Device and method for at least partly dissolving a connecting layer of a temporarily bonded substrate stack

Patent metadata

Field	Value
Publication number	US-10475672-B2
Application number	US-201515546679-A
Country	US
Kind code	B2
Filing date	Nov 3, 2015
Priority date	Feb 10, 2015
Publication date	Nov 12, 2019
Grant date	Nov 12, 2019

Abstract

A device and method for at least partial loosening of a connecting layer of a temporarily bonded substrate stack. The device has at least one ring, whereby the substrate stack can be placed within the at least one ring, the at least one ring having a plurality of nozzles. The nozzles are arranged distributed at least over a portion of the periphery of the at least one ring, the nozzles directed onto the connecting layer. The device sprays solvent from the nozzles onto an edge area of the connecting layer.

First claim

Having described the invention, the following is claimed:

1. A device for at least partial loosening of a connecting layer of a temporarily bonded substrate stack, the substrate stack having at least two substrates that are temporarily bonded to each other with the connecting layer, the device comprising:
a plurality of rings arranged one next to the other and vertically one above the other, each of said rings having an inner circumference and being equipped with a plurality of holding chucks extending inward from said inner circumference, said holding chucks being configured to receive and hold the substrate stack; and
a plurality of nozzles arranged at least over a portion of a periphery of each of the rings, each of the nozzles being directed toward the connecting layer of the substrate stack, each of the nozzles being configured to spray a solvent onto an edge area of the connecting layer.

2. The device according to claim 1 , wherein each of the nozzles has a diameter of 0.01 to 10 mm.

3. The device according to claim 1 , wherein each of the rings is equipped with a solvent line that is connected to the nozzles of the ring.

4. The device according to claim 1 , wherein the nozzles of each ring are spaced from one another over an entire periphery of the ring.

5. The device according to claim 4 , wherein the nozzles of each ring are evenly spaced from one another over the entire periphery of the ring.

6. The device according to claim 1 , wherein each of said rings has at least 60 of said nozzles.

7. The device according to claim 1 , wherein the holding chucks pivot.

8. The device according to claim 1 , wherein each of the holding chucks have at least one attaching pin for fastening the substrate stack thereto.

9. The device according to claim 1 , wherein the rings are installed in a closed chamber.

10. The device according to claim 1 , wherein the device has 2 to 30 of said rings arranged one above the other.

11. The device according to claim 1 , wherein the nozzles of each ring pivot with a degree of pivoting movement of 1° to 20°.

12. The device according to claim 11 , wherein the nozzles of each ring pivot in a horizontal plane.

13. The device according to claim 1 , further comprising:
a receiving system configured to transport the substrate stack to and/or away from each of said rings, said receiving system being further configured to move in a vertical direction.

14. A device for at least partial loosening of a connecting layer of a temporarily bonded substrate stack, the substrate stack having at least two substrates that are temporarily bonded to each other with the connecting layer, the device comprising:
a plurality of rings arranged one next to the other and vertically one above the other, an inside of each of said rings being dimensioned to receive the substrate stack; and
a plurality of nozzles arranged at least over a portion of a periphery of each of the rings, each of the nozzles being directed toward the connecting layer of the substrate stack, each of the nozzles being configured to spray a solvent onto an edge area of the connecting layer;
a receiving system configured to transport the substrate stack to and/or away from each of said rings, said receiving system being further configured to move in a vertical direction; and
one or more additional nozzles configured to clean a bottom of the substrate stack, said additional nozzles being located below the receiving system and/or in a lowermost ring, said additional nozzles pointing toward a direction of a center of the substrate stack.

15. The device according to claim 14 , wherein the device has 1 to 60 of said additional nozzles.

16. The device according to claim 14 , further comprising:
a plurality of attaching pins configured to secure the substrate stack during cleaning of the substrate stack.

17. The device according to claim 16 , wherein the device has 15 or less attaching pins.

18. A device for at least partial loosening of a connecting layer of a temporarily bonded substrate stack, the substrate stack having at least two substrates that are temporarily bonded to each other with the connecting layer, the device comprising:
a plurality of rings arranged one next to the other and vertically one above the other, an inside of each of said rings being dimensioned to receive the substrate stack;
a plurality of nozzles arranged at least over a portion of a periphery of each of the rings, each of the nozzles being directed toward the connecting layer of the substrate stack, each of the nozzles being configured to spray a solvent onto an edge area of the connecting layer; and
a pivoting arm with at least one nozzle for cleaning the substrate stack.

19. A method for at least partial loosening of a connecting layer of a temporarily bonded substrate stack, said substrate stack comprised of at least two substrates temporarily bonded to each other with the connecting layer, the method comprising:
placing the substrate stack inside a ring of a device comprised of a plurality of rings arranged one next to the other, each ring having a plurality of nozzles that are arranged at least over a portion of a periphery of the ring, wherein each of said nozzles receives a solvent;
directing the nozzles toward the connecting layer; and
spraying the solvent onto an edge area of the connecting layer.

Assignees

• Ev Group E Thallner Gmbh

Inventors

• Fehkuhrer Andreas

Classifications

• H10P72/7416

  used during dicing or grinding · CPC title

• H10P72/744

  Details of chemical or physical process used for separating the auxiliary support from a device or a wafer · CPC title

• H10P72/7402

  Wafer tapes, e.g. grinding or dicing support tapes · CPC title

• H10P72/3312

  Vertical transfer of a batch of workpieces · CPC title

• H10P72/0428 Primary

  Apparatus for mechanical treatment or grinding or cutting · CPC title