11742205-B2 · Aug 29, 2023 · US
Method and device for bonding of substrates
US-2021343530-A1 · Nov 4, 2021 · US
Method and device for bonding of substrates
US-11101132-B2 · Aug 24, 2021 · US
Method and device for bonding of substrates
US-2020286733-A1 · Sep 10, 2020 · US
Method and device for bonding of substrates
US-10755929-B2 · Aug 25, 2020 · US
Method and device for bonding of substrates
US-10755930-B2 · Aug 25, 2020 · US
Method and device for bonding of substrates
US-2020203165-A1 · Jun 25, 2020 · US
Device and method for at least partly dissolving a connecting layer of a temporarily bonded substrate stack
US-10475672-B2 · Nov 12, 2019 · US
Method and device for bonding of substrates
US-2019148148-A1 · May 16, 2019 · US
Recent patents
Latest publications not already listed above.
Method and device for bonding two substrates
US-2019109034-A1 · Apr 11, 2019 · US
Substrate stack holder, container and method for parting a substrate stack
US-10049902-B2 · Aug 14, 2018 · US
Method and device for coating substrates
US-2018174832-A1 · Jun 21, 2018 · US
Substrate attachment for attaching a substrate thereto
US-2018096962-A1 · Apr 5, 2018 · US
Device and method for loosening a first substrate
US-9922862-B2 · Mar 20, 2018 · US
Method for bonding substrates
US-9859246-B2 · Jan 2, 2018 · US
Substrate stack holder, container and method for parting a substrate stack
US-2017316962-A1 · Nov 2, 2017 · US
Method for coating cavities of semiconductor substrates
US-9786487-B2 · Oct 10, 2017 · US
Method for coating cavities of semiconductor substrates
US-2016365241-A1 · Dec 15, 2016 · US
Method for bonding substrates
US-2016358881-A1 · Dec 8, 2016 · US
Device and method for loosening a first substrate
US-2016329235-A1 · Nov 10, 2016 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Ev Group E Thallner Gmbh | 21 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P72/0428 | 18 |
| H01L21/67092 | 16 |
| H10P10/128 | 11 |
| H10P72/0434 | 10 |
| H10P90/1914 | 8 |