Substrate for pattern formation
US-11898008-B2 · Feb 13, 2024 · US
by cathodic sputtering
by cathodic sputtering · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K3/16 |
| Official title | by cathodic sputtering |
| Display label | by cathodic sputtering |
| Total patents | 173 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly growing.
| Year | Patents |
|---|---|
| 2015 | 18 |
| 2016 | 19 |
| 2017 | 16 |
| 2018 | 24 |
| 2019 | 13 |
| 2020 | 11 |
| 2021 | 8 |
| 2022 | 10 |
| 2023 | 8 |
| 2024 | 26 |
| 2025 | 17 |
| 2026 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Electrically-conductive structure and a production method therefor
US-10051727-B2 · Aug 14, 2018 · US
Light emitting diode (LED) packages and related methods
US-10043960-B2 · Aug 7, 2018 · US
Through wiring substrate
US-9930779-B2 · Mar 27, 2018 · US
High-sensitivity sensor comprising conductive thin film containing cracks and method for manufacturing same
US-9927311-B2 · Mar 27, 2018 · US
Circuit board and method of forming same
US-2018054899-A1 · Feb 22, 2018 · US
Warpage control with intermediate material
US-9867284-B2 · Jan 9, 2018 · US
Circuit board with via capacitor structure and manufacturing method for the same
US-2017367183-A1 · Dec 21, 2017 · US
Conductive pattern laminate and electronic device comprising same
US-9841857-B2 · Dec 12, 2017 · US
Through wiring substrate
US-2017318675-A1 · Nov 2, 2017 · US
Opto-electric hybrid board
US-2017315316-A1 · Nov 2, 2017 · US
Method of making an electronic device having a thin film resistor formed on an LCP solder mask and related devices
US-9795039-B2 · Oct 17, 2017 · US
Electrically-conductive structure and a production method therefor
US-2017238413-A1 · Aug 17, 2017 · US
Printed wiring board
US-9736945-B2 · Aug 15, 2017 · US
System and method of forming electrical interconnects
US-2017223828-A1 · Aug 3, 2017 · US
Substrate processing device
US-2017204510-A1 · Jul 20, 2017 · US
Elastic flexible substrate and method for manufacturing the same
US-9699893-B2 · Jul 4, 2017 · US
Flexible hybrid substrate for display and method for manufacturing same
US-2017171968-A1 · Jun 15, 2017 · US
Method of patterning a metal on a transparent conductor
US-2017135229-A1 · May 11, 2017 · US
Patterned conductive structure and method for forming the same
US-9595754-B2 · Mar 14, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H05K3/16?
- CPC H05K3/16 is the Cooperative Patent Classification code for “by cathodic sputtering.”
- How many patents are filed under CPC H05K3/16 (by cathodic sputtering)?
- Our database includes 173 publications tagged with this CPC code.
- Is patent activity under CPC H05K3/16 growing?
- Publication counts under this code: 26 in 2024 vs 17 in 2025 (latest complete years).