Method of manufacturing a package using a clip having at least one locking recess

Patent metadata

Field	Value
Publication number	US-12308339-B2
Application number	US-202318366843-A
Country	US
Kind code	B2
Filing date	Aug 8, 2023
Priority date	May 16, 2019
Publication date	May 20, 2025
Grant date	May 20, 2025

Abstract

A method of manufacturing a package includes: connecting an electronic component with a carrier by a clip having at least one locking recess; partially encapsulating the clip by an encapsulant so that at least part of a main surface of the clip remains partially exposed with respect to the encapsulant; and locking the encapsulant and the clip by accommodating material of the encapsulant in the at least one locking recess.

First claim

What is claimed is:

1. A method of manufacturing a package, the method comprising:
connecting an electronic component with a carrier by a clip having at least one locking recess;
partially encapsulating the clip by an encapsulant so that at least part of a main surface of the clip remains partially exposed with respect to the encapsulant; and
locking the encapsulant and the clip by accommodating material of the encapsulant in the at least one locking recess,
wherein the at least one locking recess comprises a central recess between two lateral recesses,
wherein the central recess is formed by at least one of an embossing process, a stamping process, and a punching process,
wherein after forming the central recess, the two lateral recesses are formed by at least one of a vertical embossing process, a vertical stamping process, and a vertical punching process, thereby side punching the central recess such that at least part of the central recess is provided with an undercut, and
wherein the locking between the encapsulant and the clip is increased in a region of the undercut.

2. The method of claim 1 , wherein the central recess having the undercut is dovetail shaped and/or V-shaped, and wherein the two lateral recesses have straight side walls.

3. The method of claim 1 , wherein the at least one locking recess is formed in a surface portion of the clip that faces towards the carrier.

4. The method of claim 1 , wherein the at least one locking recess is formed in a surface portion of the clip that faces away from the carrier.

5. A method of manufacturing a package, the method comprising:
connecting an electronic component with a carrier by a component connection portion of a clip and connecting a carrier connection portion of the clip with the carrier, the clip having a plurality of parallel locking grooves formed only in a first surface portion of the clip that faces the carrier in a region of the clip interposed between the component connection portion and the carrier connection portion;
partially encapsulating the clip by an encapsulant so that at least part of a main surface of the clip remains partially exposed with respect to the encapsulant; and
locking the encapsulant and the clip by accommodating material of the encapsulant in the plurality of parallel locking grooves.

6. The method of claim 5 , wherein the plurality of parallel locking grooves is grouped into sets of locking grooves, and wherein each of the sets of locking grooves corresponds to an assigned dimension of a different electronic component such that the clip is a multipurpose clip usable for electronic components of different sizes.

7. The method of claim 6 , wherein each of the sets of locking grooves has three parallel locking grooves that correspond to one assigned chip size.

8. The method of claim 6 , wherein each of the sets of locking grooves has a central locking groove between two lateral locking grooves.

9. The method of claim 8 , wherein the central locking groove is wider than the two lateral locking grooves.

10. The method of claim 8 , wherein the central locking groove has side walls with tapering sections and straight sections, and wherein the two lateral locking grooves have fully straight side walls.

11. The method of claim 5 , wherein the clip has at least one further locking groove formed only in a surface portion of the clip that faces away from the carrier.

Assignees

• Infineon Technologies Ag

Inventors

• Levardo Melvin
• Alinea Ryan Ross Agbay
• Dinkel Markus

Classifications

• H10W72/851

  Dispositions of multiple connectors or interconnections · CPC title

• H10W72/07652

  changes in structures or sizes · CPC title

• H10W72/627

  Multiple strap connectors having different structures or shapes · CPC title

• H10W72/534

  being rectangular · CPC title

• H10W90/766

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title