Conductive film, touch panel sensor, and touch panel

US11216123B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11216123-B2
Application numberUS-202017015783-A
CountryUS
Kind codeB2
Filing dateSep 9, 2020
Priority dateMar 26, 2018
Publication dateJan 4, 2022
Grant dateJan 4, 2022

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

The present invention provides a conductive film in which a change in the surface state is suppressed and the light-fast adhesiveness of a protective layer is excellent, a touch panel sensor, and a touch panel. The conductive film according to the present invention includes a substrate, a patterned layer to be plated which is arranged on at least one surface of the substrate and has a functional group interacting with a plating catalyst or a precursor thereof, a copper plating layer which is arranged to cover the patterned layer to be plated and is in contact with the substrate, a metal layer which is arranged to cover the copper plating layer and contains a metal that is electrochemically nobler than copper, a nitrogen-containing compound layer which is arranged to cover the metal layer that is electrochemically nobler than copper, and a protective layer which is arranged to cover the nitrogen-containing compound layer.

First claim

Opening claim text (preview).

What is claimed is: 1. A conductive film comprising: a substrate; a patterned layer to be plated which is arranged on at least one surface of the substrate and has a functional group interacting with a plating catalyst or a precursor thereof; a copper plating layer which is arranged to cover the patterned layer to be plated and is in contact with the substrate; a metal layer which is arranged to cover the copper plating layer and contains a metal that is electrochemically nobler than copper; a nitrogen-containing compound layer which is arranged to cover the metal layer containing the metal that is electrochemically nobler than copper; and a protective layer which is arranged to cover the nitrogen-containing compound layer. 2. The conductive film according to claim 1 , wherein the nitrogen-containing compound layer contains a nitrogen-containing non-aromatic compound or a nitrogen-containing aromatic compound. 3. The conductive film according to claim 2 , wherein the nitrogen-containing compound layer contains the nitrogen-containing non-aromatic compound. 4. The conductive film according to claim 3 , wherein the nitrogen-containing non-aromatic compound is a nitrogen-containing aliphatic acyclic compound. 5. The conductive film according to claim 4 , wherein the nitrogen-containing aliphatic acyclic compound is a compound represented by Formula (1), X represents a hydrophilic group selected from the group consisting of a hydroxyl group, a mercapto group, an amino group, and a phosphoric acid group, Y represents a hydrogen atom or a substituent other than the hydrophilic group, L's each independently represent a single bond or a divalent linking group, n represents an integer of 1 to 3, and m represents an integer of 0 to 2, where a relationship of n+m=3 is satisfied. 6. The conductive film according to claim 1 , wherein the protective layer contains at least one hetero atom selected from the group consisting of a silicon atom, a sulfur atom, and a phosphorus atom. 7. The conductive film according to claim 1 , wherein the protective layer contains a siloxane-based resin. 8. The conductive film according to claim 1 , wherein the patterned layer to be plated is arranged in a mesh shape. 9. The conductive film according to claim 1 , wherein the substrate has a three-dimensional shape. 10. A touch panel sensor comprising: the conductive film according to claim 1 . 11. A touch panel comprising: the touch panel sensor according to claim 10 . 12. The conductive film according to claim 2 , wherein the protective layer contains at least one hetero atom selected from the group consisting of a silicon atom, a sulfur atom, and a phosphorus atom. 13. The conductive film according to claim 2 , wherein the protective layer contains a siloxane-based resin. 14. The conductive film according to claim 2 , wherein the patterned layer to be plated is arranged in a mesh shape. 15. The conductive film according to claim 2 , wherein the substrate has a three-dimensional shape. 16. A touch panel sensor comprising: the conductive film according to claim 2 . 17. A touch panel comprising: the touch panel sensor according to claim 16 . 18. The conductive film according to claim 3 , wherein the protective layer contains at least one hetero atom selected from the group consisting of a silicon atom, a sulfur atom, and a phosphorus atom. 19. The conductive film according to claim 3 , wherein the protective layer contains a siloxane-based resin. 20. The conductive film according to claim 3 , wherein the patterned layer to be plated is arranged in a mesh shape.

Assignees

Inventors

Classifications

  • G06F3/044Primary

    by capacitive means · CPC title

  • Pretreatment of metal, e.g. before finish plating, etching · CPC title

  • Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices · CPC title

  • H05K3/285Primary

    Permanent coating compositions · CPC title

  • Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material · CPC title

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Frequently asked questions

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What does patent US11216123B2 cover?
The present invention provides a conductive film in which a change in the surface state is suppressed and the light-fast adhesiveness of a protective layer is excellent, a touch panel sensor, and a touch panel. The conductive film according to the present invention includes a substrate, a patterned layer to be plated which is arranged on at least one surface of the substrate and has a functiona…
Who is the assignee on this patent?
Fujifilm Corp
What technology area does this patent fall under?
Primary CPC classification G06F3/044. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Jan 04 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).