Shielding mold for electric and magnetic EMI mitigation

Patent metadata

Field	Value
Publication number	US-9807866-B2
Application number	US-201514954632-A
Country	US
Kind code	B2
Filing date	Nov 30, 2015
Priority date	Nov 30, 2015
Publication date	Oct 31, 2017
Grant date	Oct 31, 2017

Abstract

An electronic package having a substrate that includes signal traces and ground traces; an electronic component mounted on an upper surface of the substrate such that the electronic component is electrically connected to the signal traces and the ground traces in the substrate; an insulating layer covering the electronic component and the upper surface of the substrate; and an electromagnetic interference shielding mold covering the insulation layer such that the electromagnetic interference shielding mold is electrically connected to the ground traces in the substrate. In some forms of the electronic package, the electromagnetic interference shielding mold is electrically connected to the ground traces through openings in the insulation layer.

First claim

The invention claimed is:

1. An electronic package, comprising:
a substrate that includes signal traces and ground traces, the substrate having a planar upper surface;
an electronic component mounted on the planar upper surface of the substrate such that the electronic component is electrically connected to the signal traces and the ground traces in the substrate;
an insulating layer covering the entire electronic component and the entire planar upper surface of the substrate; and
an electromagnetic interference shielding mold covering the entire insulation layer such that the electromagnetic interference shielding mold extends through cylindrical drilled openings in the insulating layer to be electrically connected to the ground traces that are exposed from the planar upper surface of the substrate.

2. The electronic package of claim 1 , wherein the electromagnetic interference shielding mold includes a polymer mixed with conductive materials and magnetic materials that provide electromagnetic isolation.

3. The electronic package of claim 2 , wherein the electromagnetic interference shielding mold further includes inorganic materials.

4. The electronic package of claim 2 , wherein the materials that provide electromagnetic isolation include at least one of cobalt, iron, nickel, copper, gold, silver and aluminum.

5. The electronic package of claim 1 , wherein the insulation layer includes a dielectric material.

6. The electronic package of claim 5 , wherein the dielectric material includes inorganic and organic materials.

7. The electronic package of claim 1 , wherein the electromagnetic interference shielding mold is 60-90% conductive and magnetic materials and 10-40% epoxy resin.

8. An electronic package, comprising:
a substrate that includes signal traces and ground traces;
a plurality of electronic components mounted on an upper surface of the substrate such that the electronic components are electrically connected to the signal traces and the ground traces in the substrate;
an insulating layer entirely covering each of the electronic components and the entire upper surface of the substrate, wherein the insulating layer has a substantially uniform thickness; and
an electromagnetic interference shielding mold covering the insulation layer such that the electromagnetic interference shielding mold extends through cylindrical drilled openings in the insulating layer to be electrically connected to the ground traces in the substrate.

9. The electronic package of claim 8 , wherein the electromagnetic interference shielding mold includes a polymer mixed with materials that provide electromagnetic isolation, wherein the electromagnetic interference shielding mold further includes inorganic materials, wherein the materials that provide electromagnetic isolation include at least one of cobalt, iron, nickel, copper, gold, silver and aluminum.

10. The electronic package of claim 9 , wherein the magnetic materials that provide magnetic isolation include at least one of cobalt, iron and nickel.

11. The electronic package of claim 8 , wherein the magnetic interference shielding mold is 60-90% magnetic materials and 10-40% epoxy resin.

Assignees

• Intel Corp

Inventors

• Zhang Zhichao
• Elsherbini Adel
• Sankman Robert L
• Aygun Kemal

Classifications

• H10W42/284

  shielding resins · CPC title

• H10W42/287

  materials for magnetic shielding, e.g. ferromagnetic materials · CPC title

• H10W42/276

  the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation · CPC title

• H10W74/114

  by a substrate and the encapsulations · CPC title

• H10W74/473

  containing a filler · CPC title