Circuit board, electronic device, and production method for circuit board
US-12156346-B2 · Nov 26, 2024 · US
US2020409494A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2020409494-A1 |
| Application number | US-202017015783-A |
| Country | US |
| Kind code | A1 |
| Filing date | Sep 9, 2020 |
| Priority date | Mar 26, 2018 |
| Publication date | Dec 31, 2020 |
| Grant date | — |
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Official abstract text for this publication.
The present invention provides a conductive film in which a change in the surface state is suppressed and the light-fast adhesiveness of a protective layer is excellent, a touch panel sensor, and a touch panel. The conductive film according to the present invention includes a substrate, a patterned layer to be plated which is arranged on at least one surface of the substrate and has a functional group interacting with a plating catalyst or a precursor thereof, a copper plating layer which is arranged to cover the patterned layer to be plated and is in contact with the substrate, a metal layer which is arranged to cover the copper plating layer and contains a metal that is electrochemically nobler than copper, a nitrogen-containing compound layer which is arranged to cover the metal layer that is electrochemically nobler than copper, and a protective layer which is arranged to cover the nitrogen-containing compound layer.
Opening claim text (preview).
What is claimed is: 1 . A conductive film comprising: a substrate; a patterned layer to be plated which is arranged on at least one surface of the substrate and has a functional group interacting with a plating catalyst or a precursor thereof; a copper plating layer which is arranged to cover the patterned layer to be plated and is in contact with the substrate; a metal layer which is arranged to cover the copper plating layer and contains a metal that is electrochemically nobler than copper; a nitrogen-containing compound layer which is arranged to cover the metal layer containing the metal that is electrochemically nobler than copper; and a protective layer which is arranged to cover the nitrogen-containing compound layer. 2 . The conductive film according to claim 1 , wherein the nitrogen-containing compound layer contains s a nitrogen-containing non-aromatic compound or a nitrogen-containing aromatic compound. 3 . The conductive film according to claim 2 , wherein the nitrogen-containing compound layer contains s the nitrogen-containing non-aromatic compound. 4 . The conductive film according to claim 3 , wherein the nitrogen-containing non-aromatic compound is a nitrogen-containing aliphatic acyclic compound. 5 . The conductive film according to claim 4 , wherein the nitrogen-containing aliphatic acyclic compound is a compound represented by Formula (1), X represents a hydrophilic group selected from the group consisting of a hydroxyl group, a mercapto group, an amino group, and a phosphoric acid group, Y represents a hydrogen atom or a substituent other than the hydrophilic group, L's each independently represent a single bond or a divalent linking group, n represents an integer of 1 to 3, and m represents an integer of 0 to 2, where a relationship of n+m=3 is satisfied. 6 . The conductive film according to claim 1 , wherein the protective layer contains at least one hetero atom selected from the group consisting of a silicon atom, a sulfur atom, and a phosphorus atom. 7 . The conductive film according to claim 1 , wherein the protective layer contains a siloxane-based resin. 8 . The conductive film according to claim 1 , wherein the patterned layer to be plated is arranged in a mesh shape. 9 . The conductive film according to claim 1 , wherein the substrate has a three-dimensional shape. 10 . A touch panel sensor comprising: the conductive film according to claim 1 . 11 . A touch panel comprising: the touch panel sensor according to claim 10 . 12 . The conductive film according to claim 2 , wherein the protective layer contains at least one hetero atom selected from the group consisting of a silicon atom, a sulfur atom, and a phosphorus atom. 13 . The conductive film according to claim 2 , wherein the protective layer contains a siloxane-based resin. 14 . The conductive film according to claim 2 , wherein the patterned layer to be plated is arranged in a mesh shape. 15 . The conductive film according to claim 2 , wherein the substrate has a three-dimensional shape. 16 . A touch panel sensor comprising: the conductive film according to claim 2 . 17 . A touch panel comprising: the touch panel sensor according to claim 16 . 18 . The conductive film according to claim 3 , wherein the protective layer contains at least one hetero atom selected from the group consisting of a silicon atom, a sulfur atom, and a phosphorus atom. 19 . The conductive film according to claim 3 , wherein the protective layer contains a siloxane-based resin. 20 . The conductive film according to claim 3 , wherein the patterned layer to be plated is arranged in a mesh shape.
Pretreatment of metal, e.g. before finish plating, etching · CPC title
Sensor · CPC title
Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer · CPC title
Permanent coating compositions · CPC title
containing N · CPC title
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