Structure stamp, device and method of embossing
US-2015217505-A1 · Aug 6, 2015 · US
Method for bonding substrates
US2016358881A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016358881-A1 |
| Application number | US-201414917318-A |
| Country | US |
| Kind code | A1 |
| Filing date | Dec 18, 2014 |
| Priority date | Dec 18, 2014 |
| Publication date | Dec 8, 2016 |
| Grant date | — |
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- Title
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Abstract
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A method for bonding a first substrate with a second substrate, characterized in that the first substrate and/or the second substrate is/are thinned before the bonding.
First claim
Opening claim text (preview).
1 . Method for bonding a first substrate to a second substrate, wherein the method comprises: thinning the first substrate and/or the second substrate; and bonding the first substrate to the second substrate after the thinning. 2 . Method according to claim 1 , wherein during the thinning, the first substrate and/or the second substrate is/are thinned to a thickness of less than 1,000 μm. 3 . Method according to claim 1 , wherein the method further comprises: attaching the first substrate and/or the second substrate to a carrier surface of a carrier for the thinning and/or the bonding. 4 . Method according to claim 1 , wherein the first substrate and the second substrate are at least partially congruent in shape and/or have similar geometric dimensions. 5 . Method according to claim 1 , wherein the method further comprises: aligning the first substrate and the second substrate with one another before bonding, said aligning based on corresponding alignment markings of the first and second substrates, and pre-attaching the first substrate to the second substrate after the aligning. 6 . Method according to claim 1 , wherein said method further comprises: attaching the first substrate and/or the second substrate to a respective substrate attachment for the thinning and/or the bonding, each substrate attachment including: a substrate attaching surface for attaching one of the first and second substrates, and a carrier attaching surface surrounding the substrate attaching surface for mutual attachment of the substrate attachments. 7 . Method according to claim 6 , wherein the carrier attaching surface is magnetized or is magnetizable. 8 . Method according to claim 3 , wherein said carrier is attached to a ring-shaped frame. 9 . Method according to claim 4 , wherein the first substrate and the second substrate are congruent in shape at least in relation to a cross-sectional surface that is parallel to a bonding surface of each of the first and second substrates. 10 . Method according to claim 5 , wherein the aligning of the first and second substrates is to an alignment accuracy of greater than 100 μm. 11 . Method according to claim 5 , wherein the pre-attaching of the first substrate to the second substrate uses magnetism.
Assignees
Inventors
Classifications
using vacuum · CPC title
Thickness · CPC title
- B32B38/1841Primary
during laying up · CPC title
Semiconductor wafers · CPC title
- B32B37/0046Primary
characterised by constructional aspects of the apparatus · CPC title
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- What does patent US2016358881A1 cover?
- A method for bonding a first substrate with a second substrate, characterized in that the first substrate and/or the second substrate is/are thinned before the bonding.
- Who is the assignee on this patent?
- Ev Group E Thallner Gmbh
- What technology area does this patent fall under?
- Primary CPC classification B32B38/1841. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Thu Dec 08 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).