Component mount board

Patent metadata

Field	Value
Publication number	US-10154597-B2
Application number	US-201815956787-A
Country	US
Kind code	B2
Filing date	Apr 19, 2018
Priority date	Nov 5, 2015
Publication date	Dec 11, 2018
Grant date	Dec 11, 2018

Abstract

A component mount board includes a resin board, an electronic component, and a molding resin. A land conductor is provided in the resin board. The electronic component is mounted on a surface of the resin board, and includes a mounting terminal that is bonded to the land conductor. The resin board includes a body resin portion including the land conductor provided on a surface thereof, and a surface resin layer disposed on a surface of the body resin portion and made of a material of the same type as that of the body resin portion. A conductor is not provided on a surface of the surface resin layer. The surface resin layer includes a through hole at which the land conductor is exposed from the surface of the resin board. The mounting terminal is bonded to the land conductor via a bonding material filled in the through hole.

First claim

What is claimed is:

1. A component mount board comprising:
a resin board on or in which a conductor pattern including a component-mounting land conductor is provided;
a first component mounted on a surface of the resin board, and including a mounting terminal that is bonded to the land conductor; and
a molding resin covering the surface of the resin board and the first component, and made of a material different from a material of the resin board; wherein
the resin board includes:
a body resin portion including a surface on which the land conductor is provided; and
a surface resin layer disposed on the surface of the body resin portion, and made of a material of the same type as a type of a material of the body resin portion;

a conductor is not provided on a surface of the surface resin layer, and the surface resin layer includes a through hole at which the land conductor is exposed from the surface of the resin board;
the mounting terminal is bonded to the land conductor by a bonding material with which the through hole is filled;
the surface resin layer and the body resin portion include a liquid crystal polymer; and
the molding resin includes a silicone resin.

2. The component mount board according to claim 1 , wherein the body resin portion includes a plurality of resin layers.

3. The component mount board according to claim 1 , wherein the conductor pattern includes a plurality of external-connection terminal conductors provided on another surface of the body resin portion opposite to the surface on which the land conductor is provided.

4. The component mount board according to claim 1 , wherein the conductor pattern includes a plurality of circuit conductors and a plurality of interlayer connection conductors provided in the body resin portion.

5. The component mount board according to claim 1 , wherein the through hole is provided at a position overlapping a portion of the land conductor.

6. The component mount board according to claim 1 , wherein the bonding material includes a solder.

7. A component mount board comprising:
a resin board on or in which a conductor pattern including a component-mounting land conductor is provided;
a first component mounted on a surface of the resin board, and including a mounting terminal that is bonded to the land conductor; and
a molding resin covering the surface of the resin board and the first component, and made of a material different from a material of the resin board; wherein
the resin board includes:
a body resin portion including a surface on which the land conductor is provided; and
a surface resin layer disposed on the surface of the body resin portion, and made of a material of the same type as a type of a material of the body resin portion;

a conductor is not provided on a surface of the surface resin layer, and the surface resin layer includes a through hole at which the land conductor is exposed from the surface of the resin board;
the mounting terminal is bonded to the land conductor by a bonding material with which the through hole is filled; and
a Young's modulus of the resin board is higher than a Young's modulus of the molding resin.

8. The component mount board according to claim 7 , wherein
the surface resin layer and the body resin portion include a liquid crystal polymer; and
the molding resin includes a silicone resin.

9. The component mount board according to claim 7 , wherein the body resin portion includes a plurality of resin layers.

10. The component mount board according to claim 7 , wherein the conductor pattern includes a plurality of external-connection terminal conductors provided on another surface of the body resin portion opposite to the surface on which the land conductor is provided.

11. The component mount board according to claim 7 , wherein the conductor pattern includes a plurality of circuit conductors and a plurality of interlayer connection conductors provided in the body resin portion.

12. The component mount board according to claim 7 , wherein the through hole is provided at a position overlapping a portion of the land conductor.

13. The component mount board according to claim 7 , wherein the bonding material includes a solder.

14. A component mount board comprising:
a resin board on or in which a conductor pattern including a component-mounting land conductor is provided;
a first component mounted on a surface of the resin board, and including a mounting terminal that is bonded to the land conductor; and
a molding resin covering the surface of the resin board and the first component, and made of a material different from a material of the resin board; wherein
the resin board includes:
a body resin portion including a surface on which the land conductor is provided; and
a surface resin layer disposed on the surface of the body resin portion, and made of a material of the same type as a type of a material of the body resin portion;

a conductor is not provided on a surface of the surface resin layer, and the surface resin layer includes a through hole at which the land conductor is exposed from the surface of the resin board;
the mounting terminal is bonded to the land conductor by a bonding material with which the through hole is filled;
the component mount board includes a second component built in the body resin portion;
the molding resin is made of a material having a lower Young's modulus than a Young's modulus of the material of the surface resin layer and a Young's modulus of the material of the body resin portion; and
a ratio of a volume of the second component to a volume of the resin board including the second component is smaller than a ratio of a volume of the first component to a total volume of the molding resin and the first component.

15. The component mount board according to claim 14 , wherein
the surface resin layer and the body resin portion include a liquid crystal polymer; and
the molding resin includes a silicone resin.

16. The component mount board according to claim 14 , wherein the body resin portion includes a plurality of resin layers.

17. The component mount board according to claim 14 , wherein the conductor pattern includes a plurality of external-connection terminal conductors provided on another surface of the body resin portion opposite to the surface on which the land conductor is provided.

18. The component mount board according to claim 14 , wherein the conductor pattern includes a plurality of circuit conductors and a plurality of interlayer connection conductors provided in the body resin portion.

19. The component mount board according to claim 14 , wherein the through hole is provided at a position overlapping a portion of the land conductor.

20. The component mount board according to claim 14 , wherein the bonding material includes a solder.

Assignees

• Murata Manufacturing Co

Inventors

• Takeoka Makoto
• Kawata Masaki
• Naruoka Tomohiko
• Noma Hayato

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W74/114

  by a substrate and the encapsulations · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/9413

  on encapsulations · CPC title