Device and method for loosening a first substrate

Patent metadata

Field	Value
Publication number	US-9922862-B2
Application number	US-201415108027-A
Country	US
Kind code	B2
Filing date	Jan 28, 2014
Priority date	Jan 28, 2014
Publication date	Mar 20, 2018
Grant date	Mar 20, 2018

Abstract

A device for detaching a first substrate from a second substrate in a detaching direction (L) with: at least two elements guided crosswise to the detaching direction (L) and in a radial direction (R) to the first substrate for clamping the first substrate crosswise to the detaching direction (L), a substrate holding device for holding the second substrate, and detaching means for detaching the first substrate from the second substrate by moving the first substrate, attached by the clamping elements, in the detaching direction (L) and/or by moving the substrate holding device opposite to the detaching direction (L). In addition, this invention relates to a corresponding method.

First claim

Having described the invention, the following is claimed:

1. A device for detaching a carrier wafer from a product wafer in a detaching direction (L), said device comprising:
at least two clamping elements configured to move crosswise to the detaching direction (L) and in a radial direction (R) relative to the carrier wafer to clamp the carrier wafer crosswise to the detaching direction (L), wherein each of the clamping elements includes elastic contour-accommodating elements for accommodating and fixing an edge of the carrier wafer;
a substrate holding device for holding the product wafer, and
detaching means for detaching the carrier wafer from the product wafer by moving the substrate holding device in a direction opposite to the detaching direction (L).

2. The device according to claim 1 , further comprising drive means for moving the at least two clamping elements in the radial direction (R) and/or in the detaching direction (L).

3. The device according to claim 1 , wherein said two clamping elements are arranged radially opposite to each other.

4. The device according to claim 1 , wherein the clamping elements have an elastic face facing in the radial direction (R) toward the carrier wafer, said elastic face elastically yielding clamping of the carrier wafer.

5. The device according to claim 1 , wherein the substrate holding device is a rigid substrate holding device that receives an entire surface of the product wafer.

6. The device according to claim 1 , further comprising a clamping element holding device movable in the detaching direction (L), for holding and guiding the clamping elements.

7. The device according to claim 1 , further comprising an attaching element for partial attachment of the carrier wafer to the product wafer when detaching the carrier wafer.

8. The device according to claim 7 , wherein the partial attachment in an inside area is carried out on an attaching side of the carrier wafer facing away from the product wafer.

9. The device according to claim 7 , wherein the attaching element includes attaching means for attaching the carrier wafer to the attaching element.

10. The device according to claim 1 , further comprising drive means for moving the at least two clamping elements in the radial direction (R) and the detaching direction (L).

11. The device according to claim 1 , further comprising drive means for moving the at least two clamping elements in the radial direction (R).

12. A method for detaching a carrier wafer from a product wafer in a detaching direction (L), said method comprising:
holding the product wafer with a substrate holding device;
clamping the carrier wafer crosswise to the detaching direction (L), the clamping comprising:
guiding at least two clamping elements crosswise to the detaching direction (L) and in a radial direction (R) relative to the carrier wafer, and
accommodating and fixing an edge of the carrier wafer using elastic contour-accommodating elements of the clamping elements; and

detaching the carrier wafer from the product wafer, the detaching comprising moving the clamping elements in the detaching direction (L) and/or the substrate holding device opposite to the detaching direction (L).

13. The method according to claim 12 , further comprising moving the clamping elements in the radial direction (R) and in the detaching direction (L).

14. The method according to claim 12 , further comprising partially attaching the carrier wafer to the product wafer by attaching means of an attaching element during detaching the carrier wafer with a counterforce (G 2 ) directed opposite to the detaching direction (L).

15. The method according to claim 14 , wherein the partial attachment in an inside area is carried out on an attaching side of the carrier wafer facing away from the product wafer.

16. The method according to claim 12 , further comprising moving the clamping elements in the radial direction (R) and the detaching direction (L).

17. The method according to claim 12 , further comprising moving the clamping elements in the radial direction (R).

18. A device for detaching a carrier wafer from a product wafer in a detaching direction (L), said device comprising:
a plurality of radially arranged clamping elements, the clamping elements being respectively configured to move crosswise to the detaching direction (L) in a radial direction (R) to clamp corresponding peripheral edges of the carrier wafer, each of the clamping elements including elastic contour-accommodating elements configured to accommodate and fix the corresponding peripheral edge of the carrier wafer;
a substrate holding device for holding the product wafer; and
detaching means for detaching the carrier wafer from the product wafer by moving the substrate holding device in a direction opposite to the detaching direction (L).

19. The device according to claim 18 , further comprising a controller configured to control movement of said clamping elements to clamp said corresponding peripheral edges of the carrier wafer.

20. The device according to claim 19 , wherein said controller is further configured to control said movement of said clamping elements individually.

Assignees

• Ev Group E Thallner Gmbh

Inventors

• Fehkuhrer Andreas

Classifications

• H10P72/7442

  Separation by peeling · CPC title

• H10P72/0428 Primary

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• H10P56/00

  Debonding of wafers, substrates or parts of devices · CPC title

• H10P72/7608 Primary

  characterised by a plurality of separate clamping members, e.g. clamping fingers · CPC title

• Y10T156/1944

  Vacuum delaminating means [e.g., vacuum chamber, etc.] · CPC title