Method for bonding substrates

Patent metadata

Field	Value
Publication number	US-9859246-B2
Application number	US-201414917318-A
Country	US
Kind code	B2
Filing date	Dec 18, 2014
Priority date	Dec 18, 2014
Publication date	Jan 2, 2018
Grant date	Jan 2, 2018

Abstract

A method for bonding a first substrate with a second substrate, characterized in that the first substrate and/or the second substrate is/are thinned before the bonding.

First claim

Having described the invention, the following is claimed:

1. A method for bonding a first substrate to a second substrate, the method comprising:
thinning the first substrate and/or the second substrate;
prior to or after the thinning, fixing the first substrate and/or the second substrate to surfaces of respective elastically deformable carriers; and
after the fixing and the thinning, bonding the first substrate to the second substrate by deforming at least one of the carriers,
wherein a frame is disposed on each of the carrier surfaces,
wherein an upper surface of the frame defines a carrier attaching surface,
wherein each of the fixed first and/or second substrates has a side that faces away the carrier surface, and
wherein, relative to the carrier surface, a height of the side of the fixed first and/or second substrates is less than a height of the carrier attaching surface.

2. The method according to claim 1 , wherein, during the thinning, the first substrate and/or the second substrate is/are thinned to a thickness of less than 1,000 μm.

3. The method according to claim 1 , wherein the first substrate and the second substrate are at least partially congruent in shape and/or have similar geometric dimensions.

4. The method according to claim 1 , further comprising:
aligning the first substrate and the second substrate with one another before the bonding, said aligning based on corresponding alignment markings of the first and second substrates; and
pre-attaching the first substrate to the second substrate after the aligning and before the bonding.

5. The method according to claim 1 , wherein said elastically deformable carriers are respectively included in substrate attachments to which said first substrate and/or said second substrate are respectively attached prior to or after the thinning, and
wherein the substrate attachments respectively have substrate attaching surfaces, the substrate attaching surfaces being configured to respectively attach said first and/or second substrates, and
wherein said carrier attaching surfaces respectively surround the substrate attaching surfaces, said carrier attaching surfaces being configured to mutually attach the substrate attachments.

6. The method according to claim 1 , wherein the carrier attaching surfaces are magnetized.

7. The method according to claim 1 , wherein said carriers are respectively attached to ring-shaped frames.

8. The method according to claim 3 , wherein the first substrate and the second substrate are congruent in shape at least in relation to a cross-sectional surface that is parallel to a bonding surface of each of the first and second substrates.

9. The method according to claim 4 , wherein the aligning of the first and second substrates is to an alignment accuracy of greater than 100 μm.

10. The method according to claim 4 , wherein the pre-attaching of the first substrate to the second substrate is performed magnetically.

11. The method according to claim 1 , wherein the carriers are respectively stretched over frames of substrate attachments that respectively comprise said carriers.

12. The method according to claim 1 , wherein the carriers are respectively comprised of elastic films.

13. The method according to claim 1 , wherein the bonding comprises applying a centrically-oriented pressure to at least one of the carriers to respectively bring at least one of the thinned and fixed substrates toward another one of the thinned and fixed substrates, the applying of the pressure serving to deform the at least one of the carriers.

14. The method according to claim 13 , wherein the centrically-oriented pressure is applied by pins.

15. The method according to claim 13 , wherein the centrically-oriented pressure is applied by mandrels.

Assignees

• Ev Group E Thallner Gmbh

Inventors

• Fehkuhrer Andreas

Classifications

• B32B2309/105

  Thickness · CPC title

• B32B38/1858

  using vacuum · CPC title

• B32B38/1841 Primary

  during laying up · CPC title

• B32B37/0046 Primary

  characterised by constructional aspects of the apparatus · CPC title

• B32B2457/14

  Semiconductor wafers · CPC title