Electronic device based on multilayer thin film and method for manufacturing the same using a three-dimensional structure
US-2024309503-A1 · Sep 19, 2024 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L28/87 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 322 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 11 |
| 2016 | 18 |
| 2017 | 21 |
| 2018 | 28 |
| 2019 | 37 |
| 2020 | 44 |
| 2021 | 26 |
| 2022 | 29 |
| 2023 | 47 |
| 2024 | 56 |
| 2025 | 5 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Capacitor having conducitve pillar structures configured to increase capacitance density
US-2024304662-A1 · Sep 12, 2024 · US
Dynamic logic memcap
US-10162263-B2 · Dec 25, 2018 · US
Semiconductor device
US-2018331112-A1 · Nov 15, 2018 · US
Coplanar metal-insulator-metal capacitive structure
US-10056448-B2 · Aug 21, 2018 · US
Multilayer printed capacitors
US-10050351-B2 · Aug 14, 2018 · US
Semiconductor structure and method of manufacturing the same
US-10049890-B2 · Aug 14, 2018 · US
Semiconductor device
US-2018211962-A1 · Jul 26, 2018 · US
Micro-pattern forming method, capacitor and method of manufacturing the same, semiconductor device and method of manufacturing the same, and electronic system including semiconductor device
US-2018175043-A1 · Jun 21, 2018 · US
Dielectric layer and manufacturing method of dielectric layer, and solid-state electronic device and manufacturing method of solid-state electronic device
US-9876067-B2 · Jan 23, 2018 · US
Adaptive capacitors with reduced variation in value and in-line methods for making same
US-2017338299-A1 · Nov 23, 2017 · US
High voltage metal-oxide-metal (HV-MOM) device, HV-MOM layout and method of making the HV-MOM device
US-9825118-B2 · Nov 21, 2017 · US
Semiconductor device with metal extrusion formation
US-9825119-B2 · Nov 21, 2017 · US
Semiconductor device with metal extrusion formation
US-9825120-B2 · Nov 21, 2017 · US
Coplanar Metal-Insulator-Metal Capacitive Structure
US-2017256606-A1 · Sep 7, 2017 · US
Method for producing a capacitor
US-9728337-B2 · Aug 8, 2017 · US
Inter-digitated capacitor in split-gate flash technology
US-2017213841-A1 · Jul 27, 2017 · US
DC-to-DC converter and method for fabricating the same
US-9704854-B2 · Jul 11, 2017 · US
Capacitor structure of integrated circuit chip and method of fabricating the same
US-9698214-B1 · Jul 4, 2017 · US
Systems and methods for depositing materials on either side of a freestanding film using selective thermally-assisted chemical vapor deposition (STA-CVD), and structures formed using same
US-9679779-B2 · Jun 13, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L28/87?
- CPC H01L28/87 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L28/87 (Electricity)?
- Our database includes 322 publications tagged with this CPC code.
- Is patent activity under CPC H01L28/87 growing?
- Publication counts under this code: 56 in 2024 vs 5 in 2025 (latest complete years).