Method of making an electronic device having a thin film resistor formed on an LCP solder mask and related devices

Patent metadata

Field	Value
Publication number	US-9795039-B2
Application number	US-201615346043-A
Country	US
Kind code	B2
Filing date	Nov 8, 2016
Priority date	Sep 19, 2014
Publication date	Oct 17, 2017
Grant date	Oct 17, 2017

Abstract

A method of making an electronic device may include forming at least one circuit layer that includes solder pads on a substrate and forming at least one liquid crystal polymer (LCP) solder mask having mask openings therein. The method may also include forming at least one thin film resistor on the LCP solder mask and coupling the at least one LCP solder mask to the substrate so that the at least one thin film resistor is coupled to the at least one circuit layer and so that the solder pads are aligned with the mask openings.

First claim

That which is claimed is:

1. An electronic device comprising:
a substrate having opposing first and second major surfaces;
a plurality of circuit layers each comprising a plurality of solder pads carried by a respective one of the first and second major surfaces of said substrate, each of said plurality of solder pads carried by the first major surface being vertically aligned with respective ones of said plurality of solder pads carried by the second major surface;
a plurality of liquid crystal polymer (LCP) solder masks each carried by a respective one of the first and second major surfaces of said substrate, each LCP solder mask having a plurality of mask openings extending between first and second major surfaces thereof; and
at least one thin film resistor carried by at least one of said plurality of LCP solder masks;
each LCP solder mask being directly coupled to the substrate without an adhesive layer so that said at least one thin film resistor is directly coupled to said at least one circuit layer and so that said plurality of solder pads is aligned with the plurality of mask openings.

2. The electronic device of claim 1 wherein at least one of said plurality of LCP solder masks is coupled to said substrate so that said at least one thin film resistor is sandwiched between said at least one of the plurality of LCP solder masks and said substrate.

3. The electronic device of claim 1 wherein said at least one thin film resistor comprises at least one thin film resistor on each of said plurality of LCP solder masks; and wherein each of said plurality of LCP solder masks are coupled to the opposing surfaces of said substrate.

4. The electronic device of claim 1 wherein each LCP solder mask is coupled to a respective one of the surfaces of said substrate so that said plurality of thin film resistors is sandwiched between the plurality of LCP solder masks and the substrate.

5. The electronic device of claim 1 further comprising a circuit component coupled to corresponding solder pads of said plurality thereof.

6. The electronic device of claim 1 further comprising at least one electrically conductive via through said substrate.

7. The electronic device of claim 1 wherein said substrate comprises an LCP substrate.

8. The electronic device of claim 1 wherein said substrate comprises a flexible printed circuit board (PCB).

Assignees

• Harris Corp

Inventors

• Rendek Jr Louis Joseph

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/20

  Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps · CPC title

• H10W72/50

  Bond wires · CPC title

• H05K3/3452 Primary

  Solder masks · CPC title

• H05K1/181

  associated with surface mounted components · CPC title