Circuit substrate and electronic device
US-2024023241-A1 · Jan 18, 2024 · US
Encapsulation comprising more than one layer
Encapsulation comprising more than one layer · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K2203/1322 |
| Official title | Encapsulation comprising more than one layer |
| Display label | Encapsulation comprising more than one layer |
| Total patents | 186 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 7 |
| 2016 | 12 |
| 2017 | 26 |
| 2018 | 23 |
| 2019 | 13 |
| 2020 | 16 |
| 2021 | 16 |
| 2022 | 17 |
| 2023 | 20 |
| 2024 | 18 |
| 2025 | 15 |
| 2026 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Component mount board
US-10154597-B2 · Dec 11, 2018 · US
An Electronic Device Package
US-2018350780-A1 · Dec 6, 2018 · US
Stretchable circuit board and strain sensor
US-2018317318-A1 · Nov 1, 2018 · US
Multi-layer potting for electronic modules
US-10083885-B1 · Sep 25, 2018 · US
Thermoformed plastic cover for electronics and related method of manufacture
US-10064282-B2 · Aug 28, 2018 · US
Fabrication methods for bio-compatible devices using an etch stop and/or a coating
US-10057983-B1 · Aug 21, 2018 · US
Electronic device package having a dielectric layer and an encapsulant
US-10043782-B2 · Aug 7, 2018 · US
Multi-layer thin-film coatings for system-in-package assemblies in portable electronic devices
US-2018220525-A1 · Aug 2, 2018 · US
Packaging structure and packaging method of electronic product
US-2018184528-A1 · Jun 28, 2018 · US
Printed circuit board assembly
US-10004137-B2 · Jun 19, 2018 · US
Cortical implant system for brain stimulation and recording
US-9949376-B2 · Apr 17, 2018 · US
Component-embedded substrate
US-9918381-B2 · Mar 13, 2018 · US
Protective layering process for circuit board EMI sheilding and thermal management
US-9900988-B1 · Feb 20, 2018 · US
Wafer-level package with enhanced performance
US-2018044177-A1 · Feb 15, 2018 · US
Smart textile product and method for fabricating the same
US-9839123-B2 · Dec 5, 2017 · US
Shielding mold for electric and magnetic EMI mitigation
US-9807866-B2 · Oct 31, 2017 · US
Combining different types of moisture-resistant materials
US-9795989-B2 · Oct 24, 2017 · US
Electronic Device Package Having a Dielectric Layer and an Encapsulant
US-2017287880-A1 · Oct 5, 2017 · US
Long-term packaging for the protection of implant electronics
US-9781842-B2 · Oct 3, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H05K2203/1322?
- CPC H05K2203/1322 is the Cooperative Patent Classification code for “Encapsulation comprising more than one layer.”
- How many patents are filed under CPC H05K2203/1322 (Encapsulation comprising more than one layer)?
- Our database includes 186 publications tagged with this CPC code.
- Is patent activity under CPC H05K2203/1322 growing?
- Publication counts under this code: 18 in 2024 vs 15 in 2025 (latest complete years).