Methods of etching conductive features, and related devices and systems

Patent metadata

Field	Value
Publication number	US-11425822-B2
Application number	US-202117301459-A
Country	US
Kind code	B2
Filing date	Apr 2, 2021
Priority date	Dec 12, 2016
Publication date	Aug 23, 2022
Grant date	Aug 23, 2022

Abstract

A method of making a device patterned with one or more electrically conductive features includes depositing a conductive material layer over an electrically insulating surface of a substrate, depositing an anti-corrosive material layer over the conductive material layer, and depositing an etch-resist material layer over the anti-corrosive material layer. The etch-resist material layer may be deposited over the anti-corrosive material layer, and the anti-corrosive material layer forming a bi-component etch mask in a pattern resulting in covered portions of the conductive material layer and exposed portions of the conductive material layer, the covered portions being positioned at locations corresponding to one or more conductive features of the device. A wet-etch process is performed to remove the exposed portions of the conductive material layer from the electrically insulating substrate, and the bi-component etch mask is removed to expose the remaining conductive material. Systems and devices relate to devices with patterned features.

First claim

What is claimed is:

1. A method of making a device comprising one or more electrically conductive features, the method comprising:
depositing a first layer over a conductive layer on an electrically insulating surface of a substrate;
depositing a second layer over the first layer, the second layer and the first layer reacting to form a bi-component etch mask resulting in covered portions of the conductive material layer and exposed portions of the conductive material layer;
performing a wet-etch process to form the electrically conductive features by removing the exposed portions of the conductive layer from the electrically insulating substrate; and
removing the bi-component etch mask to expose the electrically conductive features,
wherein the first layer, the second layer, or both comprise a polymer, and wherein the first layer, the second layer, or both comprise an -imine group, an -amine group, an -azole group, a -hydrazine group, an amino acid, or a Schiff base, or a combination thereof.

2. The method of claim 1 , wherein the polymer of the first layer, the second layer, or both, is reactive.

3. The method of claim 1 , wherein depositing the first layer over the conductive layer comprises depositing a polymer over the conductive layer.

4. The method of claim 1 , wherein depositing the first layer over the conductive layer comprises depositing an organic material over the conductive layer.

5. The method of claim 1 , wherein the bi-component etch mask is formed by reaction of the first layer with the second layer on contact.

6. The method of claim 1 , further comprising irradiating portions of the second layer using at least one of laser direct writing or photomask exposure.

7. The method of claim 1 , wherein depositing the second layer comprises at least one of inkjet printing, slot die coating, spin coating, or lamination.

8. The method of claim 1 , wherein depositing the first layer comprises at least one of inkjet printing, slot die coating, spin coating, or lamination.

9. The method of claim 1 , wherein a thickness of the second layer is less than or equal to 10 μm.

10. The method of claim 1 , wherein a thickness of the second layer is less than or equal to 5 μm.

11. The method of claim 1 , wherein a thickness of the first layer is from 5 μm to 40 μm.

12. A method of making a device comprising one or more electrically conductive features, the method comprising:
depositing a first layer over a conductive layer on an electrically insulating surface of a substrate, the first layer being chosen from a material comprising one or more -azole groups and a material comprising a Schiff Base;
depositing a second layer over the first layer, the second layer reacting with the first layer upon contact to form a bi-component etch mask resulting in covered portions of the conductive layer and exposed portions of the conductive layer;
performing a wet-etch process to form the one or more electrically conductive features by removing the exposed portions of the conductive layer from the electrically insulating substrate; and
removing the bi-component etch mask to expose the one or more electrically conductive features.

13. The method of claim 12 , wherein at least one of the first layer and the second layer contains a reactive polymer.

14. The method of claim 12 , further comprising irradiating portions of the second layer, the irradiated portions corresponding to the one or more conductive features.

15. The method of claim 12 , wherein depositing the first layer or the second layer, or both, comprises at least one of inkjet printing, slot die coating, spin coating, or lamination.

16. The method of claim 12 , wherein each of the first layer and the second layer comprises a reactive polymer, and the reactive polymers of the first and second layers react upon contact to form the bi-component etch mask.

Assignees

• Kateeva Inc

Inventors

• Shpaisman Nava
• Frenkel Moshe

Classifications

• H05K3/282

  for inhibiting the corrosion of the circuit, e.g. for preserving the solderability · CPC title

• H05K2203/1184

  Underetching, e.g. etching of substrate under conductors or etching of conductor under dielectrics; Means for allowing or controlling underetching · CPC title

• H05K2203/1163

  Chemical reaction, e.g. heating solder by exothermic reaction · CPC title

• H05K2203/0392

  Pretreatment of metal, e.g. before finish plating, etching · CPC title

• H05K3/068

  Apparatus for etching printed circuits · CPC title