Method for producing a rolling bearing component
US-12546361-B2 · Feb 10, 2026 · US
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Dinkel Markus patents
Dinkel Markus is listed as an inventor on 53 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Dinkel Markus |
| Total patents | 53 |
| First publication | Mar 5, 2015 |
| Latest publication | Feb 10, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor package with hybrid interconnect clip
US-2025286011-A1 · Sep 11, 2025 · US
Package with component-carrying intermediate structure and additional carrier having reference potential structure
US-2025218914-A1 · Jul 3, 2025 · US
Method for producing rolling bearing components with a high degree of toughness
US-2025178066-A1 · Jun 5, 2025 · US
Method of manufacturing a package using a clip having at least one locking recess
US-12308339-B2 · May 20, 2025 · US
Method for producing a rolling element bearing component, rolling element bearing component, and rolling element bearing
US-2024279762-A1 · Aug 22, 2024 · US
Semiconductor device having a carrier, semiconductor chip packages mounted on the carrier and a cooling element
US-11915999-B2 · Feb 27, 2024 · US
Method for producing a rolling bearing component
US-2024060531-A1 · Feb 22, 2024 · US
Treatment method and process for valve seat
US-2023407425-A1 · Dec 21, 2023 · US
Method Of Manufacturing A Package Using A Clip Having At Least One Locking Recess
US-2023387068-A1 · Nov 30, 2023 · US
Recent patents
Latest publications not already listed above.
Method of fabricating a semiconductor package
US-11776882-B2 · Oct 3, 2023 · US
Clip having locking recess for connecting an electronic component with a carrier in a package
US-11728309-B2 · Aug 15, 2023 · US
Semiconductor chip, chip system, method of forming a semiconductor chip, and method of forming a chip system
US-2023230903-A1 · Jul 20, 2023 · US
Semiconductor device having a carrier, semiconductor chip packages mounted on the carrier and a cooling element
US-2023187326-A1 · Jun 15, 2023 · US
Semiconductor Packages and Methods for Manufacturing Thereof
US-2023095545-A1 · Mar 30, 2023 · US
Plurality of transistor packages with exposed source and drain contacts mounted on a carrier
US-11600558-B2 · Mar 7, 2023 · US
Method of fabricating a semiconductor package
US-2022230941-A1 · Jul 21, 2022 · US
Leadframe leads having fully plated end faces
US-11342252-B2 · May 24, 2022 · US
Semiconductor package and method of fabricating a semiconductor package
US-11302610-B2 · Apr 12, 2022 · US
Semiconductor package including a cavity in its package body
US-2021035876-A1 · Feb 4, 2021 · US
Method of producing an SMD package with top side cooling
US-10903133-B2 · Jan 26, 2021 · US
Leadframe leads having fully plated end faces
US-2021020553-A1 · Jan 21, 2021 · US
Clip Having Locking Recess
US-2020365549-A1 · Nov 19, 2020 · US
Electronic module having an electrically insulating structure with material having a low modulus of elasticity
US-10813229-B2 · Oct 20, 2020 · US
Chip Package, Method of Forming a Chip Package, Semiconductor Device, Semiconductor Arrangement, Three-Phase-System, Method of Forming a Semiconductor Device, and Method of Forming a Semiconductor Arrangement
US-2020328141-A1 · Oct 15, 2020 · US
Leadframe leads having fully plated end faces
US-10796986-B2 · Oct 6, 2020 · US
SMD package with flat contacts to prevent bottleneck
US-10699987-B2 · Jun 30, 2020 · US
Method of Producing an SMD Package with Top Side Cooling
US-2020144150-A1 · May 7, 2020 · US
Semiconductor Package and Method of Fabricating a Semiconductor Package
US-2020135619-A1 · Apr 30, 2020 · US
SMD package with top side cooling
US-10566260-B2 · Feb 18, 2020 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Ag | 38 |
| Infineon Technologies Austria Ag | 10 |
| Schaeffler Technologies Ag | 5 |
| Tinfineon Tech Austria Ag | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W74/111 | 26 |
| H10W90/756 | 22 |
| H10W90/736 | 21 |
| H10W72/073 | 20 |
| H10W72/926 | 18 |