Coating metal foil with N-heterocyclic carbene compounds containing organic functionalities for improving metal-to-resin adhesion

Patent metadata

Field	Value
Publication number	US-11102892-B2
Application number	US-201916656691-A
Country	US
Kind code	B2
Filing date	Oct 18, 2019
Priority date	Dec 2, 2014
Publication date	Aug 24, 2021
Grant date	Aug 24, 2021

Abstract

A carbene-coated metal foil is produced by applying an N-heterocyclic carbene (NHC) compound to one or more surfaces of a metal foil (e.g., an electrodeposited copper foil having a surface that is smooth and non-oxidized). The NHC compound contains a matrix-reactive pendant group that includes at least one of a vinyl-, allyl-, acrylic-, methacrylic-, styrenic-, amine-, amide- and epoxy-containing moiety capable of reacting with a base polymer (e.g., a vinyl-containing resin such as a polyphenylene oxide/triallyl-isocyanurate (PPO/TAIC) composition). The NHC compound may be synthesized by, for example, reacting a halogenated imidazolium salt (e.g., 1,3-bis(4-bromo-2,6-dimethylphenyl)-4,5-dihydro-1H-imidazol-3-ium chloride) and an organostannane having a vinyl-containing moiety (e.g., tributyl(vinyl)stannane) in the presence of a palladium catalyst. In some embodiments, an enhanced substrate for a printed circuit board (PCB) is produced by laminating the carbene-coated metal foil to a substrate that includes glass fiber impregnated with the base polymer.

First claim

What is claimed is:

1. An enhanced substrate comprising:
a substrate, wherein the substrate comprises glass fiber impregnated with a base polymer;
a carbene-coated metal foil laminated to the substrate, wherein the carbene-coated metal foil comprises a conductive surface treated with an N-heterocyclic carbene (NHC) compound comprising a matrix-reactive pendant group, wherein the matrix-reactive pendant group of the NHC compound enhances bonding of the carbene-coated metal foil to the base polymer, and wherein the NHC compound is a NHC precursor represented by the following formula:

2. The enhanced substrate as recited in claim 1 , wherein the carbene-coated metal foil comprises an electrodeposited copper foil having a copper surface treated with the NHC compound.

3. The enhanced substrate as recited in claim 2 , wherein the copper surface of the electrodeposited copper foil is smooth, with a root-mean-square (RMS) surface roughness of R q ≤0.5 μm, and non-oxidized.

4. The enhanced substrate as recited in claim 2 , wherein the substrate is a prepreg comprising a sheet of woven glass fiber impregnated with the base polymer.

5. The enhanced substrate as recited in claim 2 , wherein the base polymer comprises a vinyl-containing resin, and wherein the matrix-reactive pendant group of the NHC compound enhances bonding of the carbene-coated metal foil to the base polymer by crosslinking into the vinyl-containing resin of the base polymer.

6. An enhanced substrate comprising:
a substrate, wherein the substrate comprises glass fiber impregnated with a base polymer;
a carbene-coated metal foil laminated to the substrate, wherein the carbene-coated metal foil comprises a conductive surface treated with an N-heterocyclic carbene (NHC) compound comprising a matrix-reactive pendant group, wherein the matrix-reactive pendant group of the NHC compound enhances bonding of the carbene-coated metal foil to the base polymer, and wherein the NHC compound is a NHC precursor represented by one of the following formulas:

7. The enhanced substrate as recited in claim 6 , wherein the carbene-coated metal foil comprises an electrodeposited copper foil having a copper surface treated with the NHC compound.

8. The enhanced substrate as recited in claim 7 , wherein the copper surface of the electrodeposited copper foil is smooth and non-oxidized.

9. The enhanced substrate as recited in claim 7 , wherein the substrate is a prepreg comprising a sheet of woven glass fiber impregnated with the base polymer.

10. The enhanced substrate as recited in claim 7 , wherein the base polymer comprises a vinyl-containing resin, and wherein the matrix-reactive pendant group of the NHC compound enhances bonding of the carbene-coated metal foil to the base polymer by crosslinking into the vinyl-containing resin of the base polymer.

11. An enhanced substrate comprising:
a substrate, wherein the substrate comprises is a prepreg comprising a sheet of woven glass fiber impregnated with a base polymer;
a carbene-coated metal foil laminated to the substrate, wherein the carbene-coated metal foil comprises an electrodeposited copper foil having a smooth and non-oxidized copper surface treated with an N-heterocyclic carbene (NHC) compound comprising a matrix-reactive pendant group, wherein the matrix-reactive pendant group of the NHC compound enhances bonding of the carbene-coated metal foil to the base polymer, and wherein the NHC compound is a NHC precursor represented by the following formula:

12. The enhanced substrate as recited in claim 11 , wherein the base polymer comprises a vinyl-containing resin, and wherein the matrix-reactive pendant group of the NHC compound enhances bonding of the carbene-coated metal foil to the base polymer by crosslinking into the vinyl-containing resin of the base polymer.

13. The enhanced substrate as recited in claim 11 , wherein the copper surface of the electrodeposited copper foil has a root-mean-square (RMS) surface roughness of R q ≤0.5 μm.

Assignees

• IBM

Inventors

• Boday Dylan J
• Kuczynski Joseph
• Wertz Jason T
• Zhang Jing

Classifications

• H05K3/389 Primary

  by the use of a coupling agent, e.g. silane · CPC title

• B32B2307/538

  Roughness · CPC title

• B32B2260/046

  Synthetic resin · CPC title

• B32B2255/24

  Organic non-macromolecular coating · CPC title

• B32B15/08

  of synthetic resin · CPC title