Thermoformed plastic cover for electronics and related method of manufacture

Patent metadata

Field	Value
Publication number	US-10064282-B2
Application number	US-201615158645-A
Country	US
Kind code	B2
Filing date	May 19, 2016
Priority date	May 19, 2015
Publication date	Aug 28, 2018
Grant date	Aug 28, 2018

Abstract

A multilayer structure for an electronic device having a flexible substrate film (202) for accommodating electronics (204); at least one electronic component (204) provided on said substrate film (202); and a number of conductive traces (206) provided on said substrate film (202) for electrically powering and/or connecting electronics including said at least one electronic component (204), wherein at least one preferably thermoformed cover (210) is attached to said substrate film (202) on top of said at least one electronic component (204), the at least one thermoformed cover (210) and the substrate film (202) accommodating the electronics (204) being overmolded with thermoplastic material (208). The invention also relates to a method for manufacturing a multilayer structure for an electronic device.

First claim

The invention claimed is:

1. A multilayer structure for an electronic device, comprising:
a flexible substrate film for accommodating electronics,
at least one electronic component directly contacting said flexible substrate film,
a number of conductive traces provided on said flexible substrate film for electrically powering and/or connecting electronics including said at least one electronic component, and
at least one cover attached to said flexible substrate film on top of said at least one electronic component by at least one of adhesive, solder, or mechanical fixing with a fastener, said at least one cover being overmolded with thermoplastic material.

2. The multilayer structure of claim 1 , wherein said at least one cover includes a cover placed on top of a plurality of electronic components.

3. The multilayer structure of claim 1 , further comprising at least two covers placed at least partially on top of at least two electronic components respectively.

4. The multilayer structure of claim 1 wherein a continuous, object defines multiple cover shapes, each cover shape being configured to accommodate one or more electronic components.

5. The multilayer structure of claim 1 , wherein said at least one cover extends over a surface of the flexible substrate film accommodating said at least one electronic component partially or completely.

6. The multilayer structure of claim 1 , wherein said at least one cover defines a number of rounded, protective caps for electronic components.

7. The multilayer structure of claim 1 , wherein said at least one cover includes an optically transparent or translucent material having regard to predefined electromagnetic wavelengths.

8. The multilayer structure of claim 1 , wherein said at least one cover includes a number of through-holes configured to enable light emitted and/or detected by the at least one electronic component to propagate there within and outcouple therefrom.

9. The multilayer structure of claim 1 , wherein said flexible substrate film includes an optically transparent or translucent material as to predetermined electromagnetic wavelengths.

10. The multilayer structure of claim 1 , wherein said thermoplastic material includes an optically transparent or translucent material having regard to predefined wavelengths.

11. The multilayer structure of claim 1 , wherein said thermoplastic material includes a plurality of layers and wherein the thermoplastic material layers exhibit different elasticities, optical transparencies/transmittances, glass transition temperatures, melting points or a combination thereof.

12. The multilayer structure of claim 1 , wherein said at least one electronic component includes at least one optoelectronic, light-emitting, light-detecting, and/or light-sensing component, LED (light-emitting diode) or photodiode.

Assignees

• Tactotek Oy

Inventors

• Heikkinen Mikko
• Sääski Jarmo
• Torvinen Jarkko

Classifications

• H10W72/253

  not comprising solid metals or solid metalloids, e.g. polymers or ceramics · CPC title

• H10W70/688

  Flexible insulating substrates · CPC title

• H10W70/611

  for connecting multiple chips together · CPC title

• H05K1/186 Primary

  manufactured by mounting on or connecting to patterned circuits before or during embedding · CPC title

• H05K1/189

  characterised by the use of flexible or folded printed circuits · CPC title