Ultrasonic lamination of dielectric circuit materials

Patent metadata

Field	Value
Publication number	US-2017290172-A1
Application number	US-201615331307-A
Country	US
Kind code	A1
Filing date	Oct 21, 2016
Priority date	Apr 4, 2016
Publication date	Oct 5, 2017
Grant date	—

Abstract

A method of lamination of dielectric circuit materials is provided. The method includes preparing first and second circuit layers of dielectric materials, stacking the first and second circuit layers with circuit trace elements interposed between the first and second circuit layers and ultrasonically welding the second circuit layer onto the first circuit layer around the circuit trace elements.

First claim

What is claimed is:

1 . A method of lamination of dielectric circuit materials, the method comprising:
preparing first and second circuit layers of dielectric materials; stacking the first and second circuit layers with circuit trace elements interposed between the first and second circuit layers; and ultrasonically welding the second circuit layer onto the first circuit layer around the circuit trace elements.

2 . The method according to claim 1 , wherein the dielectric materials comprise liquid crystal polymer (LCP), Polyimides and Polytetrafluoroethylene (PTFE).

3 . The method according to claim 1 , wherein the ultrasonically welding comprises melting material of the second circuit layer without melting material of the first circuit layer.

4 . The method according to claim 1 , further comprising:
machining a cavity in the first circuit layer; stacking the first and second circuit layers such that the second circuit layer overhangs the cavity; and avoiding an execution of ultrasonic welding at a location of the cavity.

5 . The method according to claim 4 , further comprising disposing an electrical or thermal element into the cavity.

6 . The method according to claim 1 , further comprising installing vias by which circuit trace elements are connectable.

7 . The method according to claim 1 , wherein an execution of ultrasonic welding bonds abutting circuit trace elements.

8 . The method according to claim 1 , further comprising machining, re-melting or polishing the second circuit layer to have a predetermined thickness or surface roughness.

9 . A method of lamination of dielectric circuit materials, the method comprising:
preparing first and second circuit layers of dielectric materials; disposing circuit trace elements on at least one of an upper surface of the first circuit layer and a lower surface of the second circuit layer; stacking the first and second circuit layers such that the lower surface of the second circuit layer above the upper surface of the first circuit layer; and ultrasonically welding the lower surface of the second circuit layer onto the upper surface of the first circuit layer around the circuit trace elements.

10 . The method according to claim 9 , wherein the dielectric materials comprise liquid crystal polymer (LCP), Polyimides and Polytetrafluoroethylene (PTFE).

11 . The method according to claim 9 , wherein the ultrasonically welding comprises melting material of the lower surface of the second circuit layer without melting material of the upper surface of the first circuit layer.

12 . The method according to claim 9 , further comprising localizing an execution of ultrasonic welding.

13 . The method according to claim 9 , further comprising controlling a single horn element to conduct the stacking and the ultrasonically welding.

14 . The method according to claim 9 , further comprising:
machining a cavity in the upper surface of the first circuit layer; stacking the first and second circuit layers such that the second circuit layer overhangs the cavity; and avoiding an execution of ultrasonic welding at a location of the cavity.

15 . The method according to claim 14 , further comprising disposing an electrical or thermal element into the cavity.

16 . The method according to claim 9 , further comprising installing vias by which circuit trace elements are connectable.

17 . The method according to claim 9 , wherein an execution of ultrasonic welding bonds abutting circuit trace elements.

18 . The method according to claim 9 , further comprising machining, re-melting or polishing the second circuit layer to have a predetermined thickness or surface roughness.

19 . A method of lamination of dielectric circuit materials, the method comprising:
preparing a first circuit layer of first dielectric materials and a second circuit layer of second dielectric materials; stacking the first and second circuit layers with circuit trace elements interposed between the first and second circuit layers; ultrasonically welding the second dielectric material onto the first dielectric material around the circuit trace elements; bonding circuit trace elements abutting other circuit trace elements; and bonding the first or second dielectric materials to circuit trace elements to which the first or second dielectric materials abut.

20 . The method according to claim 19 , wherein the bonding is achieved by at least one of ultrasonic welding, soldering and adhesion.

Assignees

• Raytheon Co

Inventors

• Kocurek Patrick J
• Rajendran Sankerlingam

Classifications

• H05K2203/065

  Binding insulating layers without adhesive, e.g. by local heating or welding, before lamination of the whole PCB · CPC title

• H05K2201/015

  Fluoropolymer, e.g. polytetrafluoroethylene [PTFE] · CPC title

• H05K2203/0285

  Using ultrasound, e.g. for cleaning, soldering or wet treatment · CPC title

• H05K3/4038

  Through-connections; Vertical interconnect access [VIA] connections (H05K3/403, H05K3/42 take precedence) · CPC title

• H05K2201/0141

  Liquid crystal polymer [LCP] · CPC title