Mounted substrate, mounted-substrate production method, and mounted-substrate production device
US-10136570-B2 · Nov 20, 2018 · US
After-treatment, e.g. cleaning or desmearing of holes
After-treatment, e.g. cleaning or desmearing of holes · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K3/0055 |
| Official title | {After-treatment, e.g. cleaning or desmearing of holes} |
| Display label | After-treatment, e.g. cleaning or desmearing of holes |
| Total patents | 184 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 9 |
| 2016 | 23 |
| 2017 | 17 |
| 2018 | 19 |
| 2019 | 25 |
| 2020 | 26 |
| 2021 | 23 |
| 2022 | 6 |
| 2023 | 6 |
| 2024 | 13 |
| 2025 | 14 |
| 2026 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Wiring board manufacturing method and wiring board manufacturing device
US-2018302991-A1 · Oct 18, 2018 · US
Stretchable electronic assembly
US-2018295720-A1 · Oct 11, 2018 · US
Multilayer printed wiring board and method of manufacturing the same
US-2018279486-A1 · Sep 27, 2018 · US
Formation of dielectric with smooth surface
US-10070537-B2 · Sep 4, 2018 · US
Fabrication method of flexible electronic device
US-2018213649-A1 · Jul 26, 2018 · US
Manufacturing method for printed circuit board
US-2018153043-A1 · May 31, 2018 · US
Wiring substrate method of manufacturing, wiring substrate and wiring substrate manufacturing device
US-2018153044-A1 · May 31, 2018 · US
Desmear module of a horizontal process line and a method for separation method and removal of desmear particles from such a desmear module
US-9930786-B2 · Mar 27, 2018 · US
Desmear treatment device and desmear treatment method
US-9859131-B2 · Jan 2, 2018 · US
Wiring substrate, semiconductor device, and method for manufacturing wiring substrate
US-9859201-B2 · Jan 2, 2018 · US
Wiring substrate and semiconductor device
US-2017372991-A1 · Dec 28, 2017 · US
Laminate production method
US-2017359908-A1 · Dec 14, 2017 · US
Laminate production method
US-2017359907-A1 · Dec 14, 2017 · US
Plasma etching of solder resist openings
US-9820386-B2 · Nov 14, 2017 · US
Printed wiring board and method for manufacturing the same
US-2017303396-A1 · Oct 19, 2017 · US
Ultrasonic lamination of dielectric circuit materials
US-2017290172-A1 · Oct 5, 2017 · US
Wafer-level manufacturing method for embedding passive element in glass substrate
US-2017280566-A1 · Sep 28, 2017 · US
Plasma etching of solder resist openings
US-2017273187-A1 · Sep 21, 2017 · US
Composition for forming conductive pattern and resin structure having conductive pattern thereon
US-9756725-B2 · Sep 5, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H05K3/0055?
- CPC H05K3/0055 is the Cooperative Patent Classification code for “After-treatment, e.g. cleaning or desmearing of holes.”
- How many patents are filed under CPC H05K3/0055 (After-treatment, e.g. cleaning or desmearing of holes)?
- Our database includes 184 publications tagged with this CPC code.
- Is patent activity under CPC H05K3/0055 growing?
- Publication counts under this code: 13 in 2024 vs 14 in 2025 (latest complete years).