Mounted substrate, mounted-substrate production method, and mounted-substrate production device

Patent metadata

Field	Value
Publication number	US-10136570-B2
Application number	US-201515314914-A
Country	US
Kind code	B2
Filing date	May 22, 2015
Priority date	May 30, 2014
Publication date	Nov 20, 2018
Grant date	Nov 20, 2018

Abstract

An array substrate includes a driver, a glass substrate having a driver mounting section where the driver is mounted, an anisotropic conductive material that is interposed between the driver and driver mounting section so as to electrically connect both and that at least includes a binder made of a thermosetting resin and conductive particles in the binder, and a heat supply part provided on at least the driver mounting section of the glass substrate for supplying heat to the anisotropic conductive material.

First claim

What is claimed is:

1. A mounting substrate, comprising:
a component having a plurality of component-side output and input terminals thereon;
a substrate having a component mounting section where the component is mounted;
an anisotropic conductive material interposed between and electrically connecting the component and the component mounting section of the substrate, the anisotropic conductive material including at least a binder made of a thermosetting resin and conductive particles contained in the binder;
a heat supply pattern made of a heat conductive material and provided on the substrate in at least the component mounting section of the substrate, said heat supply pattern supplying heat to the anisotropic conductive material; and
a plurality of substrate-side input and output terminals in the component mounting section on the substrate, respectively connected to the plurality of component-side output and input terminals on the component,
wherein said heat supply pattern is not electrically connected to any of the plurality of substrate-side input and output terminals.

2. The mounting substrate according to claim 1 , wherein the heat supply pattern comprises:
a heated section heated from outside and provided on a component non-overlapping section of the substrate not overlapping the component in a plan view; and
a heat transfer section transferring heat from the heated section to the anisotropic conductive material and provided on at least the component mounting section of the substrate, which is a portion of the substrate overlapping the component in a plan view.

3. The mounting substrate according to claim 2 , wherein the heat transfer section of the heat supply pattern extends across the component mounting section, whereas the heated section of the heat supply pattern is provided in a pair respectively continuing from both ends of the heat transfer section in an extension direction of the heat transfer section.

4. The mounting substrate according to claim 2 ,
wherein an optical member is attached to the substrate along a surface of the substrate and adjacent to the component mounting section in a direction orthogonal to an extension direction of the heat transfer section extending across the component mounting section of the substrate, and
wherein the heat transfer section of the heat supply pattern is drawn out from the component mounting section towards the component non-overlapping section opposite to the optical member in the direction orthogonal to the extension direction of the heat transfer section, whereas the heated section of the heat supply pattern continues from a drawn-out end of the heat transfer section and is arranged on a side on the component non-overlapping section opposite to the optical member with respect to the component mounting section in the direction orthogonal to the extension direction.

5. The mounting substrate according to claim 1 , wherein the heat supply pattern comprises:
a voltage receiving pattern receiving a voltage from outside and provided on a component non-overlapping section of the substrate not overlapping the component in a plan view; and
a heat generating pattern generating heat based on the voltage received by the voltage receiving pattern and provided on at least the component mounting section of the substrate, which is a portion of the substrate overlapping the component in a plan view.

6. The mounting substrate according to claim 1 ,
wherein the component mounting section includes a first terminal group comprising a plurality of first terminals arranged side-by-side, and a second terminal group comprising a plurality of second terminals arranged side-by-side parallel to an arrangement direction of the plurality of first terminals and having a total area greater than a total area of the first terminal group, and
wherein the heat supply pattern includes at least a pattern closer to the second terminal group than the first terminal group.

7. The mounting substrate according to claim 6 , wherein the heated supply pattern at least includes an inner heat supply pattern that passes between the second terminal group and the first terminal group on an inner side of the second terminal group, and an outer heat supply pattern that sandwiches the second terminal group on an outer side of the second terminal group with the inner heat supply pattern.

8. The mounting substrate according to claim 6 , wherein the first terminal group is an input terminal group receiving input signals for the component, whereas the second terminal group is an output terminal group receiving output signals from the component.

9. The mounting substrate according to claim 1 ,
wherein the component mounting section includes input terminals receiving input signals for the component, and output terminals separated from the input terminals and receiving output signals from the component, and
wherein the heat supply pattern passes between at least the input terminals and the output terminals on the component mounting section.

10. The mounting substrate according to claim 1 ,
wherein the component mounting section includes input terminals receiving input signals for the component, and output terminals separated from the input terminals and receiving output signals from the component, and
wherein the heat supply pattern at least includes an input terminal-side heat supply pattern disposed relatively near the input terminals, and an output terminal-side heat supply pattern disposed relatively near the output terminals.

11. The mounting substrate according to claim 1 , wherein the heat supply pattern is made of a material having a higher thermal conductivity than a thermal conductivity of the substrate.

12. The mounting substrate according to claim 1 , wherein the component mounting section includes input terminals receiving input signals for the component, and output terminals receiving output signals from the component, and
wherein the heat supply pattern is made of a same material as the input terminals and the output terminals.

Assignees

• Sharp Kk

Inventors

• Yamaguchi Katsuhiro
• Nakata Nobuhiro
• Masuda Yukinori
• TAKAHARA Tomoki

Classifications

• H10W99/00

  Subject matter not provided for in other groups of this subclass · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W72/07338

  hardening the adhesive by curing, e.g. thermosetting · CPC title