Electrically-conductive structure and a production method therefor

Patent metadata

Field	Value
Publication number	US-10051727-B2
Application number	US-201615098775-A
Country	US
Kind code	B2
Filing date	Apr 14, 2016
Priority date	Mar 4, 2011
Publication date	Aug 14, 2018
Grant date	Aug 14, 2018

Abstract

An exemplary embodiment of the present invention relates to a conductive structure body that comprises a darkening pattern layer having AlOxNy, and a method for manufacturing the same. The conductive structure body according to the exemplary embodiment of the present invention may prevent reflection by a conductive pattern layer without affecting conductivity of the conductive pattern layer, and improve a concealing property of the conductive pattern layer by improving absorbance. Accordingly, a display panel having improved visibility may be developed by using the conductive structure body according to the exemplary embodiment of the present invention.

First claim

The invention claimed is:

1. A conductive structure body, comprising:
a substrate;
a conductive pattern layer; and
a darkening pattern layer comprising:
a dielectric material, and
AlOxNy (x >0, y >0) satisfying the following Equation 1,

1
<

(
Al
)

⁢
at
×
3

(
0
)

⁢
at
×
2

+

(
N
)

⁢
at
×
3

<
2

[

Equation
⁢

⁢
1

]

 wherein x and y mean ratios of numbers of O and N atoms to one Al atom, respectively, in AlOxNy, and (Al)at represents an atomic content (at %) of Al, (O)at represents an atomic content (at %) of O, and (N)at represents an atomic content (at %) of N based on 100% of a content of all atoms represented by AlOxNy in Equation 1,
wherein an extinction coefficient k of the conductive structure body is 0.2 or more and 1.5 or less, and
wherein the dielectric material is provided in an amount that gradually decreases as the dielectric material becomes more distant from an incident external light.

2. The conductive structure body according to claim 1 ,
wherein an extinction coefficient k of the conductive structure body is 0.2 or more and 0.8 or less.

3. The conductive structure body according to claim 1 ,
wherein a refractive index of the conductive structure body is 0 or more and 3 or less.

4. The conductive structure body according to claim 1 ,
wherein the darkening pattern layer further comprises a metal.

5. The conductive structure body according to claim 1 ,
wherein the dielectric material is selected from the group consisting of SiO, SiO2, MgF2, and SiNz (z is an integer of 1 or more).

6. The conductive structure body according to claim 4 ,
wherein the metal is selected from the group consisting of Fe, Co, Ti, V, Cu, Al, Au, and Ag.

7. The conductive structure body according to claim 1 ,
wherein the darkening pattern layer has an area of 80% to 120% of an area where the conductive pattern layer is occupied.

8. The conductive structure body according to claim 1 ,
wherein a line width of the darkening pattern layer is the same as or larger than a line width of the conductive pattern layer.

9. The conductive structure body according to claim 1 ,
wherein a thickness of the conductive pattern layer is 0.01 μm or more and 10 μm or less.

10. The conductive structure body according to claim 1 ,
wherein a line width of the conductive pattern layer is 10 μm or less.

11. The conductive structure body according to claim 1 ,
wherein the conductive pattern layer comprises a regular pattern.

12. The conductive structure body according to claim 1 ,
wherein the conductive pattern layer comprises an irregular pattern.

13. The conductive structure body according to claim 1 ,
wherein a structure of the conductive structure body is a structure of substrate/darkening pattern layer/conductive pattern layer, a structure of substrate/conductive pattern layer/darkening pattern layer, a structure of substrate/darkening pattern layer/conductive pattern layer/darkening pattern layer, a structure of substrate/conductive pattern layer/darkening pattern layer/conductive pattern layer, a structure of substrate/darkening pattern layer/conductive pattern layer/darkening pattern layer/conductive pattern layer/darkening pattern layer, or a structure of substrate/darkening pattern layer/conductive pattern layer/darkening pattern layer/conductive pattern layer/darkening pattern layer/conductive pattern layer/darkening pattern layer.

14. A touch screen panel, comprising:
the conductive structure body according to claim 1 .

15. A display device, comprising:
the conductive structure body according to claim 1 .

16. A solar battery, comprising:
the conductive structure body according to claim 1 .

17. A method for manufacturing a conductive structure body, comprising:
forming a conductive pattern layer on a substrate; and
forming a darkening pattern layer comprising a dielectric material and AlOxNy (x >0, y >0) having an atomic ratio represented by the following Equation 1 before, after, or before and after the conductive pattern layer is formed,

1
<

(
Al
)

⁢
at
×
3

(
0
)

⁢
at
×
2

+

(
N
)

⁢
at
×
3

<
2

[

Equation
⁢

⁢
1

]

wherein x and y mean ratios of numbers of O and N atoms to one Al atom, respectively, in AlOxNy, and (Al)at represents an atomic content (at %) of Al, (O)at represents an atomic content (at %) of O, and (N)at r

Assignees

• Lg Chemical Ltd

Inventors

• Lim Jin Hyong
• Jang Song Ho
• Park Jin Woo
• Kim Ki-Hwan
• Hwang In-Seok
• Kim Chung Wan
• Lee Seung Heon
• Koo Beom Mo
• Hwang Ji Young

Classifications

• H05K1/09

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title

• G06F2203/04112

  Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material · CPC title

• H05K1/0298

  Multilayer circuits · CPC title

• H01B1/08

  oxides · CPC title

• H05K3/4644

  by building the multilayer layer by layer, i.e. build-up multilayer circuits (making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602) · CPC title