Method for coating cavities of semiconductor substrates

Patent metadata

Field	Value
Publication number	US-9786487-B2
Application number	US-201515118914-A
Country	US
Kind code	B2
Filing date	Jan 9, 2015
Priority date	Mar 26, 2014
Publication date	Oct 10, 2017
Grant date	Oct 10, 2017

Abstract

A method for temporary coating of cavities, which at least partially run through a semiconductor substrate and are provided for a permanent coating and/or equipping, with a temporarily applied coating material before processing steps for processing at least one surface of the semiconductor substrate. In addition, a method for removing a temporary coating of cavities of a semiconductor substrate, whereby the coating is applied according to a previously-mentioned method and whereby, in particular immediately afterwards, a permanent coating and/or equipping of the cavities is carried out.

First claim

Having described the invention, the following is claimed:

1. A method for temporarily coating a semiconductor substrate having at least one substrate surface and one or more cavity surfaces that define cavities formed in the semiconductor substrate, said method comprising:
applying a temporary coating material to the semiconductor substrate before performing processing steps for processing the at least one substrate surface,
wherein the temporary coating material applied to the semiconductor substrate includes (i) a high-adhesive part, which removably adheres to the one or more cavity surfaces, and (ii) a low-adhesive part, which faces interior regions of the cavities and thus comes into contact with contaminants.

2. The method according to claim 1 , wherein the step of applying the temporary coating material to the semiconductor substrate includes applying the temporary coating material at least to an inner periphery surface and a base surface of the cavity surfaces, said temporary coating material applied with a coating thickness (d) that is smaller than half a mean diameter (D) of each of the cavities.

3. The method according to claim 1 , wherein the step of applying the temporary coating material to the semiconductor substrate includes applying the temporary coating material to intermediate surfaces of the substrate surfaces, said intermediate surfaces extending between the cavities.

4. The method according to claim 3 , wherein the method further comprises:
removing the temporary coating material from the intermediate surfaces after applying the temporary coating material to the semiconductor substrate, without removing the temporary coating material applied to the one or more cavity surfaces.

5. The method according to claim 4 , wherein the temporary coating material is removed from the intermediate surfaces by centrifuging.

6. The method according to claim 1 , further comprising:
cleaning the semiconductor substrate after performing the processing steps for processing the at least one substrate surface.

7. The method according to claim 1 , furthered comprising:
removing the temporary coating material from the cavities after performing the processing steps for process the at least one substrate surface; and
immediately after the removing of the coating materials, permanently coating the one or more cavity surfaces and/or equipping the cavities.

8. The method according to claim 6 , wherein the method further comprises removing the temporary coating material after cleaning the semiconductor substrate.

9. The method according to claim 7 , wherein the temporary coating material is removed by introducing the coated semiconductor substrate into a solvent bath filled with a solvent for dissolving the temporary coating material.

10. The method according to claim 9 , wherein the semiconductor substrate is exposed to ultrasound in the solvent bath.

11. The method according to claim 4 , wherein the temporary coating material is completely removed from the intermediate surfaces.

12. The method according to claim 5 , wherein the temporary coating material is removed from the intermediate surfaces by centrifuging in connection with applying a solvent for at least partially dissolving the temporary coating material.

13. The method according to claim 7 , wherein the temporary coating material is removed after cleaning of the semiconductor substrate.

14. The method according to claim 13 , wherein the temporary coating material is removed by introducing the coated semiconductor substrate into a solvent bath filled with a solvent for dissolving the temporary coating material.

15. The method according to claim 14 , wherein the semiconductor substrate is exposed to ultrasound in the solvent bath.

16. The method according to claim 1 , wherein the cavities are recesses.

17. The method according to claim 1 , wherein the cavities are vias.

18. The method according to claim 17 , wherein each via is one of the following: a bore hole, a clearance hole, or a contact hole.

19. The method according to claim 13 , wherein the temporary coating material is removed by plasma.

20. The method according to claim 1 , wherein an energy per unit of surface area of the high-adhesive part that is needed to separate the high-adhesive part from the one or more cavity surfaces is greater than 0.00001 J/m 2 , and
wherein an energy per unit of surface area of the low-adhesive part at which the low-adhesive part adheres to the contaminants is less than 2.5 J/m 2 .

Assignees

• Ev Group E Thallner Gmbh

Inventors

• Fehkuhrer Andreas

Classifications

• H10W20/023

  the interconnections being through-semiconductor vias · CPC title

• H10W20/0245

  comprising use of blind vias during the manufacture · CPC title

• H10W20/0265

  characterised by the sidewall insulation · CPC title

• H10P70/20 Primary

  Cleaning during device manufacture · CPC title

• B08B5/00

  Cleaning by methods involving the use of air flow or gas flow (cleaning hollow articles by methods or apparatus specially adapted thereto B08B9/00) · CPC title