Elastic flexible substrate and method for manufacturing the same

Patent metadata

Field	Value
Publication number	US-9699893-B2
Application number	US-201514626936-A
Country	US
Kind code	B2
Filing date	Feb 20, 2015
Priority date	Mar 31, 2014
Publication date	Jul 4, 2017
Grant date	Jul 4, 2017

Abstract

An elastic flexible substrate including an insulating film base material provided with a wire is provided. In the insulating film base material, a plurality of slits are provided with a predetermined space left therebetween, the insulating film base material has a bellows shape in which the insulating film base material is bent or curved by using the slits as base points, and the slits are deformed when the insulating film base material is stretched.

First claim

What is claimed is:

1. An elastic flexible substrate comprising:
an insulating film base material; and
a wire provided on the insulating film base material, wherein:
in the insulating film base material, a plurality of slits each formed to extend in a width direction of the insulating film base material are provided with a predetermined space left therebetween in a length direction of the insulating film base material; and
the insulating film base material has a bellows shape in which the insulating film base material is bent or curved about the slits as base points so that adjacent slits of the plurality of slits are offset from each other in a direction perpendicular to the width and length directions.

2. The elastic flexible substrate according to claim 1 , wherein
the slits are opened when the insulating film base material is stretched.

3. The elastic flexible substrate according to claim 1 , wherein
two slits which arc adjacent to each other are not aligned in a direction in which the plurality of slits are arranged with the predetermined space left therebetween.

4. The elastic flexible substrate according to claim 1 , wherein
at least two slits are provided in each of a bent spot or a most highly-curved spot of the insulating film base material.

5. The elastic flexible substrate according to claim 1 , further comprising:
an electronic device provided on the insulating film base material.

6. The elastic flexible substrate according to claim 1 , further comprising:
a via penetrating the insulating film base material, wherein:
the insulating film base material has two principal surfaces; and

the wire provided on one principal surface of the two principal surfaces of the insulating film base material and the wire provided on the other principal surface of the two principal surfaces are connected to each other by the via.

7. The elastic flexible substrate according to claim 1 , wherein:
the bellows shape includes a peak portion and a bottom portion; and
the slits are located in the peak portion and the bottom portion.

8. The elastic flexible substrate according to claim 2 , wherein
shapes of openings of the slits are deformable with expansion and contraction of the insulating film base material.

9. The elastic flexible substrate according to claim 5 , further comprising:
a protrusion formed by cutting and bending a part of a principal surface of the insulating film base material.

10. The elastic flexible substrate according to claim 9 , wherein
the electronic device is provided on the protrusion.

11. A method for manufacturing an elastic flexible substrate, the method comprising:
(i) forming a wire on an insulating film base material;
(ii) forming a plurality of slits in the insulating film base material, each of the plurality of slits formed to extend in a width direction of the insulating film base material with a predetermined space left therebetween in a length direction of the insulating film base material; and
(iii) processing the insulating film base material into a bellows shape by bending or curving the insulating film base material about the slits as base points so that adjacent slits of the plurality of slits are offset from each other in a direction perpendicular to the width and length directions.

12. The method for manufacturing an elastic flexible substrate according to claim 11 , wherein
two slits which are adjacent to each other are formed so as not to be aligned in a direction in which the plurality of slits are arranged with the predetermined space left therebetween.

13. The method for manufacturing an elastic flexible substrate according to claim 11 , wherein
at least two slits are formed in each of a bent spot obtained by bending the insulating film base material or a most highly-curved spot obtained by curving the insulating film base material.

14. The method for manufacturing an elastic flexible substrate according to claim 11 , further comprising:
providing an electronic device on the insulating film base material.

15. The method for manufacturing an elastic flexible substrate according to claim 11 , further comprising:
forming a protrusion formed of a part of a principal surface of the insulating film base material, wherein
the protrusion is formed by forming a notch in a part of the principal surface of the insulating film base material and bending the part of the principal surface.

16. The method for manufacturing an elastic flexible substrate according to claim 11 , wherein
formation of the slits in the step (ii) is performed before formation of the wire in the step (i).

17. The method for manufacturing an elastic flexible substrate according to claim 15 , wherein
the electronic device is provided in the part of the principal surface, the part becoming the protrusion.

Assignees

• Panasonic Ip Man Co Ltd

Inventors

• Matsumoto Takashi
• Ogura Tetsuyoshi
• Wakuda Daisuke

Classifications

• H05K1/115

  Via connections; Lands around holes or via connections (H05K1/112 takes precedence) · CPC title

• H05K2201/10151

  Sensor · CPC title

• H05K2201/09854

  Hole or via having special cross-section, e.g. elliptical · CPC title

• Y10T29/49162

  by using wire as conductive path · CPC title

• H05K1/028 Primary

  Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence) · CPC title