Warpage control with intermediate material

Patent metadata

Field	Value
Publication number	US-9867284-B2
Application number	US-201515501829-A
Country	US
Kind code	B2
Filing date	Aug 4, 2015
Priority date	Aug 5, 2014
Publication date	Jan 9, 2018
Grant date	Jan 9, 2018

Abstract

A mounting device for mounting electronic components, wherein the mounting device comprises an electrically conductive structure having a first value of thermal expansion in at least one pre-defined spatial direction, an electrically insulating structure having a second value of thermal expansion in the at least one pre-defined spatial direction being different from the first value and being arranged on the electrically conductive structure, and a thermal expansion adjustment structure having a third value of thermal expansion in the at least one pre-defined spatial direction, wherein the third value is selected and the thermal expansion adjustment structure is located so that thermally induced warpage of the mounting device resulting from a difference between the first value and the second value is at least partially compensated by the thermal expansion adjustment structure.

First claim

The invention claimed is:

1. A mounting device for mounting electronic components, wherein the mounting device comprises:
an electrically conductive structure having a first value of thermal expansion in at least one pre-defined spatial direction;
an electrically insulating structure having a second value of thermal expansion in the at least one pre-defined spatial direction being different from the first value and being arranged on the electrically conductive structure;
a thermal expansion adjustment structure having a third value of thermal expansion in the at least one pre-defined spatial direction;
wherein the third value is selected and the thermal expansion adjustment structure is located so that thermally induced warpage of the mounting device resulting from a difference between the first value and the second value is at least partially compensated by the thermal expansion adjustment structure;
wherein the third value is selected to be smaller than both the first value and the second value.

2. The mounting device according to claim 1 , configured as a plate with a thickness extending in z-direction and having a length in x-direction and a width in y-direction being both larger than the thickness.

3. The mounting device according to claim 2 , wherein the at least one predefined spatial direction comprises at least one of the x-direction, the y-direction, and the z-direction.

4. The mounting device according to claim 1 , wherein the thermal expansion adjustment structure comprises or consists of one of the group consisting of diamond like carbon, a nitride, and an oxide.

5. The mounting device according to claim 1 , wherein the electrically conductive structure, the electrically insulating structure, and the thermal expansion adjustment structure constitute a layer stack.

6. The mounting device according to claim 1 , wherein the thermal expansion adjustment structure is embedded between different spatially separated sections of the electrically conductive structure.

7. The mounting device according to claim 1 , further comprising an adhesion promoting structure arranged between the thermal expansion adjustment structure and the electrically conductive structure and configured for promoting adhesion of the thermal expansion adjustment structure on the electrically conductive structure.

8. The mounting device according to claim 7 , wherein the mounting device comprises at least one of the following features:
the adhesion promoting structure extends over only a part of the surface of or over the entire surface of at least one of the electrically conductive structure and the thermal expansion adjustment structure; the adhesion promoting structure comprises or consists of at least one of the group consisting of titanium, tungsten, chromium, a carbide builder, a carbon composite, graphene, and a monolayer graphene.

9. The mounting device according to claim 1 , wherein the electrically conductive structure comprises two spatially separated sections arranged on two opposing sides of the thermal expansion adjustment structure, and the electrically insulating structure comprises two spatially separated sections arranged on two opposing sides of the two sections of the electrically conductive structure.

10. The mounting device according to claim 9 , wherein the two sections of the electrically conductive structure, the two sections of the electrically insulating structure, and the thermal expansion adjustment structure form a symmetric arrangement.

11. The mounting device according to claim 1 , wherein the mounting device comprises at least one of the following features:
the thermal expansion adjustment structure is made of a thermally conductive and electrically insulating material;
the thermal expansion adjustment structure is made of a material having a value of the thermal conductivity of at least 2 W/m K.

12. The mounting device according to claim 1 , wherein the electrically insulating structure is made of a material having anisotropic properties in terms of thermal expansion.

13. The mounting device according to claim 1 , comprising at least one of the following features:
at least one further electrically conductive structure;
at least one further electrically insulating structure on the electrically insulating structure and the electrically conductive structure.

14. The mounting device according to claim 1 , configured as one of the group consisting of a printed circuit board, an interposer, a substrate, and a multilayer substrate.

15. The mounting device according to claim 1 , wherein the mounting device comprises at least one of the following features:
the thermal expansion adjustment structure is configured so that the thermally induced warpage is characterized by a bow of the mounting device of at the maximum 1.5%, wherein the bow is calculated as a ratio between a maximum distance between a bottom surface of the mounting surface and a planar support carrying the mounting device on the one hand and a length of a longest side of the mounting device on the other hand;
the thermal expansion adjustment structure is configured so that the thermally induced warpage is characterized by a twist of the mounting device of at the maximum 2%, wherein the twist is calculated as a ratio between a maximum distance between a corner of the mounting surface and a planar support carrying the mounting device on the one hand and a longest diameter of the mounting device on the other hand;
the thermal expansion adjustment structure is configured as a partial layer having, in a viewing direction perpendicular to a main surface of the mounting device, a total area being smaller than a surface area of the main surface of the mounting device.

16. A method of manufacturing a mounting device for mounting electronic components, wherein the method comprises:
providing an electrically conductive structure having a first value of thermal expansion in at least one pre-defined spatial direction;
arranging an electrically insulating structure on the electrically conductive structure, the electrically insulating structure having a second value of thermal expansion in the at least one pre-defined spatial direction being different from the first value;
forming a thermal expansion adjustment structure having a third value of thermal expansion in the at least one pre-defined spatial direction;
selecting the third value and locating the thermal expansion adjustment structure so that thermally induced warpage of the mounting device resulting from a difference between the first value and the second value is at least partially compensated by the thermal expansion adjustment structure;
wherein the third value is selected to be smaller than both the first value and the second value.

17. The method according to claim 16 , wherein the thermal expansion adjustment structure is formed by one of the group consisting of physical vapor deposition, cathodic arc deposition, chemical vapour deposition, plasma enhanced chemical vapour deposition, and printing.

18. The method according to claim 16 , wherein the third value is selected so that the electrically conductive structure and the thermal expansion adjustment structure as a composite have an effective value of the thermal expansion in the at least one pre-defined spatial direction which is closer to the second value than the first value.

19. The method according to claim 16 , wherein the method comprises:
estimating thermally induced warpage of a mounting device without a thermal expansion adjustment structure;
est

Assignees

• Austria Tech & System Tech
• At & S Austria Tech & Systemtechnii

Inventors

• Kreutzwiesner Elisabeth
• Schulz Gernot

Classifications

• H05K3/4602

  characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated · CPC title

• H05K3/16

  by cathodic sputtering · CPC title

• H05K1/0207

  using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes · CPC title

• H05K3/146

  By vapour deposition · CPC title

• H05K2201/0323

  Carbon · CPC title