Light emitting diode (LED) packages and related methods

Patent metadata

Field	Value
Publication number	US-10043960-B2
Application number	US-201113296812-A
Country	US
Kind code	B2
Filing date	Nov 15, 2011
Priority date	Nov 15, 2011
Publication date	Aug 7, 2018
Grant date	Aug 7, 2018

Abstract

Light emitting diode (LED) packages and methods are disclosed herein. In one aspect, a light emitting package is disclosed. The light emitting package includes one or more areas of conductive material having a thickness of less than approximately 50 microns (μm). The package can further include at least one light emitting diode (LED) electrically connected to the conductive material and at least one thin gap disposed between areas of conductive material.

First claim

What is claimed is:

1. A light emitting package comprising:
a first area and a second area of conductive material; and
a plurality of light emitting diode (LED) chips electrically connected to one or more of the first and second areas of conductive material,
wherein the first and second areas are each divided into a plurality of interlocked traces via a plurality of gaps,
wherein the first area is substantially circular,
wherein the second area is substantially ring shaped and is disposed outside a circumference of the first area,
wherein each trace of the plurality of traces comprises a substantially uniform thickness of approximately 25 microns (μm) or less, and
wherein each gap of the plurality of gaps comprises a width that is approximately equal to the thickness of each trace of the plurality of traces.

2. The light emitting package of claim 1 , further comprising a submount, the submount comprising a ceramic material.

3. The light emitting package of claim 2 , wherein the ceramic material comprises aluminum nitride (AlN).

4. The light emitting package of claim 1 , wherein the conductive material comprises copper (Cu).

5. The light emitting package of claim 1 , wherein each gap of the plurality of gaps comprises a depth approximately equal to the thickness of the plurality of traces.

6. The light emitting package of claim 1 , wherein the first and second areas of conductive material comprise a thickness of approximately 20 μm.

7. The light emitting package of claim 2 , wherein the first and second areas of conductive material cover approximately 70 percent (%) or more of a surface area of the submount.

8. The light emitting package of claim 1 , wherein the first and second areas of conductive material comprise a thickness of approximately 10 μm or less.

9. The light emitting package of claim 8 , wherein each gap comprises a depth of approximately 10 μm or less.

10. The light emitting package of claim 1 , wherein the first and second areas of conductive material comprise a range of thickness from approximately 3 μm to approximately 5 μm.

11. The light emitting package of claim 10 , wherein each gap comprises a depth ranging from approximately 3 μm to approximately 5 μm.

12. The light emitting package of claim 1 , wherein a reflective material is at least partially disposed over the first and second areas of conductive material.

13. The light emitting package of claim 12 , wherein the reflective material comprises silver (Ag).

14. The light emitting package of claim 1 , wherein each gap comprises a width of approximately 4 to 100 percent (%) of the thickness of each LED chip.

15. The light emitting package of claim 1 , wherein each gap comprises a width of less than approximately 25 percent (%) of the length of each LED chip.

16. The light emitting package of claim 1 , wherein each gap comprises a width of less than approximately 20 percent (%) of the width of each LED chip.

17. The light emitting package of claim 1 , further comprising electrically conductive vias.

18. A light emitting package comprising:
a ceramic submount;
at least a first electrically conductive trace and a second electrically conductive trace disposed on and contacting the submount, wherein each of the first and second traces comprises a substantially uniform thickness measuring approximately 25 microns (μm) or less, the second trace comprising an outer portion in a substantially ring shape disposed outside a periphery of the first trace;
one or more light emitting diodes (LEDs) at least partially disposed over the first trace; and
at least one gap disposed between the first and second traces, the gap comprising a width measuring approximately 25 μm or less,
wherein the first trace is divided into a plurality of interlocked traces via the at least one gap.

19. The light emitting package of claim 18 , wherein the ceramic submount comprises aluminum nitride (AlN).

20. The light emitting package of claim 18 , wherein the gap comprises a depth approximately equal to the thickness of the first and second traces.

21. The light emitting package of claim 18 , wherein the first and second traces comprise a thickness of approximately 20 μm.

22. The light emitting package of claim 18 , comprising a plurality of LEDs disposed over some of the traces.

23. The light emitting package of claim 18 , wherein the first and second traces comprise a thickness of approximately 10 μm or less.

24. The light emitting package of claim 23 , wherein the gap comprises a depth of approximately 10 μm or less.

25. The light emitting package of claim 18 , wherein the first and second traces comprise a range of thickness from approximately 3 μm to approximately 5 μm.

26. The light emitting package of claim 25 , wherein the gap comprises a depth ranging from approximately 3 μm to approximately 5 μm.

27. The light emitting package of claim 18 , wherein a reflective material is at least partially disposed over the first and second traces.

28. The light emitting package of claim 27 , wherein the reflective material comprises silver (Ag).

29. The light emitting package of claim 18 , wherein the first and second traces comprise copper (Cu).

30. The light emitting package of claim 18 , wherein the gap width ranges from approximately 4 to 100 percent (%) of a thickness of the one or more LEDs.

31. The light emitting package of claim 18 , wherein the gap width is less than approximately 25 percent (%) of a length of the one or more LEDs.

32. The light emitting package of claim 18 , wherein the gap width is less than approximately 20 percent (%) of a width of the one or more LEDs.

33. The light emitting package of claim 18 , further comprising electrically conductive vias.

Assignees

• Andrews Peter Scott
• Britt Jeffrey Carl
• Cree Inc

Inventors

• Andrews Peter Scott
• Britt Jeffrey Carl

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/00 Primary

  Package configurations · CPC title

• H10W40/255

  having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates · CPC title

• H10W72/5363

  the connected ends being wedge-shaped · CPC title

• H10W72/536

  the connected ends being ball-shaped · CPC title