What is claimed is:
1. A conductive film comprising:
a substrate;
a patterned layer to be plated which is arranged on at least one surface of the substrate and has a functional group interacting with a plating catalyst or a precursor thereof;
a copper plating layer which is arranged to cover the patterned layer to be plated and is in contact with the substrate;
a metal layer which is arranged to cover the copper plating layer and contains a metal that is electrochemically nobler than copper;
a nitrogen-containing compound layer which is arranged to cover the metal layer containing the metal that is electrochemically nobler than copper; and
a protective layer which is arranged to cover the nitrogen-containing compound layer.
2. The conductive film according to claim 1 ,
wherein the nitrogen-containing compound layer contains a nitrogen-containing non-aromatic compound or a nitrogen-containing aromatic compound.
3. The conductive film according to claim 2 ,
wherein the nitrogen-containing compound layer contains the nitrogen-containing non-aromatic compound.
4. The conductive film according to claim 3 ,
wherein the nitrogen-containing non-aromatic compound is a nitrogen-containing aliphatic acyclic compound.
5. The conductive film according to claim 4 ,
wherein the nitrogen-containing aliphatic acyclic compound is a compound represented by Formula (1),
X represents a hydrophilic group selected from the group consisting of a hydroxyl group, a mercapto group, an amino group, and a phosphoric acid group, Y represents a hydrogen atom or a substituent other than the hydrophilic group, L's each independently represent a single bond or a divalent linking group, n represents an integer of 1 to 3, and m represents an integer of 0 to 2, where a relationship of n+m=3 is satisfied.
6. The conductive film according to claim 1 ,
wherein the protective layer contains at least one hetero atom selected from the group consisting of a silicon atom, a sulfur atom, and a phosphorus atom.
7. The conductive film according to claim 1 ,
wherein the protective layer contains a siloxane-based resin.
8. The conductive film according to claim 1 ,
wherein the patterned layer to be plated is arranged in a mesh shape.
9. The conductive film according to claim 1 ,
wherein the substrate has a three-dimensional shape.
10. A touch panel sensor comprising:
the conductive film according to claim 1 .
11. A touch panel comprising:
the touch panel sensor according to claim 10 .
12. The conductive film according to claim 2 ,
wherein the protective layer contains at least one hetero atom selected from the group consisting of a silicon atom, a sulfur atom, and a phosphorus atom.
13. The conductive film according to claim 2 ,
wherein the protective layer contains a siloxane-based resin.
14. The conductive film according to claim 2 ,
wherein the patterned layer to be plated is arranged in a mesh shape.
15. The conductive film according to claim 2 ,
wherein the substrate has a three-dimensional shape.
16. A touch panel sensor comprising:
the conductive film according to claim 2 .
17. A touch panel comprising:
the touch panel sensor according to claim 16 .
18. The conductive film according to claim 3 ,
wherein the protective layer contains at least one hetero atom selected from the group consisting of a silicon atom, a sulfur atom, and a phosphorus atom.
19. The conductive film according to claim 3 ,
wherein the protective layer contains a siloxane-based resin.
20. The conductive film according to claim 3 ,
wherein the patterned layer to be plated is arranged in a mesh shape.