Semiconductor packages with socket plug interconnection structures
US-9842822-B2 · Dec 12, 2017 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L24/72 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 227 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 19 |
| 2016 | 29 |
| 2017 | 18 |
| 2018 | 18 |
| 2019 | 26 |
| 2020 | 33 |
| 2021 | 16 |
| 2022 | 21 |
| 2023 | 21 |
| 2024 | 14 |
| 2025 | 10 |
| 2026 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Semiconductor arrangement, method for producing a number of chip assemblies, method for producing a semiconductor arrangement and method for operating a semiconductor arrangement
US-9818730-B2 · Nov 14, 2017 · US
Connectors for making connections between analyte sensors and other devices
US-9782112-B2 · Oct 10, 2017 · US
Clip-bonded semiconductor chip package using metal bumps and method for manufacturing the package
US-2017207150-A1 · Jul 20, 2017 · US
Spacer system for a semiconductor switching device
US-9698067-B2 · Jul 4, 2017 · US
Substrate structures and methods of manufacture
US-2017162481-A1 · Jun 8, 2017 · US
System and method for producing devices including a semiconductor part and a non-semiconductor part
US-9659798-B2 · May 23, 2017 · US
Clamping Assembly Having A Spring System
US-2017141070-A1 · May 18, 2017 · US
Low profile zero/low insertion force package top side flex cable connector architecture
US-9640887-B2 · May 2, 2017 · US
Semiconductor arrangement, method for producing a semiconductor module, method for producing a semiconductor arrangement and method for operating a semiconductor arrangement
US-9620459-B2 · Apr 11, 2017 · US
Power device cassette with auxiliary emitter contact
US-9601473-B2 · Mar 21, 2017 · US
Optoelectronic component, contact-making device, and optoelectronic subassembly
US-9583740-B2 · Feb 28, 2017 · US
Power electronic switching device and assembly
US-9530712-B2 · Dec 27, 2016 · US
Semiconductor module and semiconductor device
US-9524919-B2 · Dec 20, 2016 · US
Semiconductor package with elastic coupler and related methods
US-2016343683-A1 · Nov 24, 2016 · US
Electric power converter with a spring member
US-9502331-B2 · Nov 22, 2016 · US
Semiconductor device
US-9490200-B2 · Nov 8, 2016 · US
Semiconductor module for high pressure applications
US-9484275-B2 · Nov 1, 2016 · US
Semiconductor packages with sliding interconnect structure
US-9484322-B1 · Nov 1, 2016 · US
Semiconductor packages with socket plug interconnection structures
US-2016293565-A1 · Oct 6, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L24/72?
- CPC H01L24/72 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L24/72 (Electricity)?
- Our database includes 227 publications tagged with this CPC code.
- Is patent activity under CPC H01L24/72 growing?
- Publication counts under this code: 14 in 2024 vs 10 in 2025 (latest complete years).