Clip having locking recess for connecting an electronic component with a carrier in a package

Patent metadata

Field	Value
Publication number	US-11728309-B2
Application number	US-202016875258-A
Country	US
Kind code	B2
Filing date	May 15, 2020
Priority date	May 16, 2019
Publication date	Aug 15, 2023
Grant date	Aug 15, 2023

Abstract

A clip for connecting an electronic component with a carrier in a package is provided. The clip includes a clip body having a component connection portion configured to be connected with the electronic component to be mounted on the carrier, and a carrier connection portion configured to be connected with the carrier. The clip further includes at least one locking recess in a surface portion of the clip body, the surface portion being configured to face the carrier. The at least one locking recess is configured to accommodate material of an encapsulant of the package so as to lock the encapsulant and the clip. A corresponding method of manufacturing the package is also provided.

First claim

What is claimed is:

1. A clip for connecting an electronic component with a carrier in a package, the clip comprising:
a clip body comprising:
a component connection portion configured to be connected with the electronic component to be mounted on the carrier; and
a carrier connection portion configured to be connected with the carrier;
a first surface portion configured to face the carrier;
a second surface portion configured to face away from the carrier; and
a plurality of parallel locking grooves formed only in the first surface portion of the clip body in a region of the clip body interposed between the component connection portion and the carrier connection portion,

wherein the plurality of parallel locking grooves is configured to accommodate material of an encapsulant of the package so as to lock the encapsulant and the clip.

2. The clip of claim 1 , further comprising at least one further locking groove formed only in the second surface portion of the clip body.

3. The clip of claim 1 , wherein at least part of at least one of the plurality of parallel locking grooves has an undercut.

4. The clip of claim 1 , wherein at least one of the plurality of parallel locking grooves and/or material of the clip body between two adjacent locking ones of the locking grooves has a dovetail shape.

5. The clip of claim 1 , wherein the plurality of parallel locking grooves is formed as a groove array comprising a central groove between two other grooves of the groove array.

6. The clip of claim 5 , wherein the central groove has a larger width than each of the two other grooves of the groove array.

7. The clip of claim 5 , wherein the central groove has at least partially tapering side walls, and wherein the two other grooves of the groove array have straight side walls.

8. The clip of claim 1 , wherein at least one of a depth and a width of the plurality of parallel locking grooves is in a range between 20 μm and 200 μm.

9. The clip of claim 1 , wherein a thickness of the clip body is in a range between 200 μm and 1 mm.

10. The clip of claim 1 , wherein the plurality of parallel locking grooves comprises a central groove between two other grooves of the groove array, and wherein at least part of the central groove has an undercut.

11. The clip of claim 1 , wherein the plurality of parallel locking grooves is grouped into sets of locking grooves, and wherein each of the sets of locking grooves corresponds to an assigned dimension of a different electronic component such that the clip is a multipurpose clip usable for electronic components of different sizes.

12. The clip of claim 11 , wherein each of the sets of locking grooves has three parallel locking grooves that correspond to one assigned chip size.

13. The clip of claim 11 , wherein each of the sets of locking grooves has a central locking groove between two lateral locking grooves.

14. The clip of claim 13 , wherein the central locking groove is wider than the two lateral locking grooves.

15. The clip of claim 13 , wherein the central locking groove has side walls with tapering sections and straight sections, and wherein the two lateral locking grooves have fully straight side walls.

16. A package, comprising:
a clip configured to connect an electronic component with a carrier and having a plurality of parallel locking grooves in a region of the clip interposed between a component connection portion of the clip configured to be connected with the electronic component to be mounted on the carrier and a carrier connection portion of the clip configured to be connected with the carrier; and
an encapsulant partially encapsulating the clip so that the clip remains partially exposed with respect to the encapsulant,
wherein material of the encapsulant is accommodated in the plurality of parallel locking grooves so as to lock the encapsulant and the clip,
wherein the plurality of parallel locking grooves is formed only in a surface portion of the clip configured to face towards the carrier.

17. The package of claim 16 , further comprising at least one further locking groove formed only in a surface portion of the clip configured to face away from the carrier.

18. The package of claim 16 , wherein the package further comprises the electronic component, and wherein the electronic component is at least partially encapsulated in the encapsulant and connected with a component connection portion of the clip.

19. The package of claim 18 , wherein the package further comprises the carrier on which the electronic component is mounted, and wherein the carrier is partially encapsulated in the encapsulant and connected with a carrier connection portion of the clip.

20. The package of claim 18 , wherein at least one connection selected from the group consisting of a connection between the electronic component and the carrier, a connection between the electronic component and the clip, and a connection between the carrier and the clip, is formed by a connection medium.

21. The package of claim 20 , wherein the connection medium is accommodated in the plurality of parallel locking grooves, and wherein the connection medium is selected from the group consisting of a solder structure, a sinter structure, a welding structure, and a glue structure.

Assignees

• Infineon Technologies Ag

Inventors

• Levardo Melvin
• Alinea Ryan Ross Agbay
• Dinkel Markus

Classifications

• H10W72/851

  Dispositions of multiple connectors or interconnections · CPC title

• H10W72/07652

  changes in structures or sizes · CPC title

• H10W72/627

  Multiple strap connectors having different structures or shapes · CPC title

• H10W72/534

  being rectangular · CPC title

• H10W90/766

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title