Stacked-layer board, electronic component module, and method of manufacturing stacked-layer board
US-12052821-B2 · Jul 30, 2024 · US
Pretreatment of metal, e.g. before finish plating, etching
Pretreatment of metal, e.g. before finish plating, etching · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K2203/0392 |
| Official title | Pretreatment of metal, e.g. before finish plating, etching |
| Display label | Pretreatment of metal, e.g. before finish plating, etching |
| Total patents | 66 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 6 |
| 2016 | 11 |
| 2017 | 6 |
| 2018 | 7 |
| 2019 | 8 |
| 2020 | 5 |
| 2021 | 6 |
| 2022 | 7 |
| 2023 | 2 |
| 2024 | 2 |
| 2025 | 5 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Methods for producing an etch resist pattern on a metallic surface
US-2024035167-A1 · Feb 1, 2024 · US
Printed wiring board and method for manufacturing printed wiring board
US-11832397-B2 · Nov 28, 2023 · US
Methods for producing an etch resist pattern on a metallic surface
US-11807947-B2 · Nov 7, 2023 · US
Methods of etching conductive features, and related devices and systems
US-11425822-B2 · Aug 23, 2022 · US
Copper-clad laminated plate, resin-clad copper foil, and circuit substrate using said plate and foil
US-2022220272-A1 · Jul 14, 2022 · US
Stacked-layer board, electronic component module, and method of manufacturing stacked-layer board
US-2022183156-A1 · Jun 9, 2022 · US
Hydrophobic Low-Dielectric-Constant Film and Preparation Method Therefor
US-2022145460-A1 · May 12, 2022 · US
Methods for producing an etch resist pattern on a metallic surface
US-2022136113-A1 · May 5, 2022 · US
Methods for producing an etch resist pattern on a metallic surface
US-11255018-B2 · Feb 22, 2022 · US
Conductive film, touch panel sensor, and touch panel
US-11216123-B2 · Jan 4, 2022 · US
Method for producing a printed circuit board structure
US-11172576-B2 · Nov 9, 2021 · US
Coating metal foil with N-heterocyclic carbene compounds containing organic functionalities for improving metal-to-resin adhesion
US-11102892-B2 · Aug 24, 2021 · US
Methods of etching conductive features, and related devices and systems
US-2021227696-A1 · Jul 22, 2021 · US
Printed wiring board and method for manufacturing printed wiring board
US-2021176866-A1 · Jun 10, 2021 · US
Methods of etching conductive features, and related devices and systems
US-11006528-B2 · May 11, 2021 · US
Methods for producing an etch resist pattern on a metallic surface
US-2021007225-A1 · Jan 7, 2021 · US
Conductive film, touch panel sensor, and touch panel
US-2020409494-A1 · Dec 31, 2020 · US
Methods for producing an etch resist pattern on a metallic surface
US-10806035-B2 · Oct 13, 2020 · US
Surface treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device
US-10791631-B2 · Sep 29, 2020 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H05K2203/0392?
- CPC H05K2203/0392 is the Cooperative Patent Classification code for “Pretreatment of metal, e.g. before finish plating, etching.”
- How many patents are filed under CPC H05K2203/0392 (Pretreatment of metal, e.g. before finish plating, etching)?
- Our database includes 66 publications tagged with this CPC code.
- Is patent activity under CPC H05K2203/0392 growing?
- Publication counts under this code: 2 in 2024 vs 5 in 2025 (latest complete years).