US10791631B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10791631-B2 |
| Application number | US-201715825259-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 29, 2017 |
| Priority date | Dec 6, 2016 |
| Publication date | Sep 29, 2020 |
| Grant date | Sep 29, 2020 |
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Official abstract text for this publication.
Also disclosed is a surface treated copper foil, comprising a copper foil, a roughening treatment layer on one surface, and/or another roughening treatment layer the other surface of the copper foil, wherein a height of roughening particles of the roughening treatment layer is 5 to 1000 nm from the surface, a color difference ΔE*ab according to JIS Z 8730 of a surface of a side of the roughening treatment layer is 65 or less, and a glossiness of the TD of the surface of the side of the roughening treatment layer is 70% or less.
Opening claim text (preview).
The invention claimed is: 1. A surface treated copper foil, comprising a copper foil, and a roughening treatment layer on at least one surface of the copper foil, wherein a height of roughening particles of the roughening treatment layer is 5 nm to 1000 nm from the surface of the copper foil, a color difference ΔE*ab according to JIS Z 8730 of a surface of a side of the roughening treatment layer is 65 or less, and a glossiness of a TD of the surface of the side of the roughening treatment layer is 70% or less. 2. The surface treated copper foil according to claim 1 , wherein the height of the roughening particles of the roughening treatment layer is 20 nm to 1000 nm from the surface of the copper foil. 3. The surface treated copper foil according to claim 1 , wherein the height of the roughening particles of the roughening treatment layer is 150 nm to 1000 nm from the surface of the copper foil. 4. The surface treated copper foil according to claim 1 , wherein the height of the roughening particles of the roughening treatment layer is 5 nm to 650 nm from the surface of the copper foil. 5. The surface treated copper foil according to claim 1 , wherein the height of the roughening particles of the roughening treatment layer is 5 nm to 150 nm from the surface of the copper foil. 6. The surface treated copper foil according to claim 1 , wherein a thickness of the roughening particles of the roughening treatment layer is 5 nm to 500 nm. 7. The surface treated copper foil according to claim 1 , wherein a thickness of the roughening particles of the roughening treatment layer is 10 nm or more. 8. The surface treated copper foil according to claim 1 , wherein a thickness of the roughening particles of the roughening treatment layer is 250 nm or less. 9. The surface treated copper foil according to claim 1 , wherein the glossiness of the TD of the surface of the side of the roughening treatment layer is 65% or less. 10. The surface treated copper foil according to claim 1 , wherein the glossiness of the TD of the surface of the side of the roughening treatment layer is 10% or less. 11. The surface treated copper foil according to claim 1 , wherein the glossiness of the TD of the surface of the side of the roughening treatment layer is 5% or less. 12. The surface treated copper foil according to claim 1 , wherein the color difference ΔE*ab according to JIS Z 8730 of the surface of the side of the roughening treatment layer is 42 to 65. 13. The surface treated copper foil according to claim 1 , wherein the color difference ΔE*ab according to JIS Z 8730 of the surface of the side of the roughening treatment layer is 45 to 65. 14. The surface treated copper foil according to claim 1 , wherein the color difference ΔE*ab according to JIS Z 8730 of the surface of the side of the roughening treatment layer is 49.1 to 65. 15. The surface treated copper foil according to claim 1 , wherein the color difference ΔE*ab according to JIS Z 8730 of the surface of the side of the roughening treatment layer is 50 or less. 16. The surface treated copper foil according to claim 1 , wherein the height of roughening particles of the roughening treatment layer is 500 nm to 1000 nm from the surface of the copper foil, the thickness of the roughening particles of the roughening treatment layer is 10 nm to 250 nm, the color difference ΔE*ab according to JIS Z 8730 of the surface of the side of the roughening treatment layer is 49.1 to 65, and the glossiness of the TD of the surface of the side of the roughening treatment layer is 5% or less. 17. The surface treated copper foil according to claim 1 , wherein the height of roughening particles of the roughening treatment layer is 20 nm to 400 nm from the surface of the copper foil, the thickness of the roughening particles of the roughening treatment layer is 10 nm to 250 nm, the color difference ΔE*ab according to JIS Z 8730 of the surface of the side of the roughening treatment layer is 49.1 to 65, and the glossiness of the TD of the surface of the side of the roughening treatment layer is 65% or less. 18. The surface treated copper foil according to claim 1 , wherein the copper foil has the roughening treatment layer on both surfaces of the copper foil. 19. The surface treated copper foil according to claim 1 comprising, on the surface of the roughening treated layer, one or more layers selected from the group consisting of a heat resistant layer, a rust preventive layer, a chromate treatment layer and a silane coupling treatment layer. 20. The surface treated copper foil according to claim 1 , wherein the surface treated copper foil is for heat dissipation. 21. A surface treated copper foil with resin layer, comprising the surface treated copper foil according to claim 1 , and a resin layer on the surface of the side of the roughening treatment layer. 22. A copper foil with carrier, comprising a carrier, an intermediate layer, and an ultra-thin copper layer, wherein the ultra-thin copper layer is the surface treated copper foil according to claim 1 . 23. The copper foil with carrier, comprising a carrier, an intermediate layer, and an ultra-thin copper layer, wherein the ultra-thin copper layer is the surface treated copper foil with resin layer according to claim 21 . 24. A laminate, comprising the surface treated copper foil according to claim 1 . 25. A laminate, comprising the copper foil with carrier according to claim 22 .
Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor (other insulating materials H05K3/387) · CPC title
by special treatment of the metal · CPC title
Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier (H05K1/187, H05K3/20 and H05K3/4682 take precedence) · CPC title
Pretreatment of metal, e.g. before finish plating, etching · CPC title
Surface topography of the layers, e.g. rough, dendritic or nodular layers · CPC title
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