Composition and method for forming conductive pattern, and resin structure having conductive pattern thereon
US-2016128188-A1 · May 5, 2016 · US
US9756725B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9756725-B2 |
| Application number | US-201415023506-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 24, 2014 |
| Priority date | Nov 25, 2013 |
| Publication date | Sep 5, 2017 |
| Grant date | Sep 5, 2017 |
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The present invention relates to a composition for forming a conductive pattern which is capable of forming a fine conductive pattern on a variety of polymeric resin products or resin layers by a simplified process, while imparting excellent flame retardancy to the resin products or resin layers, and a resin structure having the conductive pattern obtained using the composition. The composition for forming a conductive pattern includes: a polymer resin; a non-conductive metal compound including a first metal element and a second metal element, having a R 3 m or P6 3 /mmc space group in crystal structure; and a flame retardant, wherein a metal nucleus including the first metal element, the second metal element or an ion thereof is formed from the non-conductive metal compound by the electromagnetic irradiation.
Opening claim text (preview).
The invention claimed is: 1. A composition for forming a conductive pattern by electromagnetic irradiation, comprising: a polymer resin; a non-conductive metal compound having a layered three dimensional structure and including a first metal element and a second metal element, having a R3m or P6 3 /mmc space group in crystal structure, the structure comprising: a plurality of first layers including at least one metal of the first metal element selected from the group consisting of Cr, Mo, Mn, Fe, Sn and W, and a second layer including at least one metal of the second metal element selected from the group consisting of Cu, Ag and Ni and arranged between the first layers, wherein the non-conductive metal compound has a general formula ABX 2 where A is selected from the group consisting of Cu, Ag and Ni, B is selected from the group consisting of Cr, Mo, Mn, Fe, Sn and W, and X is oxygen, nitrogen, or sulfur; and a flame retardant, wherein a metal nucleus including the first metal element, the second meta element or an ion thereof is formed from the non-conductive metal compound by the electromagnetic irradiation. 2. The composition of claim 1 , wherein the non-conductive metal compound includes one or more compounds selected from the group consisting of CuCrO 2 , NiCrO 2 , AgCrO 2 , CuMoO 2 , NiMoO 2 , AgMoO 2 , NiMnO 2 , AgMnO 2 , NiFeO 2 , AgFeO 2 , CuWO 2 , AgWO 2 , NiWO 2 , AgSnO 2 , NiSnO 2 and CuSnO 2 . 3. The composition of claim 1 , wherein it exhibits reflectivity of 25% or less with respect to a laser electromagnetic wave having a wavelength of 1000 nm to 1200 nm. 4. The composition of claim 1 , wherein the metal nucleus is formed by irradiating a laser electromagnetic wave having a wavelength of 1000 nm to 1200 nm at an average power of 5 to 20 W. 5. The composition of claim 1 , wherein the polymer resin includes a thermosetting resin or a thermoplastic resin. 6. The composition of claim 5 , wherein the polymer resin includes one or more selected from the group consisting of an ABS resin, a polyalkylene terephthalate resin, a polycarbonate resin, a polypropylene resin, and a polyphthalamide resin. 7. The composition of claim 1 , wherein the non-conductive metal compound is included in an amount of 0.1 to 10 wt %, with respect to the composition. 8. The composition of claim 1 , wherein the flame retardant includes a phosphorus-containing organic flame retardant or an inorganic flame retardant. 9. The composition of claim 8 , wherein the phosphorus-containing organic flame retardant includes one or more selected from the group consisting of trialkyl phosphate, alkyldiaryl phosphate, tricryl phosphate and resorcinol bisphenyl phosphate. 10. The composition of claim 8 , wherein the inorganic flame retardant includes one or more selected from the group consisting of metal hydrides, antimony oxide and metal sulfonates. 11. The composition of claim 1 , wherein the flame retardant is included in an amount of 0.1 to 20 wt %, with respect to the composition. 12. The composition of claim 1 , further comprising one or more additives selected from the group consisting of a heat stabilizer, a UV stabilizer, a lubricant, an antioxidant, an inorganic filler, a colorant, an impact modifier, and a functional modifier. 13. The composition of claim 12 , wherein the flame retardant includes a phosphorus-containing organic flame retardant, and the inorganic filler or the impact modifier is included as the additive. 14. A resin structure having a conductive pattern, comprising: a polymeric resin substrate; dispersed in the polymeric resin substrate, a non-conductive metal compound including a first metal element and a second metal element, having a R3m or P6 3 /mmc space group in crystal structure, the structure comprising a plurality of first layers including at least one metal of the first meta element selected from the group consisting of Cr, Mo, Mn, Fe, Sn and W, and a second layer including at least one metal of the second metal element selected from the group consisting of Cu, Ag and Ni and arranged between the first layers, wherein the non-conductive metal compound has a general formula ABX 2 where A is selected from the group consisting of Cu, Ag and Ni, B is selected from the group consisting of Cr, Mo, Mn, Fe, Sn and W, and X is oxygen, nitrogen, or sulfur; a flame retardant dispersed in the polymeric resin substrate; an adhesion-activated surface including a metal nucleus including a first or a second metal or an ion thereof exposed on a surface of a predetermined region of the polymeric resin substrate; and a conductive metal layer formed on the adhesion-activated surface. 15. The resin structure of claim 14 , wherein the predetermined region on which the adhesion-activated surface and the conductive metal layer are formed corresponds to a region of the polymeric resin substrate to which an electromagnetic wave is irradiated. 16. The resin structure of claim 14 , wherein it exhibits a flame retardant grade of UV 94-V0 or V1 (thickness (t) is 0.6 to 1.6 mm). 17. The resin structure of claim 14 , wherein the conductive metal layer is formed on the polymeric resin substrate by adhesion at which a delamination area of the metal layer is 0% (ISO Class 0 grade), or more than 0% to 5% or less (ISO Class 1 grade), of an area of a target metal layer under test, when tested according to ISO 2409 standard. 18. The composition of claim 1 , wherein X is nitrogen or sulfur. 19. The resin structure of claim 14 , wherein X is nitrogen or sulfur.
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